-formerly austin semiconductor, inc. features clock frequency: up to 133 mhz ? configurations: 32mx16, 16mx16, 8mx16 & 4mx16 ? fully synchronous; all signals referenced to a ? positive clock edge internal pipelined operation; column a ddress can be ? changed every clock cycle internal banks for hiding row access/precharge ? power supply: +3.3v +/-0.3v ? lvttl interface ? programmable burst length (1, 2, 4, 8, full page) ? programmable burst sequence: sequential/interleave ? auto refresh (cbr) ? self refresh mode (/it) ? 64ms, 8,192 cycle refresh (/it) <24ms, 8,192 cycle refresh (/xt) write recovery (twr = ?2 clk?) ? random column a ddress every clock cycle ? programmable cas latency (2, 3 clocks) ? burst read/write and burst read/single write ? operations capability burst termination by burst stop and precharge command ? available in 54-pin tsop-ii, choice of lead frame: ? - copper lead frame - alloy 42 lead frame operating temperature range: ? industrial: -40 o c to +85 o c military: -55 o c to +125 o c pb/sn finish or rohs available ? 100% product screened at temperature extremes & vcc ? extremes benefits enhanced long-term reliability with copper ? lead frames superior thermal co nductivity improvement: ? 170 w/m*k vs. 14 w/m*k (a 12x difference) ? ja and jc characteristics provide up to 3x advantage of heat dissipation capability versus parts with alloy 42 lead frames heat dissipated from the die faster makes it ? run cooler, leading to longer life solder joint reliability vastly improved. ? - cte of copper (17 ppm/ o c), matches the cte of typical fr4 pwbs (15-17 ppm/ o c), whereas cte of alloy 42 (5 ppm/ o c), is a mismatch rohs version (nipdau plating) ? - most preferred for elimination of risk for whisker growth over broader military and industrial ? temperature ranges, the above benefits are even more important applications examples include: military, aerospace, avionics ? cellular base stations ? gas / oil exploration ? engine control ? on-board flight computers ? radar / sonar ? copper lead frame 54-pin tsopii sdram products www.micross.com
(note 4: alloy 42 lf) (alloy 42 lead frame) (cu lead frame) package diagrams rev. 1.7 5/10 symbol min. nom. max. symbol min. nom. max. a rr 1.20 a rr 1.20 a1 0.05 0.10 0.20 a1 0.05 r 0.15 a2 0.90 1.00 1.10 a2 0.95 1.00 1.05 b0.25 r 0.45 b 0.30 0.45 c0.08 r 0.18 c 0.12 r 0.21 d 22.02 22.22 22.42 d 22.02 22.22 22.42 e1 10.03 10.16 10.29 e1 10.03 10.16 10.29 e 11.56 11.76 11.96 e 11.56 11.76 11.96 e0.80 bsc e 0.80 bsc l0.40 r 0.75 l 0.40 0.50 0.60 l1 0.25 bsc zd 0.71 ref zd 0.71 ref t 0 deg r 8 deg t 0 deg r 8 deg alloy 42 lead frame micross package designator: dg cu lead frame micross package designator: dgc phone: 512.339.1188 semiconductors@micross.com www.micross.com configuration part number speed vcc temp range package package designator lead frame status 32m x 16 as4sd32m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dgc & dgcr cu qual 16m x 16 as4sd16m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dgc & dgcr cu production 8m x 16 as4sd8m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dgc & dgcr cu production 4m x 16 as4sd4m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dgc & dgcr cu production 32m x 16 as4sd32m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dg alloy 42 production 16m x 16 as4sd16m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dg alloy 42 production 8m x 16 as4sd8m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dg alloy 42 production 4m x 16 as4sd4m16 133 mhz 3.3v r 40 o c to +85 o c r 55 o c to +125 o c 54 pin tsopii dg alloy 42 production dg & dgc have pb / sn finish, dgcr is rohs compliant
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