hermetically sealed, high speed, high cmr, logic gate optocouplers reliability data sheet description the reliability data shown includes agilent reliability test data from the past three years on this product family. all of these products use the same leds, the same logic gate ics, the same dscc approved packaging materials, processes, stress conditions and testing. the data in tables 1 and 2 reflect actual test data on dual channel devices. the single channel hcpl- 5601 data in table 3 is inferred from the demonstrated life test data using the factor (1.5) found in the photodiode detector isolator section of mil-hdbk- 217, combined with any single channel data obtained. this data definition of failure inability to switch, i.e., functional failure, is the definition of failure in this data sheet. specifically, failure occurs when the device fails to switch on with 2 times the minimum recommended drive current (but not exceeding the max. rating) or fails to switch off when there is no input current. failure rate projections the demonstrated point mean time to failure (mttf) is measured at the absolute maximum stress condition. the failure rate projections in tables 2 and 3 use the arrhenius acceleration relationship, where a 0.43 ev activation energy is used as in the hybrid section of mil- hdbk-217. applications information the data of tables 1, 2, and 3 were obtained on mil-prf-38534 screened devices with high temperature operating life duration up to 5000 hours. an exponential (random) failure distribution is assumed, expressed in units of fit (failures per billion is taken from testing on agilent technologies devices using internal agilent processes, material specifications, design standards, and statistical process controls. they are not transferable to other manufacturers similar part types. device hours) are only defined in the random failure portion of the reliability curve. for valid system reliability calculations, it is necessary to adjust for the time when the system is not in operation. note that if you are using mil- hdbk-217 for predicting component reliability, the results may not be comparable to those given in tables 2 and 3 due to the different conditions and factors operating life test table 1. demonstrated operating life test performance, 6n134/883b demonstrated demonstrated stress test total devices total device number of mttf (hr)@ fits @ condition tested hours failed units t a = +125 ct a = +125 c i f = 20 ma 475 1,781,000 0 >1,781,000 <561 i out = 25 ma v cc = 5.5 v t a = +125 c t j = +160 c agilent 8102801ex, 5962-9800101kex 6n134/883b, hcpl-268k 8102802px, 5962-9800102kpx hcpl-5631, hcpl-563k 5962-9085501hpx, 5962-9085501kpx hcpl-5601, hcpl-560k, 81028032a, 5962-9800103K2A hcpl-6631, hcpl-663k 8102804fc, 5962-9800104kfc hcpl-6651, hcpl-665k
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. obsoletes 5967-6006e 5968-9395e (2/00) environmental testing all high reliability hermetic optocouplers listed meet the 100% screening and quality conformance inspection testing of mil-prf-38534, class h or class k as applicable. table 4. esds classification per method 3015, mil-std-883 that have been accounted for in mil-hdbk-217. for example, it is unlikely that your application will exercise all available channels at full rated power with the led(s) always on as agilent testing does. thus, your application total power and duty cycle must be carefully considered when comparing tables 2 and 3 to predictions using mil-hdbk-217. electrostatic discharge sensitivity part number esd class 5962-9800101kex, hcpl-268k 3 8102801ex, 6n134/883b 3 5962-9800102kpx, hcpl-563k 3 8102802px, hcpl-5631 3 5962-9085501kpx, hcpl-560k 1 5962-9085501hpx, hcpl-5601 1 5962-9800103K2A, hcpl-663k 3 5962-9800104kfc, hcpl-665k 3 8102803fc, hcpl-6631 3 81028042a, hcpl-6651 3 table 3. reliability projections for single channel devices listed in title typical (60% confidence) 90% confidence ambient junction mttf fits mttf fits temperature ( c) temperature ( c) (hr/fail) (fail/10 9 hr) (hr/fail) (fail/10 9 hr)) 125 150 2,920,000 342 1,971,000 507 120 145 3,359,000 298 2,270,000 440 110 135 4,493,000 222 3,042,000 329 100 125 6,098,000 164 4,137,000 242 90 115 8,408,000 119 5,715,000 175 80 105 11,791,000 85 8,031,000 125 70 95 16,843,000 59 11,497,000 87 60 85 24,542,000 41 16,791,000 60 50 75 36,543,000 27 25,063,000 40 40 65 55,710,000 18 38,308,000 26 30 55 87,140,000 11 60,086,000 17 25 50 110,225,000 9 76,042,000 13 table 2. reliability projections for dual channel devices listed in title typical (60% confidence) 90% confidence ambient junction mttf fits mttf fits temperature ( c) temperature ( c) (hr/fail) (fail/10 9 hr) (hr/fail) (fail/10 9 hr)) 125 160 1,943,000 514 773,000 1,293 120 155 2,224,000 450 885,000 1,130 110 145 2,939,000 340 1,169,000 855 100 135 3,938,000 254 1,567,000 638 90 125 5,355,000 187 2,131,000 469 80 115 7,398,000 135 2,944,000 340 70 105 10,397,000 96 4,137,000 242 60 95 14,884,000 67 5,923,000 169 50 85 21,738,000 46 8,650,000 116 40 75 32,447,000 31 12,912,000 77 30 65 49,594,000 20 19,735,000 51 25 60 61,902,000 16 24,633,000 41
|
