AN5700 - igbt/frd identifier 1/8 www.dynexsemi.com part numbering scheme for igbt & frd modules AN5700-1.4 february 2004 since february 2001 dynex has used the following part numbering scheme for new releases of product. a typical product has a part number of the form dim800ddm17-a000, made up as below: d im800dds17-a000 d = dynex company identifier d i m800dds17-a000 prime technology within the product i = igbt silicon f = frd silicon di m 8 00dds17-a000 m = indicates product is a module dim 8 0 0 dds17-a000 current rating (minimum of two digits and maximum of four - accomodates currents from 10a to 9999a) dim800 d d s17-a000 package outline - (see tables 1 and 2) dim800d d s 17-a000 power terminals configuration - (see tables 3, 4 and 5) dim800d d s 1 7-a000 baseplate material identifier s = copper baseplate m = metal matrix compound (mmc) baseplate dim800d ds 1 7 - a000 maximum working voltage (divided by 100, two digits - leading zero included if required.) e.g. 06 = 600v 12 = 1200v 17 = 1700v 33 = 3300v 65 = 6500v
AN5700 - igbt/frd identifier 2/8 www.dynexsemi.com dim800dds17- a 000 technology identifier a = standard non punch through (npt) dmos igbt and complementary frd e = trench field stop igbt die and complementary frd f = soft punch through (spt) 3.5kv igbt die and complementary frd j = 600v npt dmos igbt die and complementary frd k = soft punch through (spt) 6.5kv igbt die and complementary frd s = 600v epitaxial punch through (pt) igbt die and complementary frd dim800dds17-a 0 0 0 special selection identifier 000 = default (standard product) 076 = standard product supplied with production test results xxx = identifies that product is supplied against a customer requirement specification e.g. dim800ddm17-a001 dim200plm33-a019 dynex continues to manufacture some 600v igbt products which still use the former gec plessey semiconductors naming system (e.g. gp250mhb06s). the company identifier is gp and the last character of the part number is an ? (indicating epitaxial punch through (pt) die). the core of the part number may be decoded using the february 2001 naming scheme. the products covered by the old naming scheme will be discontinued shortly as products are migrated across to the new b, c and w outlines and the february 2001 naming convention will be applied.
AN5700 - igbt/frd identifier 3/8 www.dynexsemi.com e g a k c a p e n i l t u o e p y t e d o c s n o i s n e m i d ) m m ( n o i t a r u g i f n o c t b g i y r e v o c e r t s a f e d o i d n o i t a r u g i f n o c m u m i x a m g n i t a r e p o e g a t l o v y t i l i b a p a c ) v k ( e n i l t u o e l u d o ms e t o n a8 4 x 0 4 1 x 0 9 1h c t i w s e l g n i s5 . 6 n o i t a l o s i v k 2 . 0 1 e g a k c a p b0 3 x 7 0 1 x 2 6h c t i w s e l g n i s7 . 1 e n i l t u o l s e c a l p e r s n g i s e d w e n l l a r o f c0 3 x 4 3 x 4 9 e g d i r b f l a h s r e p p o h c 7 . 1 d8 3 x 0 3 1 x 0 4 1 h c t i w s l a u d r e p p o h c d e t t i m m o c n u 7 . 1 e8 3 x 0 4 1 x 0 9 1h c t i w s e l g n i se l p i r t3 . 3 f8 3 x 0 3 1 x 0 4 1h c t i w s e l g n i sl a u d7 . 1 g8 3 x 0 3 1 x 0 4 1 h c t i w s l a u d r e p p o h c d e t t i m m o c n u 3 . 3 j4 6 x 0 3 1 x 0 4 1h c t i w s e l g n i s3 . 3 n o i t a l o s i v k 5 . 8 e g a k c a p table 1: package outline / power terminal configuration
AN5700 - igbt/frd identifier 4/8 www.dynexsemi.com e g a k c a p e n i l t u o e p y t e d o c s n o i s n e m i d ) m m ( n o i t a r u g i f n o c t b g i y r e v o c e r t s a f e d o i d n o i t a r u g i f n o c m u m i x a m g n i t a r e p o e g a t l o v y t i l i b a p a c ) v k ( e n i l t u o e l u d o ms e t o n k8 4 x 3 7 x 0 4 1h c t i w s e l g n i s5 . 6 n o i t a l o s i v k 2 . 0 1 e g a k c a p l0 3 x 8 0 1 x 2 6h c t i w s e l g n i se l g n i s7 . 1 m0 3 x 8 0 1 x 2 6 e g d i r b f l a h r e p p o h c h c t i w s l a n o i t c e r i d - i b r i a p s e i r e s ) e g d i r b f l a h ( 7 . 1 n8 3 x 0 3 1 x 0 4 1e l g n i sl a u d3 . 3 y r a i l i x u a t n e r e f f i d f o t s n o i t a c o l p8 3 x 0 4 1 x 3 7 e g d i r b f l a h l a n o i t c e r i d - i b r i a p s e i r e s ) e g d i r b f l a h ( 3 . 3 r8 3 x 0 3 1 x 0 4 1 e c n a t c u l e r d e h c t i w s e g d i r b e n i h c a m 7 . 1 w0 3 x 7 0 1 x 2 6 e g d i r b f l a h r e p p o h c h c t i w s l a n o i t c e r i d - i b r i a p s e i r e s ) e g d i r b f l a h ( 7 . 1 e n i l t u o m s e c a l p e r s n g i s e d w e n l l a r o f x8 4 x 0 3 1 x 0 4 1h c t i w s e l g n i s5 . 6 n o i t a l o s i v k 2 . 0 1 e g a k c a p table 2: package outline / power terminal configuration 7 5 4 6 3 1 2 c1 e1 c2 e2 g e 2 c 1 e 2 - aux emitter c 1 - aux collector 10 11 12 9 8 7 321 654
AN5700 - igbt/frd identifier 5/8 www.dynexsemi.com t i u c r i c l a c i r t c e l e e d o c e p y t n o i t p i r c s e dt i u c r i c b t b g i h c t i w s l a n o i t c e r i d - i b r e t t i m e n o m m o c ( ) n o i t a r u g i f n o c c t b g i d e t t i m m o c n u , r e p p o h c d t b g i h c t i w s l a u d e t b g i d e t c e n n o c s e i r e s r i a p r e p p o h c l a c i r t e m m y s h t b g i e g d i r b f l a h k t b g i m r a r e p p u , r e p p o h c d e l l o r t n o c 3(c1) 5(e 1 ) 6(g 1 ) 7(c 1 ) 1(e1) 4(e2) 2(c2) 3(c1) 5(e 1 ) 6(g 1 ) 7(c 1 ) 12(c 2 ) 11(g 2 ) 10(e 2 ) 1(e1) 4(e2) 2(c2) 3(c1) 1(k,e) 2(a) 5(e 1 ) 4(g 1 ) 3(c1) 1(e1c2) 2(e2) 6(g 2 ) 7(e 2 ) 5(e 1 ) 4(g 1 ) table 3: module electrical circuit configurations 3(c1) 1(c2) 2(e1e2) 11(c 2 ) 9(c 1 ) 6(g 2 ) 7(e 2 ) 1 ohms 3.6 ohm 5(e 1 ) 4(g 1 ) 3(c2) 2(c1) 1(e1/e2) 7(e 2 ) 6(g 2 ) 5(e 1 ) 4(g 1 ) pbm type mbs type 3(c1) 5(e 1 ) 6(g 1 ) 7(c 1 ) 12(c 2 ) 11(g 2 ) 10(e 2 ) 1(e1) 4(e2) 2(c2) external connection
AN5700 - igbt/frd identifier 6/8 www.dynexsemi.com t i u c r i c l a c i r t c e l e e d o c e p y t n o i t p i r c s e dt i u c r i c l t b g i m r a r e w o l , r e p p o h c d e l l o r t n o c r t b g i e c n a t c u l e r d e h c t i w s e g d i r b e n i h c a m s t b g i h c t i w s e l g n i s e n i l t u o b t b g i h c t i w s e l g n i s e n i l t u o e t b g i h c t i w s e l g n i s e n i l t u o n d n a f e g c e c2 c1 aux c g aux e e1 e2 e3 external connection external connection c3 c2 c1 aux c g aux e e1 e2 external connection external connection 3(k) 1(a,c2) 2(e2) 6(g 2 ) 7(e 2 ) table 4: module electrical circuit configurations a4 g 3 e3 e 3 c2 g 2 e 2 c3 e2 k1
AN5700 - igbt/frd identifier 7/8 www.dynexsemi.com t i u c r i c l a c i r t c e l e e d o c e p y t n o i t p i r c s e dt i u c r i c v t b g i - i b f o r i a p d e t c e n n o c s e i r e s s e h c t i w s l a n o i t c e r i d x - e l u d o m d r f s e t o n e d t o n s n o i t a r u g i f n o c t n e r e f f i d d e i f i t n e d i y l l a c i f i c e p s table 5: module electrical circuit configurations 3(c1) 1(c4) 2(c2/c3) 4(g 3 ) 6(g 2 ) 4(g 4 ) 6(g 1 ) 5(aux. e 3 /e 4 ) 7(aux. e 1 /e 2 ) 2(k2) 1(k1) 3(a1) 4(a2) external connection external connection 3(k3) 1(k1) 4(a1) 6(a3) external connection external connection 2(k2) 5(a2) 1(k) 2(a) 1(a2/k1) 2(k2) 3(a1) f and n outline e outline b and l outline m, l and p outline
www.dynexsemi.com power assembly capability the power assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. we offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today . the assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. using the latest cad methods our team of design and applications engineers aim to provide the power assembly complete solution (pacs). heatsinks the power assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of dynex semiconductors. data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. for further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer services. customer service tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 sales offices benelux, italy & switzerland: tel: +33 (0)1 64 66 42 17. fax: +33 (0)1 64 66 42 19. france: tel: +33 (0)2 47 55 75 5 3 . fax: +33 (0)2 47 55 75 59. germany, northern europe, spain & rest of world: tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 north america: tel: (440) 259-2060. fax: (440) 259-2059. tel: (949) 733-3005. fax: (949) 733-2986. these offices are supported by representatives and distributors in many countries world-wide. ?dynex semiconductor 2003 technical documentation ?not for resale. produced in united kingdom headquarters operations dynex semiconductor ltd doddington road, lincoln. lincolnshire. ln6 3lf. united kingdom. tel: +44-(0)1522-500500 fax: +44-(0)1522-500550 this publication is issued to provide information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. the company reserves the right to alter without prior notice the specification, design or price of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to the company's conditions of sale, which are available on request. all brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
|
