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d a t a sh eet product speci?cation supersedes data of 2000 sep 19 file under integrated circuits, ic01 2001 jul 11 integrated circuits sza1015 brushless motor controller (bmc12)
2001 jul 11 2 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 features direct full bridge driving system no external series resistor required in motor supply line adjustable output current up to 2.1 a (over 20x dvd and over 50x cd) d-mosfet output with a total on-resistance of 0.7 w (typical) pwm controlled commutation internal compensation for emf of motor (emf regenerator) start/stop function with built-in power saving circuit hall amplifiers with a minimum input level of 25 mv built-in frequency generator (fg output) adjustable motor current limiter built-in thermal shutdown reverse torque brake function (full bridge) built-in reverse rotation protection circuit 32 ma hall bias circuit few external components interfaces to 3 v and 5 v logic package with very low thermal resistance from junction to heatsink (reflowable die pad). general description the bmc12 is a 3-phase brushless motor controller (bmc) for hall commutated spindle motors in cd and dvd drives suitable for dvd speeds over 20x and cd speeds over 50x. it uses a 5 v supply for the internal control circuit and a 5 to 12 v supply for the motor driver. the switching pwm output is highly efficient resulting in a low power dissipation for forward torque acceleration as well as for reverse torque brake (pwm controlled reverse torque). sensitive hall sensor amplifiers with a very low offset are integrated which can operate on very small hall signals. the current limiter circuit requires no external series resistor in the power ground which increases efficiency. the limiting current can be adjusted by means of an external resistor at pin rlim (not in series with motor supply line). the current limiter is active during accelerating as well as during braking. the emf voltage of the motor is internally measured and is used to compensate for the pwm commutation. a scaling factor can be set by means of an external resistor at pin remf. the tacho-generator can be used to measure the rotational speed of the disk. it shows the triple frequency of the hall signals. a thermal shutdown circuit with a small hysteresis protects the ic from overheating. a heatsink at the bottom of the chip with a very low thermal resistance enables effective cooling. the start/stop function reduces current consumption of the ic to a minimum when the motor is stopped (stop mode) and also turns off the hall sensor bias in the stop mode. ordering information type number package name description version SZA1015TT htssop32 plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm sot549-1
2001 jul 11 3 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 quick reference data symbol parameter min. typ. max. unit v dd supply voltage 4.5 5.0 5.5 v v ddm motor supply voltage 4.5 12.0 14.5 v i ddm motor current -- 2.1 a r ds(on) d-mosfet on-resistance (high or low) - 0.35 -w p tot total power dissipation -- 3.0 w t amb ambient temperature 0 - 85 c
2001 jul 11 4 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 block diagram d book, full pagewidth mgt188 mux reference sza1015 1 2 3 32 4 56 7 8 9, 31 14 30 29 28 27 26 25 24 23 13, 16, 22 21 19 18 v ssa bias remf rlim fg ec ecr w cosc rosc i.c. wn wp vp un vn up v dd start v ddm u v 10 11 12 15, 17, 20 cp1 cp2 capy gnd n.c. adc pwm commutation power switches dc-dc converter thermal shutdown emf regenerator current reference oscillator reverse blocking hall amplifiers current limiter d c d lim mux inputs s + + fig.1 block diagram.
2001 jul 11 5 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 pinning symbol pin description v ssa 1 motor control ground supply bias 2 hall element bias rosc 3 external resistor for internal oscillator remf 4 external resistor for emf regeneration rlim 5 external resistor for current limiting fg 6 frequency generator output ec 7 output current control pin ecr 8 output current control reference voltage pin i.c. 9 internally connected (leave open-circuit) cp1 10 booster capacitor connection 1 cp2 11 booster capacitor connection 2 capy 12 booster output v ddm 13 motor supply voltage w 14 motor terminal w gnd 15 ground supply v ddm 16 motor supply voltage gnd 17 ground supply n.c. 18 not connected v 19 motor terminal v gnd 20 ground supply u 21 motor terminal u v ddm 22 motor supply voltage start 23 start/stop control pin v dd 24 system supply voltage up 25 positive hall input u un 26 negative hall input u vp 27 positive hall input v vn 28 negative hall input v wp 29 positive hall input w wn 30 negative hall input w i.c. 31 internally connected (leave open-circuit) cosc 32 external capacitor for internal oscillator handbook, halfpage sza1015 mgt189 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 v ssa bias rosc remf rlim fg ec ecr i.c. cp1 cp2 capy v ddm w cosc i.c. wn wp vp un vn up v dd start v ddm u gnd v gnd v ddm n.c. gnd fig.2 pin configuration.
2001 jul 11 6 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 functional description motor control the control input voltage e c is converted into a digital value (d c ) by the adc where voltage e cr is the midpoint reference for e c (see fig.3). the gain from input voltage (e c ) to motor current (i m ) is i lim /e cr (a/v). the motor current can be determined with the following formula: the maximum motor current i lim is set by the motor current limiter. when the rotational speed of the motor has become zero the motor current is switched off and all driver outputs (pins u, v and w) are connected to ground. this prevents the motor of spinning backwards. internal motor voltage generation the simplified motor schematic in fig.4 shows the series resistance and back-emf voltage of the motor. if we assume that i macc is used to accelerate and i mbr is used to brake we can draw two pictures shown in figs 5 (accelerate) and 6 (brake). handbook, halfpage mgt190 reverse torque brake forward torque ( - d c ) ( + d c ) i m = + i lim i m = - i lim i m = 0 e c = 2 e cr e c = e cr e c = 0 v fig.3 motor control. i m i lim e cr ---------- - e c e cr C () = handbook, halfpage mgt191 + + - - v m1 i mbr i macc v m2 v rm (i m ) r m 2 v rm (i m ) r m 2 v emf 2 v emf 2 fig.4 simplified motor schematic. handbook, halfpage mgt192 v m1 v rm k v rm v m2 v emf 2 v emf 2 v ddm 2 v ddm v m w (rad/s) fig.5 motor voltage when accelerating.
2001 jul 11 7 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 the bmc12 regenerates v emf and superimposes v m (0 i m i lim ) which depends on the e c (gain) input voltage. v rm (i m ) can be positive (accelerate) or negative (brake). motor current limiting function the maximum motor current is determined with the following formula: i lim is a fraction of the maximum motor current i max . during accelerating and braking the motor current will not exceed the limiting current set by r lim . the formula to determine the limiting current is as follows: back-emf regeneration the back-emf voltage is internally regenerated. the ratio between r emf and r osc can be used to scale the internal emf regeneration. the value of resistor r emf depends on the type of motor (k-factor, number of pole pairs) and the motor supply voltage used. this is shown in the following formula: for noise reduction the hall signals are internally filtered. handbook, halfpage mgt193 v m1 v rm k v rm v m2 v emf 2 v emf 2 v ddm 2 v ddm v m w (rad/s) fig.6 motor voltage when actively braking. i max v ddm r motor r switches(min) + ------------------------------------------------------- = handbook, halfpage 050 100 0 20 mgt194 40 60 80 10 20 30 40 r lim (k w ) % of i max fig.7 maximum output current as a function of r lim . r osc =47k w . i lim r lim r osc ------------- - i max = r emf k 2.6 10 3 r osc n pp v ddm ------------------------------------------------------ =
2001 jul 11 8 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 fg generator the fg generator output shows a frequency which depends on the number of hall signals (three) and the number of pole pairs (n pp ). the formula to determine the motor frequency is as follows: the fg has an open-drain output for easy interfacing to 3 v and 5 v logic. thermal shutdown the thermal shutdown block sets all outputs to 3-state mode if the junction temperature of the bmc12 exceeds 155 c (typical). there is a hysteresis of 15 c (typical) between the temperatures at which the thermal shutdown activates and deactivates. as soon as the thermal shutdown deactivates, the commutation control continues its operation. oscillator the rc oscillator uses two external components (r osc and c osc ) to fix its frequency. to ensure a stable oscillator frequency the oscillator and r osc both use a reference current made by the current reference block. the nominal frequency is 3 mhz with r osc =47k w (2% tolerance) and c osc = 100 pf (5% tolerance). the values of the external components for the oscillator are fixed. the oscillator can be overruled by applying a 3 mhz clock to pin cosc (r osc is used to determine i lim and r emf and should always be connected). start/stop function at pin start = low, the bmc12 can be set to a power saving mode, reducing the current consumption. in the power saving mode the outputs will be in 3-state. dc-dc converter the on-board dc-dc converter generates a voltage of approximately 2 v ddm - 1.2 v with a maximum voltage of 19.3 v typical (internal clamp circuit). this voltage is used internal to switch the upper drivers of the u, v and w outputs. f motor fg 3n pp -------------------- =
2001 jul 11 9 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 handbook, full pagewidth mgt196 12 v (1) (3) (4) (2) up-un wp-wn vp-vn 0 v u 12 v 0 v v 12 v 0 v w fig.8 phase condition of hall input and output voltage (motor running with e c >e cr ). (1) in this example, a pwm output signal with a 25% duty cycle is drawn as a thin line. the average motor voltage (drawn with a thicker line width) is 25% v ddm , i.e. 3.0 v. at the opposite side of the coil (in this drawing pin w) the duty cycle is 75%, so the average voltage on pin w is 9.0 v. the differential voltage over the motor pins then is: 9 - 3=6v. (2) there is still a current flowing from pin u into the motor. the lower flyback diode starts conducting, and causes a flyback voltage of around 0.7 v below gnd, until the current is zero. (3) there is still a current flowing from the motor into pin u. the upper flyback diode starts conducting, and causes a flyback voltage of around 0.7 v above v ddm , until the current is zero. (4) during this phase, the driver output is 3-state. because there is no current flowing through pin u, the back-emf of the motor is seen.
2001 jul 11 10 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 limiting values in accordance with the absolute maximum rating system (iec 60134). thermal characteristics characteristics v dd =5v; v ddm = 12 v; gnd = 0 v; t amb =25 c; r osc =47k w , c osc = 100 pf; unless otherwise speci?ed. symbol parameter min. max. unit v dd supply voltage - 0.5 +6.5 v v ddm motor supply voltage - 0.5 +15 v i ddm motor current - 2.1 a p tot total power dissipation - 3.0 w t stg storage temperature - 55 +150 c t amb ambient temperature 0 85 c symbol parameter value unit r th(j-c) thermal resistance from junction to case 10 k/w symbol parameter conditions min. typ. max. unit supplies v dd supply voltage 4.5 5.0 5.5 v v ddm motor supply voltage 4.5 12.0 14.5 v i ddm motor current -- 2.1 a handbook, halfpage 0 50 100 150 t amb ( c) p tot (w) 4 3 1 0 2 mgt197 fig.9 maximum dissipation as a function of the ambient temperature. the ic is thermally connected with its heatsink to an external heatsink at ambient temperature, with a total thermal resistance of 35 k/w (10 k/w junction to case plus 25 k/w case to surrounding).
2001 jul 11 11 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 notes 1. the pwm frequency is: 2. clamping level with v ddm =12v. 3. the maximum useful range of the control input voltage e c is 0 to 2 e cr (midpoint reference voltage). when e c =e cr , then no torque is applied to the motor. the conversion characteristic does not have a dead zone. i dd supply current start = high - 15 - ma i dd(q) quiescent current in power saving mode start = low -- 1ma p tot total power dissipation -- 3.0 w t amb ambient temperature 0 - 85 c hall ampli?er inputs (pins un, up, vn, vp, wn and wp) v io input offset voltage - 3.5 - +3.5 mv v i input voltage range 0 - 4.0 v v i(dif)(p-p) hall ampli?er input voltage (peak-to-peak value) 25 -- mv hall elements bias (pin bias) i bias bias current -- 32 ma v bias bias voltage i bias = 32 ma 0.1 - 0.5 v oscillator f osc oscillator frequency note 1 - 3.0 - mhz thermal shutdown circuit t sd thermal shutdown operating temperature 140 155 170 c power switches r ds(on) d-mosfet on-resistance (high or low) v ddm = 12 v 0.25 0.35 0.50 w v ddm = 5 v 0.35 0.50 0.71 w booster v capy booster output voltage note 2 19 19.3 19.6 v torque control (pins ec and ecr) v ecr reference voltage on pin ecr 1.2 1.8 2.5 v v ec torque control voltage on pin ec note 3 0 - v dd v digital input (pin start) v ih high-level input voltage 2.0 -- v v il low-level input voltage -- 0.8 v open-drain output (pin fg) v ol low-level output voltage i o =2ma -- 0.5 v symbol parameter conditions min. typ. max. unit f pwm f osc 33 --------- =
2001 jul 11 12 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 application information handbook, full pagewidth mgt198 100 w + 5 v 22 nf 10 nf 100 pf 47 k w sza1015 332 4 3 v or 5 v + 5 v + 12 v signals to/from decoder from microcontroller 5 6 7 8 10 11 12 14 30 29 23 13, 16, 22 21 19 remf r emf (1) rlim r lim (1) fg ec ecr cp1 cp2 capy gnd v ddm v ssa 24 v dd w cosc rosc wn 2 bias wp hw 28 27 vn vp hv 26 25 un up hu hall elements + 5 v wn bias wp hw vn vp hv un up hu motor start u v 15, 17, 20 1 fig.10 typical application diagram. (1) for selection of the resistors r emf and r lim see chapter functional description.
2001 jul 11 13 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 internal pin configuration handbook, full pagewidth mgt199 r on = 150 to 350 w r on = 150 to 350 w 5 pf 3.4 pf 3.4 pf un (pin 26) 5 pf vn (pin 28) 5 pf 5 pf 5 pf 5 pf wn (pin 30) up (pin 25) vp (pin 27) wp (pin 29) u (pin 21) 100 k w ecr (pin 8) ec (pin 7) start (pin 23) 'on' when start is active bias (pin 2) v (pin 19) w (pin 14) v ddm gnd fig.11 input and output equivalent circuits.
2001 jul 11 14 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 package outline unit a 1 a 2 a 3 b p cd (1) e (2) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.05 8 0 o o 0.10 dimensions (mm are the original dimensions). notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. sot549-1 99-03-04 w m q a a 1 a 2 e h d h d l p detail x e z heatsink side e c l x (a 3 ) 0.25 1 16 32 17 y b h e 0.95 0.85 0.30 0.19 d h 5.10 4.90 e h 3.60 3.40 0.20 0.09 11.10 10.90 6.20 6.00 8.30 7.90 0.65 1.00 0.20 0.78 0.48 0.10 0.75 0.50 p v m a a htssop32: plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm sot549-1 a max. 1.10 0 2.5 5 mm scale pin 1 index
2001 jul 11 15 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2001 jul 11 16 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, lfbga, sqfp, tfbga not suitable suitable hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
2001 jul 11 17 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2001 jul 11 18 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 notes
2001 jul 11 19 philips semiconductors product speci?cation brushless motor controller (bmc12) sza1015 notes
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