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cyntec co., ltd.

document rla00000 revision a4 page 1 of 10 1/4w 1220 low resistnace chip resistor 1. scope this specification applies to 2.0mm x 1.25mm size 1/4w, fixed metal film chip resistors rectangular type for use in electronic equipment. 2. type designation RL1220 - - (1) (2) (3) (4) where (1) series no. (2) temperature coefficient of resistance t. c . r . (3) resistance value: refer to paragraph 4-1 for example-- three digits of number ( 0.1 r) r10 = 0.1 ? 1r0 = 1.0 ? four digits of number r < 0.1 ? r022 = 0.022 ? the ?r? shall be used as a decimal point. (4) resistance tolerance: refer to paragraph 4-1. 3. construction and physical dimensions dimensions (mm) code letter 1220 l 2.00 0.2 w 1.25 0.2 +0.05 t0.40 -0.1 a 0.4 0.2 b 0.4 0.2 figure 1. construction and dimensions a a l w t b
cyntec co., ltd.

document rla00000 revision a4 page 2 of 10 4. ratings 4.1 specification power rating* 1/4 w resistance value 22m ? 82m ? 0.1 ? 10 ? resistance tolerance 1%(f) , 5%(j) 1%(f) , 2%(g) note*: power rating is based on continuous full load operation at rated ambient temperature of 70 c. for resistors operated at ambient temperature in excess of 70 c, the maximum load shall be derated in accordance with the following curve. figure 2 derating curve 4.2 rated voltage the rated voltage shall be determined by the following expression. = where v rated voltage (v) r nominal resistance value ( ? ) p rated dissipation (w) 4.3 operating and storage temperature range -55 to +125 c -55 0 70 125 c 100 50 % rated dissipation ratio ambient temperature
cyntec co., ltd.

document rla00000 revision a4 page 3 of 10 r0.5 insulation prate spring test sample metal block measurement point b pressure rod (metal) measurement point a substrate protection film 5. characteristics 5-1 electrical 5-1-1 resistance resistance value shall be within the tolerance specified in paragraph 4-1 refer to jis c 5202 5.1 5-1-2 temperature coefficient of resistance not exceed the temperature coefficient of resistance specified in paragraph 4-1 room temperature room temperature + 100 refer to jis c 5202 5.2 5-1-3 short time overload resistance change : (0.5%) without significant damage by flashover (spark ,arching),burning or breakdown etc. test voltage : 2.5 times the rated voltage. duration : 5 seconds refer to jis c 5202 5.5 5-1-4 insulation resistance (1) between electrode and protection film 100m ? or over (2) between electrode and substrate 1,000m ? or over the resistor shall be cramped in the metal block and tested , as shown below. test voltage : 100v dc for 1 minute refer to jis c 5202 5.6 mounting condition g.
cyntec co., ltd.

document rla00000 revision a4 page 4 of 10 5-1-5 voltage proof resistance change : (0.5%) without damage by flashover, fire or breakdown, as shown below. the resistor shall be tested as shown in paragraph 5-1-4 the voltage : 100v ac (rms.) for 1 minute refer to jis c 5202 5.7 5-1-6 intermittent overload when the resistance tolerance is 1.0% and 2.0%, the resistance change is (1.0%). when the resistance tolerance is 5.0%, the resistance change is (5.0%). dc voltage of 3.0 times the rated voltage for 1 second with pause of 25 seconds. 10,000 200 cycles refer to jis c 5202 5.8 5-2 mechanical 5-2-1 terminal strength resistance change : (0.5%) without mechanical damage such as breaks. electrical characteristics shall be satisfied. if there are electrodes on both surfaces, it shall satisfy the above specifications on whichever surface may be fixated. bending amplitude : 3 mm 30 seconds refer to jis c 5202 6.1.4. 45 45 solder supports within 2mm test pc board sample pressure press jig refer to eiaj rc-2530 unit : mm r230 amplitude 3 mm 20 50
cyntec co., ltd.

document rla00000 revision a4 page 5 of 10 5-2-2 body strength resistance change : (0.5%) without mechanical damage such as breaks. a load of 10n using a r0.5 pressure rod shall be applied to the center in the direction of the arrow and held for 10 seconds. refer to jis c 5202 6.2 5-2-3 solderability a new uniform coating of solder shall cover minimum of 95% of the surface being immersed. temperature of solder : 235 5 c immersion duration : 2 0.5 seconds refer to jis c 5202 6.5 5-2-4 resistance to soldering heat resistance change : (0.5%) electrical characteristics shall be satisfied. without distinct deformation in appearance. (1) solder bath method pre-heat : 100 to 110 30 seconds temperature : 260 5 10 1seconds (2) reflow soldering method peak temperature : 240 5 3 to 5 seconds temperature : 220 5 40 seconds the heating apparatus shall be the upper-heated oven and temperature shall be the board surface temperature. (3) soldering iron method bit temperature : 350 5 3 1/0 seconds the resistor shall be stored at standard atmospheric conditions for 1 hour, after which the measurements shall be made. refer to jis c 5202 6.4 r0.5 1/2l l resistor pressure rod unit : mm
cyntec co., ltd.

document rla00000 revision a4 page 6 of 10 5-2-5 resistance to solvent without mechanical damage and distinct damage in appearance. immersion cleaning at normal temperature 300 seconds in isopropyl alcohol. refer to jis c 5202 5-3 endurance 5-3-1 rapid change of temperature resistance change : (0.5%) without distinct damage resistance shall be subjected to 5 cycles of the temperature cycle as following : -55 2 , 30 minutes room temperature, 2 3 minutes +125 2 , 30 minutes room temperature, 2 3 minutes refer to jis c 5202 7.4 5-3-2 dump heat with load resistance change : (1.0%) without distinct damage 40 2 with relative humidity of 90 to 95% dc rated voltage for 1.5 hours on 0.5 hour off 1,000 + 48 / - 0 hours refer to jis c 5202 7.9 5-3-3 endurance at 70 resistance change : (1.0%) without distinct damage 70 2 dc rated voltage for 1.5 hours on 0.5 hour off 1,000 + 48 / -0 hours refer to jis c 5202 7.10
cyntec co., ltd.

document rla00000 revision a4 page 7 of 10 mounting of the test sample onto the test board shall be either of following methods. (1) mounting by solder dipping epoxy based glue shall be applied in the middle of two lands of the test board. the resistor shall be mounted in such a way that the electrodes of resistors will be evenly placed in the land area and then adhesive resin shall be cured. after applying the resin flux with 25 weight % methyl alcohol, the board shall be soldered by dipping into a molten solder bath with 260 5 for 3 to 5 seconds (2) mounting by reflow soldering solder paste with approximate 300 m thickness shall be applied to the land of test board. the resistor shall be mounted in such way that the electrodes of resistors will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 240 5 (peak) for 3 to 5 seconds in an upper-heater oven. test board a material : glass fabric epoxy resin board thickness : 1.6mm copper foil thickness : 0.035mm solder resist coating b f a c 100 40 land unit : mm ab c f 1.2 4.0 1.65 (3.0)
cyntec co., ltd.

document rla00000 revision a4 page 8 of 10 test board b material : glass fabric epoxy resin board thickness : 1.6mm copper foil thickness : 0.035mm solder resist coating 0.1 2.4 5.3 6.94 4.46 5.08 (5.08x9=45.72) 58.5 1.22 1.32 18.5 8.5 27.0 1 4 unit : mm
cyntec co., ltd.

document rla00000 revision a4 page 9 of 10 6. packaging 6-1 dimensions 6-1-1 tape packaging dimensions 6-1-2 reel dimensions chip a b 1.75 0.1 3.5 0.05 8.0 0.3 a = 1.65 0.2 b = 2.4 0.2 0.8 0.1 0.75 0.05 cavity 4.0 0.1 2.0 0.05 4.0 0.1 0 1 2 3 4 5 3 1 label 12 1.5 1 0.5 10 1.5
cyntec co., ltd.

document rla00000 revision a4 page 10 of 10 6-2 peel force of top cover tape the peel speed shall be about 300 mm/min. the peel force of top cover tape shall be between 0.1 to 0.7 n. 6-3 numbers of taping 5,000 pieces/reel 6-4 making the following items shall be marked on the reel. (1) type designation . (2) quantity (3) manufacturing date code (4) manufacturer?s name (5) the country of origin 165 ~ 180 top co ve r ta pe 0.1n~0.7n

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