? semiconductor components industries, llc, 2008 april, 2008 - rev. 8 1 publication order number: esd5z2.5t1/d esd5z2.5t1 series transient voltage suppressors micro-packaged diodes for esd protection the esd5z series is designed to protect voltage sensitive components from esd and transient voltage events. excellent clamping capability, low leakage, and fast response time, make these parts ideal for esd protection on designs where board space is at a premium. because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. specification features: ? low clamping voltage ? small body outline dimensions: 0.047 x 0.032 (1.20 mm x 0.80 mm) ? low body height: 0.028 (0.7 mm) ? stand-off voltage: 2.5 v - 12 v ? peak power up to 240 watts @ 8 x 20 s pulse ? low leakage ? response time is typically < 1 ns ? esd rating of class 3 (> 16 kv) per human body model ? iec61000-4-2 level 4 esd protection ? iec61000-4-4 level 4 eft protection ? pb-free packages are available mechanical characteristics: case: void\free, transfer\molded, thermosetting plastic epoxy meets ul 94 v-0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol value unit iec 61000-4-2 (esd) contact air 30 30 kv iec 61000-4-4 (eft) 40 a esd voltage per human body model per machine model 16 400 kv v total power dissipation on fr-5 board (note 1) @ t a = 25 c p d 200 mw junction and storage temperature range t j , t stg -55 to +150 c lead solder temperature - maximum (10 second duration) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ra tings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. fr-5 = 1.0 x 0.75 x 0.62 in. see application note and8308/d for further description of survivability specs. device package shipping ? ordering information sod-523 case 502 plastic 1 cathode 2 anode esd5zxxxt1 sod-523 3000/tape & reel marking diagram see specific marking information in the device marking column of the electrical characteristics tables starting on page 2 of this data sheet. device marking information http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 1 2 http://onsemi.com xx = specific device code m = date code = pb-free package xx 1 2 m (note: microdot may be in either location) esd5zxxxt1g sod-523 pb-free 3000/tape & reel *date code orientation may vary depending upon manufacturing location.
esd5z2.5t1 series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current i f forward current v f forward voltage @ i f p pk peak power dissipation c max. capacitance @v r = 0 and f = 1 mhz *see application note and8308/d for detailed explanations of datasheet parameters. uni-directional tvs i pp i f v i i r i t v rwm v c v br v f electrical characteristics (t a = 25 c unless otherwise noted, v f = 1.1 v max. @ i f = 10 ma for all types) device** device marking v rwm (v) i r ( a) @ v rwm v br (v) @ i t (note 2) i t v c (v) @ i pp = 5.0 a ? v c (v) @ max i pp ? i pp (a) ? p pk (w) ? c (pf) v c max max min ma typ max max max typ per iec61000-4-2 (note 3) esd5z2.5t1, g* zd 2.5 6.0 4.0 1.0 6.5 10.9 11.0 120 145 figures 1 and 2 see below (note 4) esd5z3.3t1, g* ze 3.3 0.05 5.0 1.0 8.4 14.1 11.2 158 105 esd5z5.0t1, g* zf 5.0 0.05 6.2 1.0 11.6 18.6 9.4 174 80 esd5z6.0t1, g* zg 6.0 0.01 6.8 1.0 12.4 20.5 8.8 181 70 esd5z7.0t1, g* zh 7.0 0.01 7.5 1.0 13.5 22.7 8.8 200 65 esd5z12t1, g* zm 12 0.01 14.1 1.0 17 25 9.6 240 55 * the g'' suffix indicates pb-free package available. **other voltages available upon request. ?surge current waveform per figure 5. 2. v br is measured with a pulse test current i t at an ambient temperature of 25 c. 3. for test procedure see figures 3 and 4 and application note and8307/d. 4. esd5z5.0t1g shown below. other voltages available upon request. figure 1. esd clamping voltage screenshot positive 8 kv contact per iec 61000-4-2 figure 2. esd clamping voltage screenshot negative 8 kv contact per iec 61000-4-2
esd5z2.5t1 series http://onsemi.com 3 iec 61000-4-2 spec. level test voltage (kv) first peak current (a) current at 30 ns (a) current at 60 ns (a) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 i peak 90% 10% iec61000-4-2 waveform 100% i @ 30 ns i @ 60 ns t p = 0.7 ns to 1 ns figure 3. iec61000-4-2 spec 50 50 cable tvs oscilloscope esd gun figure 4. diagram of esd test setup the following is taken from application note and8308/d - interpretation of datasheet parameters for esd devices. esd voltage clamping for sensitive circuit elements it is important to limit the voltage that an ic will be exposed to during an esd event to as low a voltage as possible. the esd clamping voltage is the voltage drop across the esd protection diode during an esd event per the iec61000-4-2 waveform. since the iec61000-4-2 was written as a pass/fail spec for larger systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. on semiconductor has developed a way to examine the entire voltage waveform across the esd protection di ode over the time domain of an esd pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all esd protection diodes. for more information on how on semiconductor creates these screenshots and how to interpret them please refer to and8307/d. figure 5. 8 x 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s
esd5z2.5t1 series http://onsemi.com 4 package dimensions sod-523 case 502-01 issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. -t- seating plane b a -x- -y- d 2 pl t m 0.08 (0.003) x y c s j k dim min nom max millimeters a 1.10 1.20 1.30 b 0.70 0.80 0.90 c 0.50 0.60 0.70 d 0.25 0.30 0.35 j 0.07 0.14 0.20 k 0.15 0.20 0.25 s 1.50 1.60 1.70 0.043 0.047 0.051 0.028 0.032 0.035 0.020 0.024 0.028 0.010 0.012 0.014 0.0028 0.0055 0.0079 0.006 0.008 0.010 0.059 0.063 0.067 min nom max inches 12 *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.40 0.0157 0.40 0.0157 1.40 0.0547 mm inches scale 10:1 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. typical parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including typicals must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800-282-9855 toll free ?usa/canada europe, middle east and africa technical support: ?phone: 421 33 790 2910 japan customer focus center ?phone: 81-3-5773-3850 esd5z2.5t1/d literature fulfillment : ?literature distribution center for on semiconductor ?p.o. box 5163, denver, colorado 80217 usa ? phone : 303-675-2175 or 800-344-3860 toll free usa/canada ? fax : 303-675-2176 or 800-344-3867 toll free usa/canada ? email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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