skcd 09 c 060 i hd ? by semikron rev. 0 ? 18.02.2010 1 cal-diode skcd i f = 30 a v rrm = 600 v size: 2,95 mm x 2,95 mm skcd 09 c 060 i hd features ? high current density ? e asy paralleling due to a small forward voltage spread ? positive temperature coefficient ? very soft recovery behavior ? s mall switching losses ? high ruggedness ? compatible to thick wire bonding ? compatible to standard solder processes typical applications* ? freewheeling diode for igbt absolute maximum ratings symbol conditions values unit v rrm t j =25c, i r =0.1ma 600 v i f(av) t s =80c, t j = 175 c 20 a i fsm 10 ms sin 180 t j =25c 185 a t j = 150 c 160 a t jmax 175 c electrical char acteristics symbol conditions min. typ. max. unit i 2 t t j = 150 c, 10 ms, sin 180 128 a 2 s i r t j =25c, v rrm = 600 v 0.10 ma t j = 150 c, v rrm =600v ma v f t j =25c, i f =19a 1.35 v t j = 150 c, i f =19a 1.31 v v (to) t j = 150 c 0.85 v r t t j = 150 c 25.1 m ? dynamic characteristics symbol conditions min. typ. max. unit t rr t j = 25 c, 25 a, 300 v, 330 a/s s t rr t j = 150 c, 25 a, 300 v, 330 a/s ns q rr t j = 25 c, 25 a, 300 v, 330 a/s c q rr t j = 150 c, 25 a, 300 v, 330 a/s 1.6 c i rrm t j = 25 c, 25 a, 300 v, 330 a/s a i rrm t j = 150 c, 25 a, 300 v, 330 a/s 11 a thermal characteristics symbol conditions min. typ. max. unit t j -40 175 c t stg -40 175 c t solder 10 min. 250 c t solder 5 min. 320 c r th(j-s) sold. on 0,38 mm dcb, reference point on copper heatsink close to the chip 2.11 k/w mechanical characteristics symbol conditions values unit raster size 2.95 x 2.95 mm 2 area total 8.7 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 1175 (5" wafer) pcs
skcd 09 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal.
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