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1. general description the integrated circuit pcf8883 is a capaciti ve proximity switch that uses a patented (edisen) digital method to detect a change in capacitance on a remote sensing plate. changes in the static capacitance (as op posed to dynamic capacitance changes) are automatically compensated using continuous auto-calibration. remote sensing plates (e.g. conductive foil) can be connected directly to the ic 1 or remotely using a coaxial cable. 2. features and benefits ? dynamic proximity switch ? digital processing method ? adjustable sensitivity, can be made very high ? adjustable response time ? wide input capacitance range (10 pf to 60 pf) ? automatic calibration ? a large distance (several meters) between the sensing plate and the ic is possible ? open-drain output (p-type mosfet, exte rnal load between pin and ground) ? designed for battery powered applications (i dd = 3 a, typical) ? output configurable as push -button, toggle, or pulse ? wide voltage operating range (v dd = 3 v to 9 v) ? large temperature operating range (t amb = ? 40 c to +85 c) ? internal voltage regulator ? available in soic8 (other packages ava ilable on request for larger quantities) pcf8883 capacitive proximity switch with auto-calib ration, large voltage operating range and very low power consumption rev. 2 ? 8 march 2011 product data sheet 1. the definition of the abbreviations and acronyms used in this data sheet can be found in section 16 .
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 2 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 3. applications ? proximity detection ? proximity sensing in ? mobile phones ? portable entertainment units ? switch for medical applications ? switch for use in explosive environments ? vandal proof switches ? transportation: switches in or under upholstery, leather, handles, mats, and glass ? buildings: switch in or unde r carpets, glass, or tiles ? sanitary applications: use of standard metal sanitary parts (e.g. tap) as switch ? hermetically sealed keys on a keyboard 4. ordering information 5. marking table 1. ordering information type number package name description version pcf8883t/1 soic8 plastic small outline package; 8 leads; body width 3.9 mm pcf8883 table 2. marking codes type number marking code pcf8883t/1 pcf8883
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 3 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 6. block diagram (1) 150 na. fig 1. block diagram of pcf8883 voltage- regulator counter logic oscillator v dd v dd(intregd) out type clin cpc v ss v dd(intregd) v ref in v dd(intregd) cdn cup 013aaa07 2 pcf8883 f s f s & & i sink (1)
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 4 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 7. pinning information 7.1 pinning 7.2 pin description top view. for mechanical details, see figure 16 . fig 2. pin configuration of pcf8883 (soic8) pcf8883 in v dd 013aaa073 type clin cpc out v ss v dd(intregd) 8 1 2 3 4 6 5 7 table 3. pin description symbol pin description in 1 sensor input type 2 pin out behavior configuration input cpc 3 sensitivity setting v ss 4 ground supply voltage v dd 5 supply voltage out 6 switch output clin 7 sampling rate setting v dd(intregd) 8 internal regulated supply voltage output
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 5 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 8. functional description figure 3 and figure 4 show the functional principle of the pcf8883. the discharge time (t dch ) of a chip-internal rc timing circuit, to which the external sensing plate is connected via pin in, is compared to the discharge time (t dch(ref) ) of a second chip-internal reference rc timing circuit. both rc timing circ uits are periodically charged from v dd(intregd) via identical switches and then discha rged via a resistor to ground (v ss ). both switches are synchronized. the charge-discharge cycle is governed by the sampling rate (f s ). if the voltage of one of the rc timing circuits falls below the internal reference voltage v ref , the respective comparator output will become low. the logic following th e comparators determines which comparator switches first. if the upper (reference) comparator switches then a pulse is given on cup. if the lower (input) comparator switches first then a pulse is given on cdn (see figure 3 ). the pulses control the charge on the external capacitor c cpc on pin cpc. every time a pulse is given on cup, capacitor c cpc is charged from v dd(intregd) for a fixed time causing the voltage on c cpc to rise. likewise when a pulse occurs on cdn, capacitor c cpc is connected to a current sink to ground for a fixed time causing the voltage on c cpc to fall. fig 3. functional diagram of the sensor logic 013aaa09 3 cpc v ss v dd(intregd) v ref in v dd(intregd) cdn cup f s & & i sink counter logic
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 6 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration if the capacitance on pin in increases, the discharge time t dch increases too. therefore it will take longer for the voltage on the co rresponding comparator to drop below v ref . only once this happens, the comparator output will become low and this results in a pulse on cdn discharging the external capacitor c cpc slightly. thus most pulses will now be given by cup. without furthe r action, capacitor c cpc would then fully charge. however, a chip-internal automatic calibration mechanism that is based on a voltage controlled sink current (i sink ) connected to pin in attempts to equalize the discharge time t dch with the internal reference discharge time t dch(ref) . the current source is controlled by the voltage on c cpc which causes the capacitance on pin in to be discharged more quickly in the case that the voltage on c cpc is rising, thereby compensating for the increase in capacitance on input pin in. this arrangement constitutes a closed-loop control system that constantly attemp ts to equalize the discharge time t dch with t dch(ref) . this allows compensating for slow changes in capacitance on input pin in. fast changes due to an approaching hand for example will not be compen sated. in the equilibrium state the discharge times are equ al and the pulses alte rnate between cup and cdn. from this also follows that an increase in capacitor value c cpc results in a smaller voltage change per pulse cup or cdn. thus the compensation due to internal current sink source i sink is slower and therefore the sensitivity of the sens or will increase. likewise a decrease in capacitor c cpc will result in a lower sensitivit y. (for further information see section 13 .) c sens = sensing plate capacitance. c cable = cable capacitance. r c = external discharge (pull-down) resistor. r f = low pass filter resistor. c f = low pass filter capacitor. fig 4. functional principle of the pcf8883 counter logic oscillator v dd v dd(intregd) out type clin cpc v ss in sensor logic c f sensing plate coaxial cable c sens r f r c c cable pcf8883 voltage regulator 013aaa075 f s
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 7 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration the counter, following the sensor logic depicted in figure 3 , counts the pulses of cup or cdn respectively. the counter is reset every time the pulse sequence changes from cup to cdn or vice versa. pin out will only be activated when a sufficient number of consecutive cup or cdn pulses occur. low level interference or slow changes in the input capacitance do not ca use the output to switch. various measures, such as asymmetrical c harge and discharge steps, are taken to ensure that the output switches off correctly. a special start-up circuit ensures that the device reaches equilibrium quickl y when the supply is attached. pin out is an open-drain output ca pable of pulling an external load r ext (at maximum current of 20 ma) up to v dd . the load resistor must be dimensioned appropriately, taking the maximum expected v dd voltage into account. the ou tput will be automatically deactivated (short circuit prot ection) for loads in excess of 30 ma. pin out can also drive a cmos input without connection of the external load. a small internal 150 na current sink i sink enables a full voltage swing to take place on out, even if no load resistor is connected. this is useful for driving purely capacitive cmos inputs. the falling slope can be fairly slow in this mode, depending on load capacitance. the sampling rate (f s ) corresponds to half of the frequency used in the rc timing circuit. the sampling rate can be adjusted within a specified range by selecting the value of c clin . the oscillator frequency is internally modulated by 4 % usin g a pseudo random signal. this prevents interference caused by local ac-fields. 8.1 output switching modes the output s witching behavior can be se lected using pin type (see figure 5 ) ? push-button (type connected to v ss ): the output out is active as long as the capacitive event 2 lasts. ? toggle (type connected to v dd(intregd) ): the output out is activated by the first capacitive event and deactivated by a following capacitive event. ? pulse (c type connected betw een type and v ss ): the output out is activated for a defined time at each capacitive event. th e pulse duration is determined by the value of c type and is approximately 2.5 ms/nf. a typical value for c type is 4.7 nf which results in an output pulse duration of about 10 ms. the maximum value of c type is 470 nf which results in a pulse duration of about 1 s. capacitive events are ignored that occur during the time th e output is active. figure 5 illustrates the switching behavior for the output switching modes. additionally the graph illustrates, that short term distur bances on the sensor are suppressed by the circuit. 2. a capacitive event is a dynamic increase of capacitance at the sensor input pin in.
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 8 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 8.2 voltage regulator the pcf8883 implements a chip-internal voltage regulator supplied by pin v dd that provides an internal supply (v dd(intregd) ) limited to a maximum of 4.6 v. the lock-in voltage v lockin on v dd is typically 4.0 v. the regulated supply is available at pin v dd(intregd) and can be used to supply power to external electronic components (at a maximum current of 0.5 ma). figure 6 shows the relationship between v dd and v dd(intregd) . fig 5. switching modes timing diagram of pcf8883 013aaa077 capacitance on input out (push-button) out (toggle) out (pulse) t t t t t clk(h) = c type 2 ms/nf t clk(h) = c type 2 ms/nf t clk(h) = c type 2 ms/nf fig 6. integrated voltage regulator 013aaa078 operational range of pcf8883 v dd(max) v lockin(max) v lockin(min) v dd(intregd) v dd(intregd) v dd d v dd v dd(min) v dd(max) v lockin(max) v lockin(min) v dd(min)
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 9 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 9. limiting values [1] pass level; human body model (hbm) according to ref. 6 ? jesd22-a114 ? . [2] pass level; machine model (mm), according to ref. 7 ? jesd22-a115 ? . [3] pass level; latch-up testing, according to ref. 8 ? jesd78 ? at maximum ambient temperature (t amb(max) ). [4] according to the nxp store and transport requirements (see ref. 10 ? nx3-00092 ? ) the devices have to be stored at a temperature of +8 c to +45 c and a humidity of 25 % to 75 %. for long term storage products divergent conditions are described in that document. table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage ? 0.5 +9 v v i input voltage on pi ns in, type, cpc ? 0.5 v dd(intregd) +0.5 v i o output current on pin out ? 10 +50 ma i ss ground supply current ? 10 +50 ma i i input current on any other pin ? 10 +10 ma p tot total power dissipation - 100 mw v esd electrostatic discharge voltage hbm [1] - 2000 v mm [2] - 200 v i lu latch-up current [3] - 100 ma t stg storage temperature [4] ? 60 +125 c t amb ambient temperature operating device ? 40 +85 c
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 10 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 10. static characteristics [1] alternatively an external discharge resistor r c can be used (see section 13 ). [2] idle state is the steady state after completed power-on with out any activity on the sensor plate and the voltage on the rese rvoir capacitor c cpc settled. [3] for reliability reasons the average output current must be limited to 4.6 ma at 70 c and 3.0 ma at 85 c. [4] external ceramic chip capacitor recommended (see figure 15 ). table 5. static characteristics v dd = 5 v, t amb = +25 c; unless otherwise specified. symbol parameter conditions min typ max unit v dd supply voltage 10 pf c i 40 pf; ? 40 c t amb +85 c [1] 3.0 - 9.0 v 10 pf c i 35 pf; ? 20 c t amb +85 c 2.8 - 9.0 v v lockin lock-in voltage no external load - 4.0 - v v dd(intregd) internal regulated supply voltage v dd >v lockin 3.0 4.0 4.6 v v dd(intregd) internal regulated supply voltage variation v dd < v lockin -1050 mv i dd supply current idle state; f s = 1 khz [2] v dd =5.0v - 3 5 a v dd =3.0v - 2.2 3.5 a i sink sink current internal constant current to v ss - 150 - na v o output voltage on pin out; pull-up voltage 0 v dd 9.0 v i o output current p-mos [3] 01020 ma short circuit protection v o 0.6 v 20 30 50 ma v sat saturation voltage on pin out; i o = +10 ma v dd = 5.0 v 0.1 0.2 0.4 v v dd = 3.0 v 0.1 0.3 0.5 v c dec decoupling capacitance on pin v dd(intregd) [4] 100 - 220 nf v i(cpc) input voltage on pin cpc 0.6 - v dd(intregd) ? 0.3 v
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 11 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 11. dynamic characteristics table 6. dynamic characteristics v dd = 5 v, c clin = 22 pf, c cpc = 470 nf, t amb = +25 c; unless otherwise specified. symbol parameter conditions min typ max unit c clin capacitance on pin clin 0 22 100 pf c cpc capacitance on pin cpc x7r ceramic chip capacitor 90 470 2500 nf n res(dig)eq equivalent digital resolution - 14 - bit c type capacitance on pin type 0.1 - 470 nf c i input capacitance sensing plate and connecting cable v dd = 5.0 v 10 - 60 pf t amb = ? 40 cto+85 c; v dd =3.0v 10 - 40 pf r dson drain-source on-state resistance internal pull-up on input - - 500 t ch charge time per sample 1.4 2.5 3.5 s t dch discharge time per sample - 1.0 - s t startup start-up time until normal operation is established - 0.5 - s t p pulse duration on pin out; in pulse mode; c type 10 nf -2.5-ms/nf f s sampling frequency c clin = 0 pf -3.3-khz c clin = 22 pf (typical value) - 1 - khz c clin = 100 pf - 275 - hz t sw switching time at f s = 1 khz - 64 - ms
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 12 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 12. character istic curves 12.1 power consumption idle state; f s =1khz; t amb =25 c. fig 7. i dd with respect to v dd idle state; f s =1khz. fig 8. i dd with respect to temperature v dd (v) 210 8 46 001aak839 2.5 3.0 3.5 i dd ( a) 2.0 001aak840 temperature ( c) ? 50 100 50 0 2.5 3.0 2.0 3.5 4.0 i dd ( a) 1.5 v dd = 9 v v dd = 3 v
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 13 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 12.2 typical reaction time idle state; v dd =6v; t amb =25 c. fig 9. i dd with respect to sa mpling frequency (f s ) 001aak841 f s (hz) 250 1750 1250 750 2.5 3.0 2.0 3.5 4.0 i dd ( a) 1.5 v dd =6v; t amb =25 c. fig 10. switching time (t sw ) with respect to sampling frequency (f s ) f s (hz) 0 2000 1500 500 1000 001aak842 100 200 300 t sw (ms) 0
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 14 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration v dd =6v; t amb =25 c. fig 11. switching time (t sw ) with respect to cap acitor on pin clin (c clin ) v dd =6v. fig 12. switching time (t sw ) with respect to temperature 001aak843 c clin (pf) 0 120 80 40 100 150 50 200 250 t sw (ms) 0 001aak844 temperature ( c) ? 50 100 50 0 60 65 55 70 75 t sw (ms) 50
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 15 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 12.3 reservoir capacitor voltage v dd =6v; t amb =25 c. v i(cpc) = input voltage on pin cpc. c in = capacitor on pin in. fig 13. input voltage on pin cpc (v i(cpc) ) with respect to capacitor on pin in (c in ) v dd =6v. v i(cpc) = input voltage on pin cpc. fig 14. input voltage on pin cpc (v i(cpc) ) with respect to temperature c in (pf) 060 40 20 001aak845 1 2 3 v i(cpc) (v) 0 001aak846 temperature (c) -50 100 50 0 2.5 3.0 3.5 v i(cpc) (v) 2.0 c in = 37 pf c in = 60.8 pf
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 16 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 13. application information figure 15 shows the typical connections for a general application 3 . the positive supply is connected to pin v dd . it is recommended to connect smoothing capacitors to ground to both v dd and v dd(intregd) (values for c dec , see table 5 ). the sampling rate is determined by the capacitance c clin on pin clin. a higher sampling rate reduces the reaction time and increases the current consumption. the sensing plate capacitance c sens may consist of a small metal area, for example behind an isolating layer. the sensing pl ate can be connected to a coaxial cable (c cable ) which in turn is connected to the input pin in. alternativel y, the sensing plate can be directly connected to the input pin in. an internal low pass f ilter is used to reduce rf interference. an additional low pass filter consisting of a resistor r f and capacitor c f can be added to the input to further improve rf immunity as required. for good performance, the total amount of capacitance on the input (c sens +c cable +c f ) should be in the proper range, the optimum point being around 30 pf. these conditions allow the control loop to adapt to the static capacitance on c sens and to compensate for slow changes in the sensing plate capacitance. a higher capaciti ve input loading is po ssible provided that an additional discharge resistor r c is placed as shown in figure 15 . resistor r c simply reduces the discharge time such that the internal timing requirements are fulfilled. the sensitivity of the sensor can be influenc ed by the sensing plate area and capacitor c cpc . the sensitivity is sign ificantly reduced when c cpc is reduced. when maximum sensitivity is desired c cpc can be increased, but this also increases sensitivity to 3. for further information see ref. 2 ? an10832 ? . information about the appropriate evaluation board can be found in ref. 11 ? um10370 ? . c sens = sensing plate capacitance. the coaxial cable is optional. fig 15. typical application v dd v dd(intregd) out type clin v ss in c f c sens r f r c pcf8883 v dd(intregd) push- button pulse toggle cpc 013aaa079 coaxial cable sensing plate
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 17 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration interference. pin cpc has a high-impedance and is sensitive to leakage currents. therefore c cpc should be a high quality foil or ceramic capacitor, for example an x7r type. when limiting the maximum input capacit ance to 35 pf and the minimum operating temperature to ? 20 c then the minimum operating voltage can be reduced to 2.8 v. the main limitation when lowering the supply voltage is a reduction in the range of the v i(cpc) voltage, which is specified from 0.6 v to v dd ? 0.3 v. reducing the v i(cpc) working range is equivalent to reducing the input capacitance range. additionally, v i(cpc) increases with decreasing temperature, as illustrated in figure 13 and figure 14 . this means that it is possible to lower the supply vo ltage if the minimum temperature will be ra ised accordingly. for the choice of proper component values for a given application, the component specifications in ta b l e 5 and ta b l e 6 must be followed.
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 18 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 14. package outline fig 16. package outline of pcf8883 (soic8) references outline version european projection issue date iec jedec jeita pcf8883 ms-012-aa pcf8883_po 09-06-03 unit mm max nom min 1.73 1.37 0.25 0.10 0.25 0.49 0.36 0.249 0.190 5.0 4.8 1.27 6.2 5.8 0.86 0.41 0.1 0.7 0.3 a dimensions note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. s oic8: plastic small outline package; 8 leads; body width 3.9 mm pcf888 3 a 1 a 2 1.48 1.27 a 3 b p cd (1) 8 0 e (2) 3.99 3.82 eh e l 1.05 l p v 0.25 w 0.25 inches max nom min 0.068 0.054 0.0098 0.0040 0.01 0.019 0.014 0.0098 0.0075 0.196 0.189 0.05 0.244 0.229 0.034 0.016 0.004 0.028 0.012 0.0582 0.0500 8 0 0.157 0.150 0.041 0.01 0.01 yz (1) 0 2.5 5 mm scale a x va e h e c y d detail x a 1 l p (a 3 ) a 2 l a b p e pin 1 index w z 85 4 1
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 19 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 15. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 15.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering fig 17. three dimensional package drawing of pcf8883 (soic8)
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 20 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 15.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities 15.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 18 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 7 and 8 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 18 . table 7. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 8. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 21 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 16. abbreviations msl: moisture sensitivity level fig 18. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 9. abbreviations acronym description cmos complementary metal oxide semiconductor hbm human body model ic integrated circuit mm machine model mos metal oxide semiconductor mosfet metal?oxide?semiconduct or field-effect transistor msl moisture sensitivity level pcb printed-circuit board rc resistance-capacitance rf radio frequency smd surface mount device
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 22 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 17. references [1] an10365 ? surface mount reflow soldering description [2] an10832 ? pcf8883 - capacitive proximity switch with auto-calibration [3] iec 60134 ? rating systems for electronic tu bes and valves and analogous semiconductor devices [4] iec 61340-5 ? protection of electronic devices from electrostatic phenomena [5] ipc/jedec j-std-020d ? moisture/reflow sensitiv ity classification for nonhermetic solid state surface mount devices [6] jesd22-a114 ? electrostatic discharge (esd) sensitivity testing human body model (hbm) [7] jesd22-a115 ? electrostatic discharge (esd) se nsitivity testing machine model (mm) [8] jesd78 ? ic latch-up test [9] jesd625-a ? requirements for handling elec trostatic-discharge-sensitive (esds) devices [10] nx3-00092 ? nxp store and transport requirements [11] um10370 ? pcf8883 evaluation board 18. revision history table 10. revision history document id release date data sheet status change notice supersedes pcf8883 v.2 20110308 product data sheet - pcf8883_1 modifications: ? added low voltage specification ? deleted i li value in ta b l e 5 pcf8883_1 20091016 product data sheet - -
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 23 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 19.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 19.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
pcf8883 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 march 2011 24 of 25 nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 19.4 licenses 19.5 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. i 2 c-bus ? logo is a trademark of nxp b.v. 20. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com ics with capacitive sensing functionality this nxp semiconductors ic is ma de under license to european patent no. 0723339, owned by edisen - sensor systeme gmbh & co kg and counterparts. any license fee is included in the purchase price.
nxp semiconductors pcf8883 capacitive proximity swit ch with auto-calibration ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 8 march 2011 document identifier: pcf8883 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 output switching modes . . . . . . . . . . . . . . . . . . 7 8.2 voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 8 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 static characteristics. . . . . . . . . . . . . . . . . . . . 10 11 dynamic characteristics . . . . . . . . . . . . . . . . . 11 12 characteristic curves . . . . . . . . . . . . . . . . . . . 12 12.1 power consumption . . . . . . . . . . . . . . . . . . . . 12 12.2 typical reaction time . . . . . . . . . . . . . . . . . . . . 13 12.3 reservoir capacitor voltage . . . . . . . . . . . . . . 15 13 application information. . . . . . . . . . . . . . . . . . 16 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 15 soldering of smd packages . . . . . . . . . . . . . . 19 15.1 introduction to soldering . . . . . . . . . . . . . . . . . 19 15.2 wave and reflow soldering . . . . . . . . . . . . . . . 19 15.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20 15.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20 16 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 17 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 23 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 19.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 19.4 licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 19.5 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 20 contact information. . . . . . . . . . . . . . . . . . . . . 24 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

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