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january 2007 hyb18l128160bf-7.5 hye18l128160bf-7.5 hyb18l128160bc-7.5 hye18l128160bc-7.5 drams for mobile applications 128-mbit mobile-ram data sheet rev. 1.71
data sheet, rev. 1.71, 2007-01 2 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram hyb18l128160bf-7.5; hye18l128160bf-7.5; hyb18l128160bc-7.5; hye18l128160bc-7.5 revision history: rev. 1.71 2007-01 all new qimonda template previous revision: 1.70 all new template (logo) all v dd , v ddq changed to 1.70v-1.95v previous revision: 1.61 2 added disclaimer 49 figure 47: updated 28 figure 25 : updated 12 chapter 2.1 : added to note 6: programming of the extended mode register... 14 extended mode register ta ble: editorial changes chapter 2.2.1.6 : editorial change 39 chapter 2.4.9.2 : changed last paragraph by: if during normal operation... 15 , 28 , 46 , 46 table 8 , table 12 and table 21 : t ih changed 2005-03-07 table 21 : note 7 changed: if t t > 1ns, a value of [0.5 x (tt -1)] ns... table 20 : editorial changes we listen to your comments any information within this document that you feel is wrong, unclear or missing at all? your feedback will help us to continuously improve the quality of this document. please send your proposal (including a reference to this document) to: techdoc.mp@infineon.com data sheet 3 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram overviewfeatures 1overview this chapter gives an overview of the drams for mob ile applications product fa mily and describes its main characteristics. 1.1 features the drams for mobile applications offers the following key features: general features ? 4 banks 2 mbit 16 organization ? fully synchronous to positive clock edge ? four internal banks for concurrent operation ? programmable cas latency: 2, 3 ? programmable burst length: 1, 2, 4, 8 or full page ? programmable wrap sequence: sequential or interleaved ? programmable drive strength ? auto refresh and self refresh modes ? 4096 refresh cycles / 64 ms ? auto precharge ? commercial (0 c to +70 c) and extended (-25 c to +85 c) operating temperature range ? 54-ball p-vfbga package (12.0 8.0 1.0 mm) power saving features ? low supply voltages: v dd = 1.70v to 1.95v, v ddq = 1.70v to 1.95v ? optimized self refresh (i dd6 ) and standby currents (i dd2 /i dd3 ) ? programmable partial ar ray self refresh (pasr) ? temperature compensated self-refresh (tcsr), controlled by on-chip temperature sensor ? power-down and deep power down modes table 1 performance part number speed code - 7.5 unit speed grade 133 mhz access time (t ac.max ) cl = 3 5.4 ns cl = 2 6.0 ns clock cycle time (t ck.min ) cl = 3 7.5 ns cl = 2 9.5 ns table 2 memory addressing scheme item addresses banks ba0, ba1 rows a0 - a11 columns a0 - a8 data sheet 4 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram overviewpin configuration 1.2 pin configuration figure 1 standard ballout 128-mbit mobile-ram table 3 ordering information type package description commercial temperature range hyb18l128160bc-7.5 p-vfbga-54-2 133 mhz 4 banks 2 mbit 16 lp-sdram extended temperature range hye18l128160bc-7.5 p-vfbga-54-2 133 mhz 4 banks 2 mbit 16 lp-sdram table 4 ordering information for green products type 1) 1) hyb / hye: designator for memory products (hyb: standard temp. range; hy e: extended temp. range) 18l: 1.8v mobile-ram 128: 128 mbit density 160: 16 bit interface width b: die revision c / f: lead-containing product (c) / green product (f) -7.5: speed grade(s): min. clock cycle time package description commercial temperature range hyb18l128160bf-7.5 p-vfbga-54-2 133 mhz 4 banks 2 mbit 16 lp-sdram extended temperature range hye18l128160bf-7.5 p-vfbga-54-2 133 mhz 4 banks 2 mbit 16 lp-sdram ! " #$%&'$()*%$+,-.-- /-. data sheet 5 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram overviewdescription 1.3 description the hy[b/e]18l128160b[c/f] is a high-speed cmos, dynamic random-access memo ry containing 134,217,728 bits. it is internally configured as a quad-bank dram. the hy[b/e]18l128160b[c/f] achieves high speed data transfer rates by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to the system clock. read and write accesses are burst-oriented; accesses start at a selected location and continue for a programmed number of locations (1, 2, 4, 8 or full page) in a programmed sequence. the device operation is fully synchronous: all inputs are registered at the positive edge of clk. the hy[b/e]18l128160b[c/f] is especially designed fo r mobile applications. it operates from a 1.8v power supply. power consumption in self refresh mode is drastically reduced by an on-chip temperature sensor (octs); it can further be reduced by using the progra mmable partial array se lf refresh (pasr). a conventional data-retaining power-down (pd) mode is available as well as a non-data-retaining deep power- down (dpd) mode. the hy[b/e]18l128160b[c/f] is housed in a 54-ball p- vfbga package. it is av ailable in commercial (0 c to 70 c) and extended (-25 c to +85 c) temperature range. data sheet 6 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram overviewdescription figure 2 functional block diagram cke clk cs ras cas we address register row address mux 12 12 12 refresh counter command decode mode registers control logic bank 0 row address latch & decoder 12 bank column logic column address counter / latch 9 bank 0 memory array (4096 x 512 x 16) sense amplifier 4096 io gating dqm mask logic column decoder 9 14 a0-a11 ba0,ba1 16 dq0- dq15 data output reg. data input reg. 16 ldq m udq m bank 1 bank 2 bank 3 2 2 2 2 data sheet 7 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram overviewpin definition and description 1.4 pin definition and description table 5 pin description ball type detailed function clk input clock: all inputs are sampled on the positive edge of clk. cke input clock enable: cke high activates and cke low dea ctivates internal clock signals, device input buffers and output drivers. taking cke low pr ovides precharge power-down and self refr esh operation (all banks idle), active power- down (row active in any bank) or su spend (access in progre ss). input buffers, excluding clk and cke are disabled during power-down. input buffers, excluding cke are disabled during self refresh. cs input chip select: all commands are masked when cs is registered high. cs provides for external bank selection on systems with multiple memory banks. cs is considered part of the command code. ras , cas , we input command inputs: ras , cas and we (along with cs ) define the command being entered. dq0 - dq15 i/o data inputs/output: bi-directional data bus (16 bit) ldqm, udqm input input/output mask: input mask signal for write c ycles and output enable for read cycles. for writes, dqm acts as a data mask when high. for reads, dqm acts as an output enable and places the output buff ers in high-z state when high (two clocks latency). ldqm corresponds to the data on dq0 - dq7; udqm to the data on dq8 - dq15. ba0, ba1 input bank address inputs: ba0 and ba1 define to which bank an activate, read, write or precharge command is being applied. ba0, ba1 also determine which mode register is to be loaded during a mode register set command (mrs or emrs). a0 - a11 input address inputs: a0 - a11 define the row address during an active command cycle. a0 - a8 define the column address during a r ead or write command cycle. in addition, a10 (= ap) controls auto precharge operation at the end of the burst read or write cycle. during a precharge command, a10 (= ap ) in conjunction with ba0, ba1 controls which bank(s) are to be precharged: if a1 0 is high, all four banks will be precharged regardless of the state of ba0 and ba1; if a10 is low, ba0, ba1 define the bank to be precharged. during mode register set commands, the address inputs hold the op-code to be loaded. v ddq supply i/o power supply: isolated power for dq output buffers for improved noise immunity: v ddq = 1.70v to 1.95v v ssq supply i/o ground v dd supply power supply: power for the core lo gic and input buffers, v dd = 1.70v to 1.95v v ss supply ground n.c. ? no connect data sheet 8 rev. 1.71, 2007-01 05282004-nznk-8t0d hy[b/e]18l128160b[c/f]-7.5 128-mbit mobile-ram functional descriptionpower on and initialization 2 functional description the 128-mbit mobile-ram is a high-speed cmos, dynami c random-access memory containing 134,217,728 bits. it is internally configured as a quad-bank dram. read and write accesses to the mobile-ram are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a pr ogrammed sequence. accesses begin with the registration of an active command, followed by a read or write co mmand. the address bits re gistered coincident with the active command are used to select the bank and row to be accessed (ba0, ba1 se lect the banks, a0 - a11 select the row). the address bits registered coincident with the read or write command are used to select the starting column location for the burst access. prior to normal operation, the mobile -ram must be initialized. the following sections pr ovide detailed information covering device initialization, register defini tion, command description and device operation. 2.1 power on and initialization the mobile-ram must be powered up and initialized in a predefined manner (see figure 3 ). operational procedures other than those specifie d may result in undefined operation. figure 3 power-up sequence and mode register sets 0 o w e r u p 6 $ $ a n d # + s t a b l e , o a d - o d e 2 e g i s t e r , o a d % x t - o d e 2 e g i s t e r $ o n g t # a r e " ! , " ! 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