pin diodes reliability data description for applications requiring component reliability estimation, hewlett-packard provides reliability data for all families of devices. data is initially compiled from reliability tests run prior to market introduction to demon- strate that a product meets design criteria. additional tests are run periodically. the data on this sheet represents the latest review of accumulated test results. 1n5767 5082-3080 5082-3188 applications this information represents the capabilities of the generic device. failure rates and mttf values presented here are achievable with normal mil-s-19500 tx level screening. this reliability screen- ing is no longer available from hewlett-packard. the screening tests, references, conditions, lot sizes, and ltpd are provided as references only. 400 junction temperature, t j ( c) mean time to failure, mttf (hrs) mean time to failure vs. junction temperature 350 300 250 200 150 100 50 25 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 e a = 1.3 ev
for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1997 hewlett-packard co. obsoletes 5965-8891e printed in u.s.a. 5966-0946e (9/97) burn-in and storage ltpd/ test test conditions 1000 hours high temperature life 1,000 hrs. min. storage time @ 150 c3 steady state operating life 1,000 hrs. min. operating time @ p fm = 250 mw, 3 v rm = 20 v, f = 60 hz, t a = 25 c environmental test mil-std-750 tests conditions ltpd solderability 2026 sn 95, pb 5, solder at 260 c10 temperature cycling 1051 100 cycles from -65 c to +150 c, 0.5 hrs. at 7 extremes, 5 min. transfer. thermal shock 1056 5 cycles from 0 c to +100 c, 3 sec. transfer 7 moisture resistance 1021 10 days, 90-98% rh, -10 to +65 c, non operating 7 shock 2026 5 blows each x 1 , y 1 , y 2 , 1500 g. 0.5 msec pulse 7 vibration fatigue 2046 32 8 hrs., each x, y, z, 96 hr. total, 7 60 hz, 20 g min. vibration variable 2056 4, 4 minute cycles each x, y, z at 20 g min. 7 frequency 100 to 2000 hz constant acceleration 2006 1 minute each x 1 , y 1 , y 2 , at 20,000 g 7 terminal strength 2036 miniature glass package, -3, 90 arcs, 2 leads, 7 8 oz., lead restriction salt atmosphere 1041 35 fog for 24 hours 7 dod-hdbk-1686 esd classification: in5767 class ii 5082-3080 class ii 5082-3188 class i
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