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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. photocoupler ps2501-1,-2,-4,ps2501l-1,-2,-4 high isolation voltage single transistor type multi photocoupler series the mark ? shows major revised points. ? nepoc series ? document no. pn10225ej03v0ds (3rd edition) date published march 2006 cp(k) printed in japan ? nec compound semiconductor devices, ltd. 1988, 2006 description the ps2501-1, -2, -4 and ps2501l-1, -2, -4 are optically coupled isolators c ontaining a gaas light emitting diode and an npn silicon phototransistor. the ps2501-1, -2, -4 are in a plastic dip (dual in- line package) and the ps2501l-1, -2, -4 are lead bending type (gull-wing) for surface mount. features ? high isolation voltage (bv = 5 000 vr.m.s.) high collector to emitter voltage (v ceo = 80 v) high-speed switching (t r = 3 s typ., t f = 5 s typ.) ordering number of tape product: ps2501l-1-e3, e4, f3, f4, ps2501l-2-e3, e4 safety standards ul approved: file no. e72422 applications power supply telephone/fax. fa/oa equipment programmable logic controller ps2501-1, ps2501l-1 1. anode 2. cathode 3. emitter 4. collector 12 43 1, 3. anode 2, 4. cathode 5, 7. emitter 6, 8. collector 1234 8765 ps2501-4, ps2501l-4 12345678 16 15 14 13 12 11 10 9 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9, 11, 13, 15. emitter 10, 12, 14, 16. collector ps2501-2, ps2501l-2 (top view) pin connection
data sheet pn10225ej03v0ds 2 ps2501-1,-2,-4,ps2501l-1,-2,-4 package dimensions (unit : mm) dip type (new package) ps2501-4 ps2501-1 19.80.5 6.50.5 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 0.25 +0.1 ?0.05 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m 4.60.35 6.50.5 0 to 15? 7.62 0.25 +0.1 ?0.05 caution new package 1-ch, 4-ch only dip type ps2501-4 ps2501-1 9.70.5 6.50.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 0.25 +0.1 ?0.05 ps2501-2 4.60.5 6.50.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 0.25 +0.1 ?0.05 19.80.5 6.50.5 0 to 15? 7.62 0.25 +0.1 ?0.05 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m
data sheet pn10225ej03v0ds 3 ps2501-1,-2,-4,ps2501l-1,-2,-4 lead bending type (new package) ps2501l-4 ps2501l-1 0.25 m 4.60.35 6.50.5 3.50.3 2.54 1.250.15 0.15 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05 19.80.5 6.50.5 2.54 1.250.15 0.25 m 3.50.3 0.15 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05 caution new package 1-ch, 4-ch only lead bending type ps2501l-2 ps2501l-1 ps2501l-4 4.60.5 6.50.5 0.25 m 3.50.3 2.54 1.250.15 0.15 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05 9.70.5 6.50.5 2.54 1.250.15 0.25 m 0.15 3.50.3 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05 19.80.5 6.50.5 2.54 1.250.15 0.25 m 3.50.3 0.15 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05
data sheet pn10225ej03v0ds 4 ps2501-1,-2,-4,ps2501l-1,-2,-4 marking example 2501 ml601 ps2501-2 nl601 l j n ps2501-1 ps2501-2, -4 assembly lot week assembled year assembled (last 1 digit) in-house code ctr rank code no. 1 pin mark package new pkg standard pkg made in japan made in taiwan no. 1 pin mark n l j *1 n week assembled year assembled (last 1 digit) in-house code ctr rank code package new pkg standard pkg made in japan made in taiwan 6 01 m 6 01 *1 ps2501-4 only country assembled type number assembly lot l l k
data sheet pn10225ej03v0ds 5 ps2501-1,-2,-4,ps2501l-1,-2,-4 ordering information part number order number solder plating specification packing style safety standard approval application part number *1 ps2501-1 ps2501-1-a pb-free magazine ca se 100 pcs standard products ps2501-1 ps2501l-1 ps2501l-1-a (ul approved) ps2501l-1-e3 ps2501l-1-e3-a embossed tape 1 000 pcs/reel ps2501l-1-e4 ps2501l-1-e4-a ps2501l-1-f3 ps2501l-1-f3-a embossed tape 2 000 pcs/reel ps2501l-1-f4 ps2501l-1-f4-a ps2501-2 ps2501-2-a magazine case 45 pcs ps2501-2 ps2501l-2 ps2501l-2-a ps2501l-2-e3 ps2501l-2-e3-a embossed tape 1 000 pcs/reel ps2501l-2-e4 ps2501l-2-e4-a ps2501-4 ps2501-4-a magazine case 20 pcs ps2501-4 ps2501l-4 ps2501l-4-a *1 for the application of the safety st andard, following part number should be used.
data sheet pn10225ej03v0ds 6 ps2501-1,-2,-4,ps2501l-1,-2,-4 absolute maximum ratings (unless otherwise specified, t a = 25 c) ratings parameter symbol ps2501-1, ps2501l-1 ps2501-2,-4 ps2501l-2,-4 unit diode reverse voltage v r 6 v forward current (dc) i f 80 ma/ch power dissipation derating ? p d / c 1.5 1.2 mw/ c power dissipation p d 150 120 mw/ch peak forward current *1 i fp 1 a/ch transistor collector to emitter voltage v ceo 80 v emitter to collector voltage v eco 7 v collector current i c 50 ma/ch power dissipation derating ? p c / c 1.5 1.2 mw/ c power dissipation p c 150 120 mw/ch isolation voltage *2 bv 5 000 vr.m.s. operating ambient temperature t a ? 55 to +100 c storage temperature t stg ? 55 to +150 c *1 pw = 100 s, duty cycle = 1% *2 ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-2 shorted together, 3-4 s horted together ( ps2501-1, ps2501l-1). pins 1-4 shorted together, 5-8 s horted together ( ps2501-2, ps2501l-2). pins 1-8 shorted together, 9-16 s horted together ( ps2501-4, ps2501l-4).
data sheet pn10225ej03v0ds 7 ps2501-1,-2,-4,ps2501l-1,-2,-4 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 10 ma 1.17 1.4 v reverse current i r v r = 5 v 5 a terminal capacitance c t v = 0 v, f = 1.0 mhz 50 pf transistor collector to emitter dark current i ceo v ce = 80 v, i f = 0 ma 100 na coupled current transfer ratio (i c /i f ) *1 ctr i f = 5 ma, v ce = 5 v 80 300 600 % collector saturation voltage v ce(sat) i f = 10 ma, i c = 2 ma 0.3 v isolation resistance r i-o v i-o = 1.0 kv dc 10 11 ? isolation capacitance c i-o v = 0 v, f = 1.0 mhz 0.5 pf rise time *2 t r v cc = 10 v, i c = 2 ma, r l = 100 ? 3 s fall time *2 t f 5 *1 ctr rank ( * : only ps2501-1, ps2501l-1) k* : 300 to 600 (%) l* : 200 to 400 (%) m* : 80 to 240 (%) d* : 100 to 300 (%) h* : 80 to 160 (%) w* : 130 to 260 (%) q* : 100 to 200 (%) n : 80 to 600 (%) *2 test circuit for switching time pw = 100 s duty cycle = 1/10 pulse input v cc v out r l = 100 ? 50 ? i f
data sheet pn10225ej03v0ds 8 ps2501-1,-2,-4,ps2501l-1,-2,-4 typical characteristics (unl ess otherwise specified, t a = 25 c) 150 100 50 0255075 100 125 150 1.5 mw/?c 1.2 mw/?c 150 100 50 25 50 100 125 150 0 10 000 100 1 000 100 10 1 75 50 25 0 ?25 ?50 v ce = 80 v 10 1.0 0.8 0.6 0.4 0.2 0 5 1 0.5 0.1 10 ma 40 1.5 mw/?c 1.2 mw/?c 20 ma 50 ma 2 ma i f = 1 ma 5 ma 40 v 24 v 10 v 5 v ps2501-1 ps2501l-1 ps2501-2 ps2501l-2 ps2501-4 ps2501l-4 ps2501-1 ps2501l-1 ps2501-2 ps2501l-2 ps2501-4 ps2501l-4 100 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 50 10 5 1 0.5 0.1 +60?c +25?c t a = +100?c diode power dissipation p d (mw) transistor power dissipation p c (mw) ambient temperature t a (?c) forward current i f (ma) forward voltage v f (v) collector to emitter dark current i ceo (na) collector saturation voltage v ce(sat) (v) ambient temperature t a (?c) ambient temperature t a (?c) diode power dissipation vs. ambient temperature transistor power dissipation vs. ambient temperature forward current vs. forward voltage collector to emitter dark current vs. ambient temperature collector current vs. collector saturation voltage collector current i c (ma) 75 70 2 60 50 40 30 20 10 0 4 6 810 20 ma i f = 5 ma 10 ma 50 ma collector current i c (ma) collector to emitter voltage v ce (v) collector current vs. collector to emitter voltage 0?c ?25?c ?50?c remark the graphs indicate nominal characteristics.
data sheet pn10225ej03v0ds 9 ps2501-1,-2,-4,ps2501l-1,-2,-4 1.2 ?50 1.0 0.8 0.6 0.4 0.2 0 ?25 0 25 50 75 100 50 10 1 0.1 10 k 5 k 1 k 500 100 50 10 1 000 100 10 1 100 k 50 k 10 k 5 k 1 k 500 100 0 ?5 ?10 ?15 ?20 0.5 1 2 5 10 20 50 100 200 500 i c = 2 ma, v cc = 10 v, ctr = 290% t f t r t d t s i f = 5 ma, v cc = 5 v, ctr = 290% t s t d t r t f i f = 5 ma, v ce = 5 v 100 ? 300 ? r l = 1 k ? normalized to 1.0 at t a = 25?c, i f = 5 ma, v ce = 5 v forward current i f (ma) ambient temperature t a (?c) load resistance r l ( ? ) frequency f (khz) normalized current transfer ratio ctr current transfer ratio ctr (%) normalized gain g v load resistance r l ( ? ) switching time t ( s) normalized current transfer ratio vs. ambient temperature current transfer ratio vs. forward current switching time vs. load resistance switching time vs. load resistance frequency response switching time t ( s) 450 400 350 300 250 200 150 100 50 0 0.05 0.1 0.5 1 5 10 50 t a = 25?c t a = 60?c 1.2 1.0 0.8 0.6 0.4 0.2 0 10 2 10 3 10 4 10 5 time (hr) ctr (relative value) long term ctr degradation i f = 5 ma sample a b c d v ce = 5 v remark the graphs indicate nominal characteristics.
data sheet pn10225ej03v0ds 10 ps2501-1,-2,-4,ps2501l-1,-2,-4 taping specifications (unit : mm) tape direction outline and dimensions (tape) outline and dimensions (reel) packing: 1 000 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 ps2501l-1-e3 ps2501l-1-e4 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.0 0.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 ?0 2542.0 80.01.0 2.00.5 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10225ej03v0ds 11 ps2501-1,-2,-4,ps2501l-1,-2,-4 tape direction outline and dimensions (tape) outline and dimensions (reel) ps2501l-1-f3 ps2501l-1-f4 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.0 0.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 ?0 packing: 2 000 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 3302.0 1001.0 2.00.5 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10225ej03v0ds 12 ps2501-1,-2,-4,ps2501l-1,-2,-4 tape direction outline and dimensions (tape) outline and dimensions (reel) ps2501l-2-e3 ps2501l-2-e4 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 10.40.1 12.00.1 1.5 +0.1 ?0 7.50.1 10.30.1 16.00.3 4.0 0.1 0.3 packing: 1 000 pcs/reel 15.9 to 19.4 outer edge of flange 1001.0 3302.0 2.00.5 r 1.0 13.00.2 21.00.8 2.00.5 21.51.0 17.51.0
data sheet pn10225ej03v0ds 13 ps2501-1,-2,-4,ps2501l-1,-2,-4 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering peak reflow temperature 260 c or below (package surface temperature) time of peak reflow temperature 10 seconds or less time of temperature higher than 220 c 60 seconds or less time to preheat temperature from 120 to 180 c 120 30 s number of reflows three flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wave soldering temperature 260 c or below (molten solder temperature) time 10 seconds or less preheating conditions 120 c or below (package surface temperature) number of times one (allowed to be dipped in solder including plastic mold portion.) flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron peak temperature (l ead part temperature) 350 c or below time (each pins) 3 seconds or less flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperatur e of the package woul d not be heated over 100 c.
data sheet pn10225ej03v0ds 14 ps2501-1,-2,-4,ps2501l-1,-2,-4 (4) cautions fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly bet ween the photocoupler?s i nput and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. measurement conditions of current transfer ra tios (ctr), which differ according to photocoupler check the setting values before use, since the forward current conditions at ctr measurement differ according to product. when using products other than at the specified forward current, the char acteristics curves may differ from the standard curves due to ctr value vari ations or the like. this tendency may sometimes be obvious, especially below i f = 1 ma. therefore, check the charac teristics under the actual operating conditi ons and thoroughly take variations or the like into consideration before use. usage cautions 1. protect against static electricity when handling. 2. avoid storage at a high te mperature and high humidity.
data sheet pn10225ej03v0ds 15 ps2501-1,-2,-4,ps2501l-1,-2,-4 when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of march, 2006. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0504 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1573 fax: +81-44-435-1579 for further information, please contact ps2501-1,-2,-4,ps2501l-1,-2,-4 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth.

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