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3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification part no. : MT1064S15-Y-A 4.8mm round lamp with holder and wire observe precaution for handling electro static sensitive devices attention
MT1064S15-Y-A 4.8mm round lamp with holder and wire ver.: 01 date : 2007/10/08 page: 1 /6 package dimensions 11.3 1.0 140.02 3.50.5 0.7 tin plating 4.8 7.0 6.0 2.420.5 black wire cathode red wire anode 4.0 notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted 3. the color of holder: black. 4.the specification of wire:#1015 28awg description led chip part no. material emitting color lens color MT1064S15-Y-A gaasp/gap yellow yellow diffused
MT1064S15-Y-A 4.8mm round lamp with holder and wire ver.: 01 date : 2007/10/08 page: 2 /6 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 240 mw reverse voltage v r 5 v d.c. forward current if 30 ma peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -40 to +100
storage temperature range tstg. -40 to +100
soldering temperature (1.6mm from body) tsld. dip soldering: 260
gpstfd hand soldering: 350
gpstfd electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 4.29 7.2 mcd forward voltage vf if=20ma 18.1 18.6 v peak wavelength a viewing angle 21/2 if=20ma 38 deg spectrum line halfwidth ?
MT1064S15-Y-A 4.8mm round lamp with holder and wire ver.: 01 date : 2007/10/08 page: 3 /6 typical electrical/optical characteristic curves (25
ambient temperature un less otherwise noted) 24 forward voltage (v) forward current vs.applied voltage 20 16 28 32 forward current if(ma) 10 20 40 30 50 12 20.0 forward current (ma) forward current vs. luminous intensity relative luminous intensity 10.0 0 2.0 4.0 8.0 6.0 10.0 30.0 0.0 temperature( f c) forward current vs. ambient temperature 0 204060 100 80 forward current if(ma) 10 20 40 30 50 radiation pattern 1.0 0.7 0.8 0.9 0.1 0.5 0.3 0.2 0.4 0.6 90 70 80 50 60 20 0 10 30 40
MT1064S15-Y-A 4.8mm round lamp with holder and wire ver.: 01 date : 2007/10/08 page: 4 /6 specifications for bin grading: v(mcd) bin min. max. a 3.5 5.0 b 5.0 7.0 c 7.0 9.8 d 9.8 13.7 specifications for vf group: vf(v) bin min. max. va 17.4 17.6 vb 17.6 17.8 vc 18.0 18.2 vd 18.4 18.6 specifications for wavelength group: wld(nm) bin min. max. x1 581 584 x2 584 587 x3 587 590 x4 590 593
MT1064S15-Y-A 4.8mm round lamp with holder and wire ver.: 01 date : 2007/10/08 page: 5 /6 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering: pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) hand soldering : 350
max. (temperature of solderin g iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

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