mixers - sub-harmonic - smt 8 8 - 22 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201 general description features functional diagram the hmc264lm3 is a 20 - 30 ghz surface mount sub-harmonically pumped (x2) mmic mixer with an integrated lo ampli er in a smt leadless chip car- rier package. the 2lo to rf isolation is an excel- lent 25 to 35 db, eliminating the need for additional ltering. the lo ampli er is a single bias (+3v to +4v) two stage design with only -4 dbm drive requirement. all data is with the non-hermetic, epoxy sealed lm3 packaged device mounted in a 50 ohm test xture. utilizing the hmc264lm3 eliminates the need for wirebonding, thereby providing a consistent connec- tion interface for the customer. integrated lo ampli er: -4 dbm input sub-harmonically pumped (x2) lo high 2lo/rf isolation: 35 db lm3 smt package electrical speci cations, t a = +25 c, as a function of lo drive & vdd typical applications the hmc264lm3 is ideal for: ? 20 and 30 ghz microwave radios ? up and down converter for point-to-point radios ? lmds and satcom parameter if = 1 ghz lo = -4 dbm & vdd = +4v if = 1 ghz lo = -4 dbm & vdd = +3v units min. typ. max. min. typ. max. frequency range, rf 20 - 30 21 - 30 ghz frequency range, lo 10 - 15 10.5 - 15 ghz frequency range, if dc - 4 dc - 4 ghz conversion loss 9 12 9 12 db noise figure (ssb) 9 12 9 12 db 2lo to rf isolation 20 35 16 30 db 2lo to if isolation 30 40 26 38 db ip3 (input) 5 12 4 10 dbm 1 db compression (input) -2 +4 -1 +2 dbm supply current (idd) 28 25 ma *unless otherwise noted, all measurements performed as downconverter, if= 1 ghz.
mixers - sub-harmonic - smt 8 8 - 23 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com conversion gain vs. temperature @ lo = -4 dbm, vdd= +4v conversion gain vs. temperature @ lo = -4 dbm, vdd= +3v conversion gain vs. lo drive @ vdd = +4v conversion gain vs. lo drive @ vdd = +3v isolation @ lo = -4 dbm, vdd = +4v isolation @ lo = -4 dbm, vdd = +3v hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201 -25 -20 -15 -10 -5 0 18 20 22 24 26 28 30 32 34 +25c -40c +85c conversion gain (db) rf frequency (ghz) -70 -60 -50 -40 -30 -20 -10 0 10 18 20 22 24 26 28 30 32 34 isolation (db) rf frequency (ghz) 2lo/rf lo/rf rf/if 2lo/if lo/if -70 -60 -50 -40 -30 -20 -10 0 10 18 20 22 24 26 28 30 32 34 lo/rf rf/if lo/if 2lo/rf 2lo/if isolation (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 18 20 22 24 26 28 30 32 34 -8 dbm -6 dbm -4 dbm -2 dbm 0 dbm conversion gain (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 18 20 22 24 26 28 30 32 34 -8 dbm -6 dbm -4 dbm -2 dbm 0 dbm conversion gain (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 18 20 22 24 26 28 30 32 34 +25c -40c +85c conversion gain (db) rf frequency (ghz)
mixers - sub-harmonic - smt 8 8 - 24 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input ip2 vs. lo drive @ vdd = +4v * input ip2 vs. lo drive @ vdd = +3v * input ip3 vs. lo drive @ vdd = +4v * input ip3 vs. lo drive @ vdd = +3v * input p1db @ lo = -4 dbm, vdd = +4v input p1db @ lo = -4 dbm, vdd = +3v * two-tone input power = -10 dbm each tone, 1 mhz spacing. hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201 -5 0 5 10 15 20 25 30 18 20 22 24 26 28 30 32 34 -2 dbm -4 dbm -6 dbm input ip3 (dbm) rf frequency (ghz) -3 -2 -1 0 1 2 3 4 5 6 7 18 20 22 24 26 28 30 32 34 input p1db (dbm) rf frequency (ghz) -3 -2 -1 0 1 2 3 4 5 6 7 18 20 22 24 26 28 30 32 34 input p1db (dbm) rf frequency (ghz) 0 10 20 30 40 50 60 70 80 18 20 22 24 26 28 30 32 34 -6 dbm -4 dbm -2 dbm input ip2 (dbm) rf frequency (ghz) 0 10 20 30 40 50 60 70 18 20 22 24 26 28 30 32 34 -6 dbm -4 dbm -2 dbm input ip2 (dbm) rf frequency (ghz) -5 0 5 10 15 20 25 30 18 20 22 24 26 28 30 32 34 -6 dbm -4 dbm -2 dbm input ip3 (dbm) rf frequency (ghz)
mixers - sub-harmonic - smt 8 8 - 25 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com rf & lo return loss @ lo = -4 dbm, vdd = +4v if return loss @ lo = -4 dbm, vdd = +4v upconverter performance conversion gain, lo = -4 dbm vdd = +4v if bandwidth @ lo = -4 dbm absolute maximum ratings mxn spurious outputs @ lo = -4 dbm, vdd = +4v nlo mrf 5 4 3 2 1 0 -3 -2 34.8 -1 61.8 26.1 32.6 014.1-26.9 1x33.812.3 249.048.1 378.881.3 rf = 30 ghz @ -10 dbm lo = 13.5 ghz @ -4 dbm all values in dbc below if power level. rf / if input (vdd = +5v) +13 dbm lo drive (vdd = +5v) +13 dbm vdd 5.5v continuous pdiss (ta = 85 c) (derate 2.52 mw/c above 85 c) 227 mw storage temperature -65 to +150 c operating temperature -40 to +85 c electrostatic sensitive device observe handling precautions -25 -20 -15 -10 -5 0 012345678910 return loss (db) if frequency (ghz) -25 -20 -15 -10 -5 0 0 5 10 15 20 25 30 35 rf lo return loss (db) if frequency (ghz) -25 -20 -15 -10 -5 0 012345678910 vdd = +3v vdd = +4v conversion gain (db) if frequency (ghz) -25 -20 -15 -10 -5 0 18 20 22 24 26 28 30 32 34 vdd = +3v vdd = +4v conversion gain (db) rf frequency (ghz) hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 26 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pin number function description interface schematic 1, 2 n/c this pin may be connected to the housing ground or left unconnected. 3vdd power supply for the lo ampli er. an external rf bypass capacitor of 100 - 330 pf is required as close to the package as possible. 4rf this pin is ac coupled an matched to 50 ohm from 20 - 30 ghz. 5if this pin is dc coupled and should be dc blocked externally using a series capacitor whose value has been chosen to pass the neces- sary if frequency range. any applied dc voltage to this pin will result in die non-function and possible die failure. 6lo this pin is ac coupled and matched to 50 ohm from 10 - 15 ghz. 7 gnd must be soldered to pcb rf ground. outline drawing pin descriptions notes: 1. material: plastic 2. plating: gold over nickel 3. dimensions are in inches [millimeters]. 4. all tolerances are 0.005 [ 0.13]. 5. all grounds must be soldered to pcb rf ground. 6. ? indicates pin 1 hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 27 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com the grounded co-planar wave guide (cpwg) pcb input/output transitions allow use of ground-signal-ground (gsg) probes for testing. suggested probe pitch is 400mm (16 mils). alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. evaluation pcb evaluation circuit board layout design details lm3 package mounted to evaluation pcb layout technique micro strip to cpwg material rogers 4003 with 1/2 oz. cu dielectric thickness 0.008 (0.20 mm) microstrip line width 0.018 (0.46 mm) cpwg line width 0.016 (0.41 mm) cpwg line to gnd gap 0.005 (0.13 mm) ground to via hole diameter 0.008 (0.20 mm) c1 100 pf capacitor, 0402 pkg. hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 28 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com suggested lm3-01 pcb land pattern tolerance: 0.003 ( 0.08 mm) hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 29 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc264lm3 recommended smt attachment technique preparation & handling of the lm3 millimeterwave package for surface mounting the hmc lm3 package was designed to be compatible with high volume surface mount pcb assembly processes. the lm3 package requires a speci c mounting pattern to allow proper mechanical attachment and to optimize electrical per- formance at millimeterwave frequencies. this pcb layout pat- tern can be found on each lm3 product data sheet. it can also be provided as an electronic drawing upon request from hittite sales & application engineering. follow these precautions to avoid permanent damage: cleanliness: observe proper handling procedures to ensure clean devices and pcbs. lm3 devices should remain in their original packaging until component placement to ensure no contamination or damage to rf, dc & ground contact areas. static sensitivity: follow esd precautions to protect against esd strikes. general handling: handle the lm3 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. avoiding damaging the rf, dc, & ground contacts on the package bottom. do not apply excess pres- sure to the top of the lid. solder materials & temperature pro le: follow the information contained in the application note. hand soldering is not recommended. conductive epoxy attachment is not recommended. solder paste solder paste should be selected based on the users experience and be compatible with the metallization systems used. see the lm3 data sheet outline drawing for pin & ground contact metallization schemes. solder paste application solder paste is generally applied to the pcb using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical & electrical performance. excess solder may create unwanted electrical parasitics at high frequencies. solder re ow the soldering process is usually accomplished in a re ow oven but may also use a vapor phase process. a solder re ow pro le is suggested above. prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies. the thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. the nal pro le should be determined by mounting the thermocouple to the pcb at the location of the device. follow solder paste and oven vendors recommendations when developing a solder re ow pro le. a standard pro le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. allow enough time between reaching pre-heat temperature and re ow for the solvent in the paste to evaporate and the ux to completely activate. re ow must then occur prior to the ux being completely driven off. the duration of peak re ow temperature should not exceed 15 seconds. packages have been quali ed to withstand a peak temperature of 235c for 15 seconds. verify that the pro le will not expose device to temperatures in excess of 235c. cleaning a water-based ux wash may be used. hmc264lm3 gaas mmic sub-harmonic smt mixer, 20 - 30 ghz v01.1201 25 50 75 100 125 150 175 200 225 012345678 temperature ( 0 c) time (min)
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