View EDS1232AABB-60L_2247839.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

document no. e0205e30 (ver. 3.0) date published april 2002 (k) japan url: http:// www.elpida.com ? elpida memory, inc. 2001-2002 data sheet 128m bits sdram eds1232aabb, eds1232aata (4m words 32 bits) description the eds1232aa is a 128m bits sdram organized as 1,048,576 words 32 bits 4 banks. all inputs and outputs are synchronized with the positive edge of the clock. they are packaged in 90-ball fbga, 86-pin plastic tsop (ii). features ? 3.3v power supply ? clock frequency: 166mhz (max.) ? single pulsed /ras ? 32 organization ? 4 banks can operate simultaneously and independently ? burst read/write operation and burst read/single write operation capability ? programmable burst length (bl): 1, 2, 4, 8 and full page ? 2 variations of burst sequence ? sequential (bl = 1, 2, 4, 8) ? interleave (bl = 1, 2, 4, 8) ? programmable /cas latency (cl): 2, 3 ? byte control by dqm ? refresh cycles: 4096 refresh cycles/64ms ? 2 variations of refresh ? auto refresh ? self refresh
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 2 ordering information part number supply voltage organization (words bits) internal banks clock frequency mhz (max.) /cas latency package eds1232aabb-60 3.3v 4m 32 4 166 133 3 2 90-ball fbga eds1232aabb-75 133 100 3 2 EDS1232AABB-60L 166 133 3 2 eds1232aabb-75l 133 100 3 2 eds1232aata-60 3.3v 4m 32 4 166 133 3 2 86-pin plastic tsop (ii) eds1232aata-75 133 100 3 2 eds1232aata-60l 166 133 3 2 eds1232aata-75l 133 100 3 2 part number elpida memory density & bank 12: 128m/4 banks bit organization 32: x32 interface a: 3.3v, lvttl mask revision package ta: tsop (ii) bb: fbga speed 60: 166mhz/cl3 133mhz/cl2 75: 133mhz/cl3 100mhz/cl2 power consumption blank: normal l: low power function s: sdram material type d: monolithic device e d s 12 32 a a ta - 60 l
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 3 pin configurations /xxx indicate active low si gnal. dq26 1 a b c d e f g h j k l m n p r 23456789 dq28 vssq vssq vddq vss a4 a7 clk dq24 vddq dq27 dq29 dq31 dqm3 a5 a8 cke vss vssq dq25 dq30 nc a3 a6 nc a9 vdd vddq dq22 dq17 nc a2 a10 nc ba0 dq23 vssq dq20 dq18 dq16 dqm2 a0 ba1 /cs dq21 dq19 vddq vddq vssq vdd a1 a11 /ras (top view) (top view) dqm1 nc nc /cas /we dqm0 vddq dq8 vss vdd dq7 vssq vssq dq10 dq9 dq6 dq5 vddq vssq dq12 dq14 dq1 dq3 vddq dq11 vddq vssq vddq vssq dq4 dq13 dq15 vss vdd dq0 dq2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 v ss dq15 vssq dq14 dq13 vddq dq12 dq11 vssq dq10 dq9 vddq dq8 nc vss dqm1 nc nc clk cke a9 a8 a7 a6 a5 a4 a3 dqm3 vss nc dq31 vddq dq30 dq29 vssq dq28 dq27 vddq dq26 dq25 vssq dq24 vss vdd dq0 vddq dq1 dq2 vssq dq3 dq4 vddq dq5 dq6 vssq dq7 nc vdd dqm0 /we /cas /ras /cs a11 ba0 ba1 a10(ap) a0 a1 a2 dqm2 vdd nc dq16 vssq dq17 dq18 vddq dq19 dq20 vssq dq21 dq22 vddq dq23 vdd 86-pin tsop 90-ball fbga pin name function a0 to a11 address inputs ba0, ba1 bank select dq0 to dq31 data input/output clk clock input cke clock enable /cs chip select /ras row address strobe /cas column address strobe /we write enable dqm0 to dqm3 dq mask enable vdd supply voltage vss ground vddq supply voltage for dq vssq ground for dq nc no connection
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 4 contents description .................................................................................................................... ................................ 1 features ....................................................................................................................... ................................. 1 ordering information ........................................................................................................... .......................... 2 part number .................................................................................................................... .............................. 2 pin configurations ............................................................................................................. ............................ 3 electrical specifications...................................................................................................... ........................... 5 block diagram .................................................................................................................. ........................... 10 pin function ................................................................................................................... ............................. 11 command operation .............................................................................................................. ..................... 12 truth table .................................................................................................................... .............................. 16 simplified state diagram....................................................................................................... ...................... 22 programming mode registers ..................................................................................................... ............... 23 mode register .................................................................................................................. ........................... 24 power-up sequence .............................................................................................................. ...................... 27 operation of the sdram ......................................................................................................... ................... 28 timing waveforms ............................................................................................................... ....................... 44 package drawing ................................................................................................................ ........................ 51 recommended soldering conditions............................................................................................... ........... 53 revision history ............................................................................................................... ........................... 56
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 5 electrical specifications ? all voltages are referenced to vss (gnd). ? after power up, wait more than 100 s and then, execute power on sequence and cbr (auto) refresh before proper device operation is achieved. absolute maximum ratings parameter symbol rating unit note voltage on any pin relative to vss vt C0.5 to +4.6 v supply voltage relative to vss vdd, vddq C0.5 to +4.6 v short circuit output current ios 50 ma power dissipation pd 1.0 w operating ambient temperature ta 0 to +70 c storage temperature tstg C55 to +125 c caution exposing the device to stress above those listed in absolute maximum ratings could cause permanent damage. the device is not meant to be operated under conditions outside the limits described in the operational section of this specification. exposure to absolute maximum rating conditions for extended periods may affect device reliability. recommended operating conditions (ta = 0 to +70 c) parameter symbol min. typ. max. unit notes supply voltage vdd, vddq 3.0 3.3 3.6 v vss 0 0 0 v input high voltage vih 2.0 ? vdd + 0.3* 1 v input low voltage vil C0.3* 2 ? 0.8 v notes: 1. vih (max.) = vddq + 1.5v (pulse width 5ns). 2. vil (min.) = C1.5v (pulse width 5ns).
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 6 dc characteristics (ta = 0 to +70 c, vdd, vddq = 3.3v 0.3v, vss, vssq = 0v) parameter /cas latency symbol grade max. unit test condition notes operating current (cl = 2) idd1 135 ma 1 (cl = 3) idd1 135 ma burst length = 1 trc trc (min.) io = 0ma one bank active standby current in power down idd2p 1 ma standby current in power down (input signal stable) idd2ps 1 ma cke vil (max.) tck = 15ns cke vil (max.) tck = standby current in non power down idd2n 20 ma cke vih (min.) tck = 15ns cs vih (min.) input signals are changed one time during 30ns standby current in non power down (input signal stable) idd2ns 8 ma cke vih (min.) tck = active standby current in power down idd3p 5 ma cke vil (max.) tck = 15ns active standby current in power down (input signal stable) idd3ps 4 ma cke vil (max.), tck = active standby current in non power down idd3n 45 ma cke vih (min.), tck = 15 ns, /cs vih (min.), input signals are changed one time during 30ns. active standby current in non power down (input signal stable) idd3ns 28 ma cke vih (min.), tck = , burst operating current idd4 -60 -75 200 180 ma tck tck (min.), io = 0ma, all banks active 2 refresh current idd5 280 ma trc trc (min.) 3 self refresh current idd6 2.0 ma vih vdd ? 0.2v, vil gnd + 0.2v self refresh current (l-version) idd6 -xxl 0.6 ma notes: 1. idd1 depends on output loading and cycle rates. specified values are obtained with the output open. in addition to this, idd1 is measured condition that addresses are changed only one time during tck (min.). 2. idd4 depends on output loading and cycle rates. specified values are obtained with the output open. in addition to this, idd4 is measured condition that addresses are changed only one time during tck (min.). 3. idd5 is measured on condition that addresses are changed only one time during tck (min.). dc characteristics 2 (ta = 0 to +70 c, vdd, vddq = 3.3v 0.3v, vss, vssq = 0v) parameter symbol min. max. unit test condition notes input leakage current ili C1.0 1.0 a 0 = vin = vddq, vddq = vdd, all other pins not under test = 0v output leakage current ilo C1.5 1.5 a 0 = vin = vddq dout is disabled output high voltage voh 2.4 v ioh = C2 ma output low voltage vol 0.4 v iol = 2 ma
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 7 pin capacitance (ta = 25c, f = 1mhz) 90-ball fbga 86-pin tsop (ii) parameter symbol pins min. typ max. min. typ max. unit notes input capacitance ci1 address 1.5 3.0 2.5 4.0 pf ci2 clk, cke, /cs, /ras, /cas, /we, dqm 1.5 3.0 2.5 4.0 pf data input/output capacitance ci/o dq 3.0 5.5 4.0 6.5 pf ac characteristics (ta = 0 to +70 c, vdd, vddq = 3.3v 0.3v, vss, vssq = 0v) -60 -75 parameter symbol min. max. min. max. unit notes system clock cycle time (cl = 2) tck 7.5 10 ns (cl = 3) tck 6 7.5 ns clk high pulse width tch 2.5 2.5 ns clk low pulse width tcl 2.5 2.5 ns access time from clk tac 5.4 5.4 ns data-out hold time toh 2 2 ns clk to data-out low impedance tlz 0 0 ns clk to data-out high impedance thz 2 5.4 2 5.4 ns input setup time tsi 1.5 1.5 ns input hold time thi 0.8 0.8 ns cke setup time (power down exit) tcksp 1.5 1.5 ns act to ref/act command period (operation) trc 60 ? 67.5 ? ns (refresh) trc 60 ? 67.5 ? ns active to precharge command period tras 42 120000 45 120000 ns active command to column command (same bank) trcd 15 ? 20 ? ns precharge to active command period trp 15 ? 20 ? ns write recovery or data-in to precharge lead time tdpl 12 ? 15 ? ns last data into active latency tdal 2clk + 15ns ? 2clk + 20ns ? active (a) to active (b) command period trrd 12 ? 15 ? ns mode register set cycle time trsc 2 ? 2 ? clk transition time (rise and fall) tt 0.5 30 0.5 30 ns refresh period (4096 refresh cycles) tref 64 64 ms
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 8 test conditions ? ac high level input voltage / low level input voltage: 2.4v / 0.4v ? input timing measurement reference level: 1.4v ? transition time (input rise and fall time): 1ns ? output timing measurement reference level: 1.4v ? termination voltage (vtt): 1.4v w[ w w] 4s6 zs6 gs6 w][ 4s6 zs6 gs6 z + ]C =w output z = 50 ? vtt 30pf 50 ? input waveforms and output load
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 9 relationship between frequency and minimum latency parameter -60 -75 frequency (mhz) 166 133 133 100 tck (ns) symbol 6 7.5 7.5 10 notes active command to column command (same bank) lrcd 3 2 3 2 1 active command to active command (same bank) lrc 10 8 9 7 1 active command to precharge command (same bank) lras 7 6 6 5 1 precharge command to active command (same bank) lrp 3 2 3 2 1 write recovery or data-in to precharge command (same bank) ldpl 2 2 2 2 1 active command to active command (different bank) lrrd 2 2 2 2 1 self refresh exit time lsrex 1 1 1 1 2 last data in to active command (auto precharge, same bank) ldal 5 4 5 4 = [ldpl + lrp] self refresh exit to command input lsec 10 8 9 7 = [lrc] 3 precharge command to high impedance (cl = 2) lhzp ? 2 ? 2 (cl = 3) lhzp 3 3 3 3 last data out to active command (auto precharge) (same bank) lapr 1 1 1 1 last data out to precharge (early precharge) (cl = 2) lep ? C1 ? C1 (cl = 3) lep C2 C2 C2 C2 column command to column command lccd 1 1 1 1 write command to data in latency lwcd 0 0 0 0 dqm to data in ldid 0 0 0 0 dqm to data out ldod 2 2 2 2 cke to clk disable lcle 1 1 1 1 register set to active command lmrd 2 2 2 2 /cs to command disable lcdd 0 0 0 0 power down exit to command input lpec 1 1 1 1 notes: 1. ircd to irrd are recommended value. 2. be valid [desl] or [nop] at next command of self refresh exit. 3. except [desl] and [nop]
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 10 block diagram w ; " wjC wj] " = q jjjjjjw " w w = q jjjjjjw q w Cjwjw ]jw zjwj q C C; w][ w[+ = 8w 8"= 8w= 8+ qj7 qj4 qjz j= wjCjw ]jw qjg "jC
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 11 pin function clk (input pin) clk is the master clock input. other inputs signals are referenced to the clk rising edge. cke (input pins) cke determine validity of the next clk (clock). if cke is high, the next clk rising edge is valid; otherwise it is invalid. if the clk rising edge is invalid, the internal clock is not issued and the synchronous dram suspends operation. when the synchronous dram is not in burst mode and cke is negated, the device enters power down mode. during power down mode, cke must remain low. /cs (input pins) /cs low starts the command input cycle. when /cs is high, commands are ignored but operations continue. /ras, /cas, and /we (input pins) /ras, /cas and /we have the same symbols on conventional dram but different functions. for details, refer to the command table. a0 to a11 (input pins) row address is determined by a0 to a11 at the clk (clock) rising edge in the active command cycle. column address is determined by a0 to 7 at the clk rising edge in the read or write command cycle. a10 defines the precharge mode. when a10 is high in the precharge command cycle, all banks are precharged; when a10 is low, only the bank selected by ba0 and ba1 is precharged. when a10 is high in read or write command cycle, the precharge starts automatically after the burst access. ba0 and ba1 (input pin) ba0 and ba1 are bank select signal. (see bank select signal table) [bank select signal table] ba0 ba1 bank 0 l l bank 1 h l bank 2 l h bank 3 h h remark: h: vih. l: vil. : vih or vil dqm (input pins) dqm controls i/o buffers. dqm0 controls dq0 to 7, dqm1 controls dq8 to dq15, dqm2 controls dq16 to dq23, dqm3 controls dq24 to dq31. in read mode, dqm controls the output buffers like a conventional /oe pin. dqm high and dqm low turn the output buffers off and on, respectively. the dqm latency for the read is two clocks. in write mode, dqm controls the word mask. input data is written to the memory cell if dqm is low but not if dqm is high. the dqm latency for the write is zero. dq0 to dq31 (input/output pins) dq pins have the same function as i/o pins on a conventional dram. vdd, vss, vddq, vssq (power supply) vdd and vss are power supply pins for internal circuits. vddq and vssq are power supply pins for the output buffers.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 12 command operation mode register set command (/cs, /ras, /cas, /we) the synchronous dram has a mode register that defines how the device operates. in this command, a0 through a11 are the data input pins. after power on, the mode register set command must be executed to initialize the device. the mode register can be set only when all banks are in idle state. during 2clk (trsc) following this command, the synchronous dram cannot accept any other commands. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, mode register set command activate command (/cs, /ras = low, /cas, /we = high) the synchronous dram has four banks, each with 8,192 rows. this command activates the bank selected by ba0 and ba1 and a row address selected by a0 through a11. this command corresponds to a conventional dram's /ras falling. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z " " yqj, row address strobe and bank activate command
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 13 precharge command (/cs, /ras, /we = low, /cas = high) this command begins precharge operation of the bank selected by ba0 and ba1. when a10 is high, all banks are precharged, regardless of ba0 and ba1. when a10 is low, only the bank selected by ba0 and ba1 is precharged. after this command, the synchronous dram cant accept the activate command to the precharging bank during trp (precharge to activate command period). this command corresponds to a conventional drams /ras rising. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, yj, precharge command write command (/cs, /cas, /we = low, /ras = high) if the mode register is in the burst write mode, this command sets the burst start address given by the column address to begin the burst write operation. the first write data in burst mode can input with this command with subsequent data on following clocks. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, ws column address and write command
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 14 read command (/cs, /cas = low, /ras, /we = high) read data is available after /cas latency requirements have been met. this command sets the burst start address given by the column address. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, ws column address and and read command cbr (auto) refresh command (/cs, /ras, /cas = low, /we, cke = high) this command is a request to begin the cbr (auto) refresh operation. the refresh address is generated internally. before executing cbr (auto) refresh, all banks must be precharged. after this cycle, all banks will be in the idle (precharged) state and ready for a row activate command. during trc period (from refresh command to refresh or activate command), the synchronous dram cannot accept any other command = =zg q=g-jq=z 8+ 8w= 8"= 8w w[+ w][ yqj, cbr (auto) refresh command
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 15 self refresh entry command (/cs, /ras, /cas, cke = low, /we = high) after the command execution, self refresh operation continues while cke remains low. when cke goes high, the synchronous dram exits the self refresh mode. during self refresh mode, refresh interval and refresh operation are performed internally, so there is no need for external control. before executing self refresh, all banks must be precharged. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, self refresh entry command burst stop command (/cs = /we = low, /ras, /cas = high) this command can stop the current burst operation. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, burst stop command in full page mode no operation (/cs = low, /ras, /cas, /we = high) this command is not an execution command. no operations begin or terminate by this command. 8+ 8w= 8"= 8w w[+ w][ = =zg q=g-jq=z yqj, no operation
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 16 truth table command truth table cke ba0, a9 - a0, function symbol n C 1 n /cs /ras /cas /we ba1 a10 a11 device deselect desl h h no operation nop h l h h h burst stop bst h l h h l read read h l h l h v l v read with auto precharge reada h l h l h v h v write writ h l h l l v l v write with auto precharge writa h l h l l v h v bank activate act h l l h h v v v precharge select bank pre h l l h l v l precharge all banks pall h l l h l h mode register set mrs h l l l l l l v remark: h: vih. l: vil. : vih or vil, v = valid data dqm truth table cke dqm function symbol n C 1 n 0 1 2 3 data write / output enable enb h l l l l data mask / output disable mask h h h h h dq0 to dq7 write enable/output enable enb0 h l dq8 to dq15 write enable/output enable enb1 h l dq16 to dq23 write enable/output enable enb2 h l dq24 to dq31 write enable/output enable enb3 h l dq0 to dq7 write inhibit/output disable mask0 h h dq8 to dq15 write inhibit/output disable mask 1 h h dq16 to dq23 write inhibit/output disable mask 2 h h dq24 to dq31 write inhibit/output disable mask 3 h h remark: h: vih. l: vil. : vih or vil
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 17 cke truth table cke current state function symbol n C 1 n /cs /ras /cas /we address activating clock suspend mode entry h l any clock suspend mode l l clock suspend clock suspend mode exit l h idle cbr (auto) refresh command ref h h l l l h idle self refresh entry self h l l l l h self refresh self refresh exit l h l h h h l h h idle power down entry h l l h h h h l h power down power down exit l h h l h l h h h remark: h: vih. l: vil. : vih or vil
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 18 function truth table* 1 current state /cs /ras /cas /we address command operation notes idle h desl nop or power down 2 l h h nop or bst nop or power down 2 l h l h ba, ca, a10 read/reada illegal 3 l h l l ba, ca, a10 writ/ writa illegal 3 l l h h ba, ra act row activating l l h l ba, a10 pre/pall nop l l l h ref/self cbr (auto) refresh or self refresh 4 l l l l opcode mrs mode register accessing row active h desl nop l h h nop or bst nop l h l h ba, ca, a10 read/reada begin read: determine ap 5 l h l l ba, ca, a10 writ/ writa begin write: determine ap 5 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall precharge 6 l l l h ref/self illegal l l l l opcode mrs illegal read h desl continue burst to end row active l h h h nop continue burst to end row active l h h l bst burst stop row active l h l h ba, ca, a10 read/reada terminate burst, new read: determine ap 7 l h l l ba, ca, a10 writ/writa terminate burst, begin write: determine ap 7, 8 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall terminate burst, precharging l l l h ref/self illegal l l l l opcode mrs illegal write h desl continue burst to end write recovering l h h h nop continue burst to end write recovering l h h l bst burst stop row active l h l h ba, ca, a10 read/reada terminate burst, start read : determine ap 7, 8 l h l l ba, ca, a10 writ/writa terminate burst, new write : determine ap 7 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall terminate burst, precharging 9 l l l h ref/self illegal l l l l opcode mrs illegal
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 19 current state /cs /ras /cas /we address command operation notes read with auto h desl continue burst to end precharging precharge l h h h nop continue burst to end precharging l h h l bst illegal l h l h ba, ca, a10 read/reada illegal 3 l h l l ba, ca, a10 writ/ writa illegal 3 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall illegal 3 l l l h ref/self illegal l l l l opcode mrs illegal write with auto precharge h desl continue burst to end write recovering with auto precharge l h h h nop continue burst to end write recovering with auto precharge l h h l bst illegal l h l h ba, ca, a10 read/reada illegal 3 l h l l ba, ca, a10 writ/ writa illegal 3 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall illegal 3 l l l h ref/self illegal l l l l opcode mrs illegal precharging h desl nop enter idle after trp l h h h nop nop enter idle after trp l h h l bst illegal l h l h ba, ca, a10 read/reada illegal 3 l h l l ba, ca, a10 writ/writa illegal 3 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall nop enter idle after trp l l l h ref/self illegal l l l l opcode mrs illegal row activating h desl nop enter bank active after trcd l h h h nop nop enter bank active after trcd l h h l bst illegal l h l h ba, ca, a10 read/reada illegal 3 l h l l ba, ca, a10 writ/writa illegal 3 l l h h ba, ra act illegal 3, 10 l l h l ba, a10 pre/pall illegal 3 l l l h ref/self illegal l l l l opcode mrs illegal
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 20 current state /cs /ras /cas /we address command operation notes write recovering h desl nop enter row active after tdpl l h h h nop nop enter row active after tdpl l h h l bst nop enter row active after tdpl l h l h ba, ca, a10 read/reada start read, determine ap 8 l h l l ba, ca, a10 writ/ writa new write, determine ap l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall illegal 3 l l l h ref/self illegal l l l l opcode mrs illegal write recovering h desl nop enter precharge after tdpl with auto l h h h nop nop enter precharge after tdpl precharge l h h l bst nop enter row active after tdpl l h l h ba, ca, a10 read/reada illegal l h l l ba, ca, a10 writ/writa illegal 3, 8 l l h h ba, ra act illegal 3 l l h l ba, a10 pre/pall illegal 3 l l l h ref/self illegal l l l l opcode mrs illegal refresh h desl nop enter idle after trc l h h h nop/bst nop enter idle after trc l h h l read/reada illegal l h l h act/pre/pall illegal l h l l ref/self/mrs illegal mode register h desl nop enter idle after trsc accessing l h h h nop nop enter idle after trsc l h h l bst illegal l h l h read/reada illegal l l l l act/pre/pll/ ref/self/mrs illegal remark: h: vih. l: vil. : vih or vil, v = valid data ba: bank address, ca: column address, ra: row address notes: 1. all entries assume that cke was active (high level) during the preceding clock cycle. 2. if all banks are idle, and cke is inactive (low level), the synchronous dram will enter power down mode. 3. illegal to bank in specified states; function may be legal in the bank indicated by bank address (ba), depending on the state of that bank. 4. if all banks are idle, and cke is inactive (low level), the synchronous dram will enter self refresh mode. all input buffers except cke will be disabled. 5. illegal if trcd is not satisfied. 6. illegal if tras is not satisfied. 7. must satisfy burst interrupt condition. 8. must satisfy bus contention, bus trun around, and/or write recovery requirements. 9. must mask preceding data which dont satisfy tdpl. 10. illegal if trrd is not satisfied.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 21 command truth table for cke cke current state n C 1 n /cs /ras /cas /we address operation notes self refresh h invalid, clk (n C 1) would exit self refresh l h h self refresh recovery l h l h h self refresh recovery l h l h l illegal l h l l illegal l l continue self refresh self refresh recovery h h h idle after trc h h l h h idle after trc h h l h l illegal h h l l illegal h l h illegal h l l h h illegal h l l h l illegal h l l l illegal power down h invalid, clk (n C 1) would exit power down l h h exit power down l h l h h h exit power down l l continue power down mode all banks idle h h h refer to operations in function truth table h h l h refer to operations in function truth table h h l l h refer to operations in function truth table h h l l l h cbr (auto) refresh h h l l l l opcode refer to operations in function truth table h l h begin power down next cycle h l l h refer to operations in function truth table h l l l h refer to operations in function truth table h l l l l h self refresh 1 h l l l l l opcode refer to operations in function truth table l h exit power down next cycle l l power down 1 row active h refer to operations in function truth table l clock suspend 1 any state other than h h refer to operations in function truth table listed above h l begin clock suspend next cycle 2 l h exit clock suspend next cycle l l maintain clock suspend remark : h = vih, l = vil, = vih or vil notes: 1. self refresh can be entered only from the all banks idle state. power down can be entered only from all banks idle or row active state. 2. must be legal command as defined in function truth table.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 22 simplified state diagram -9 -9 -9 -9 -9 -9 -9 -9 *u 9 u *u : : 9ucul 9ucul *- 96 -9 -9 96 96u g9 -:cl *-9 g * g 9*g 9*g* 9*g 9g 9*g* 9g 9 9* 9 9g 9* 9g 9 *u uu -9 -9 u
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 23 programming mode registers the mode register is programmed by the mode register set command using address bits a11 through a0, ba0 and ba1 as data inputs. the registers retain data until it is re-programmed, or the device loses power. the mode register has three fields; options : a11 through a7, ba0, ba1 /cas latency : a6 through a4 wrap type : a3 burst length : a2 through a0 following mode register programming, no command can be issued before at least 2 clk have elapsed. /cas latency /cas latency is the most critical of the parameters being set. it tells the device how many clocks must elapse before the data will be available. the value is determined by the frequency of the clock and the speed grade of the device. relationship between frequency and latency shows the relationship of /cas latency to the clock period and the speed grade of the device. burst length burst length is the number of words that will be output or input in a read or write cycle. after a read burst is completed, the output bus will become high-z. the burst length is programmable as 1, 2, 4, 8 or full page. wrap type (burst sequence) the wrap type specifies the order in which the burst data will be addressed. this order is programmable as either sequential or interleave. the method chosen will depend on the type of cpu in the system. some microprocessor cache systems are optimized for sequential addressing and others for interleaved addressing. burst length sequence shows the addressing sequence for each burst length using them. both sequences support bursts of 1, 2, 4 and 8. additionally, sequence supports the full page length.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 24 mode register uku+ + 7 q z + 0 0 0 0 9g9-uuuucuul : g9 0 0 + :uuuu cuuu-l 0 + uu + + u : g9 0 0 0 0 0 uu uku ukugu uku0 + 7 q z 6u :7.0 000 00+ 0+0 0++ +00 +0+ ++0 +++ :u 0 + u =-*u 7 v :.q 000 00+ 0+0 0++ +00 +0+ ++0 +++ 0 0 *0 *+ *7 *v *q *5 *h * *z *w *+0 *++ :*+ :*0 *0 *+ *7 *v *q *5 *h * *z *w *+0 *++ :*+ :*0 *0 *+ *7 *v *q *5 *h * *z *w *+0 *++ :*+ :*0 *0 *+ *7 *v *q *5 *h * *z *w *+0 *++ :*+ :*0 *0 *+ *7 *v *q *5 *h * *z *w *+0 *++ :*+ :*0 0 0 uuuulu - -9 =- =* =-* =9 *0u.u*++vu :*0c+vlvu:*+c*+7l uu uuu
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 25 burst length and sequence [burst of two] starting address (column address a0, binary) sequential addressing sequence (decimal) interleave addressing sequence (decimal) 0 0, 1 0, 1 1 1, 0 1, 0 [burst of four] starting address (column address a1 to a0, binary) sequential addressing sequence (decimal) interleave addressing sequence (decimal) 00 0, 1, 2, 3 0, 1, 2, 3 01 1, 2, 3, 0 1, 0, 3, 2 10 2, 3, 0, 1 2, 3, 0, 1 11 3, 0, 1, 2 3, 2, 1, 0 [burst of eight] starting address (column address a2 to a0, binary) sequential addressing sequence (decimal) interleave addressing sequence (decimal) 000 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 001 1, 2, 3, 4, 5, 6, 7, 0 1, 0, 3, 2, 5, 4, 7, 6 010 2, 3, 4, 5, 6, 7, 0, 1 2, 3, 0, 1, 6, 7, 4, 5 011 3, 4, 5, 6, 7, 0, 1, 2 3, 2, 1, 0, 7, 6, 5, 4 100 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3 101 5, 6, 7, 0, 1, 2, 3, 4 5, 4, 7, 6, 1, 0, 3, 2 110 6, 7, 0, 1, 2, 3, 4, 5 6, 7, 4, 5, 2, 3, 0, 1 111 7, 0, 1, 2, 3, 4, 5, 6 7, 6, 5, 4, 3, 2, 1, 0 full page burst is an extension of the above tables of sequential addressing, with the length being 256.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 26 address bits of bank-select and precharge *++ *+0 *w *z *h * *q *5 *v *7 *+ *0 c*ul *++ *+0 *w *z *h * *q *5 *v *7 *+ *0 cul u*. c9uu:l 0 u*. c9uu:l + *+0 *w *z *h * *q *5 *v *7 *+ *0 -y c=-*ul ulug u u:u* *u 0 u:u: *u 0 + + 0 + 0 + :*+c*+7l :*0c*+vl :*+c*+7l :*0c*+vl :*+c*+7l :*0c*+vl u:u- *u u:ug *u u= uu:u* 0 u= uu:u: 0 + + 0 + 0 + u= uu:u- u= uu:ug u:u* u:u: u:u- u:ug u*u: *+0 0 0 0 0 + 0 0 + + 0 + 0 + :*+ :*0 :*+ :*0 :*+ :*0
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 27 power-up sequence power-up sequence the sdram should be goes on the following sequence with power up. the clk, cke, /cs, dqm and dq pins keep low till power stabilizes. the clk pin is stabilized within 100 s after power stabilizes before the following initialization sequence. the cke and dqm is driven to high between power stabilizes and the initialization sequence. this sdram has vdd clamp diodes for clk, cke, /cs dqm and dq pins. if these pins go high before power up, the large current flows from these pins to vdd through the diodes. initialization sequence when 200 s or more has past after the above power-up sequence, all banks must be precharged using the precharge command (pall). after trp delay, set 8 or more auto refresh commands (ref). set the mode register set command (mrs) to initialize the mode register. we recommend that by keeping dqm and cke to high, the output buffer becomes high-z during initialization sequence, to avoid dq bus contention on memory system formed with a number of device. CC-jCC jj zj zggj power-up sequence and initialization sequence
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 28 operation of the sdram read/write operations bank active before executing a read or write operation, the corresponding bank and the row address must be activated by the bank active (act) command. an interval of t rcd is required between the bank active command input and the following read/write command input. read operation a read operation starts when a read command is input. output buffer becomes low-z in the (/cas latency - 1) cycle after read command set. the sdram can perform a burst read operation. the burst length can be set to 1, 2, 4 and 8. the start address for a burst read is specified by the column address and the bank select address at the read command set cycle. in a read operation, data output starts after the number of clocks specified by the /cas latency. the /cas latency can be set to 2 or 3. when the burst length is 1, 2, 4 and 8 the dout buffer automatically becomes high-z at the next clock after the successive burst-length data has been output. the /cas latency and burst length must be specified at the mode register. "+=C w][ w C =w " w = w]jcj4 w]jcj7 jg jz j4 j7 jg jz j4 j7 "wC w]jcj8w=j qj]jcj6 /cas latency "+=C w][ w C =w " w jg jv jf = jg jz j6 jk jg jz j4 j7 q]jcjz jg jz j4 j7 q]jcj4 q]jcj6 q]jcj9 "wC q]jbjqj] 8w=j]jcj4 burst length
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 29 write operation burst write or single write mode is selected by the opcode of the mode register. 1. burst write: a burst write operation is enabled by setting opcode (a9, a8) to (0, 0). a burst write starts in the same clock as a write command set. (the latency of data input is 0 clock.) the burst length can be set to 1, 2, 4 and 8, like burst read operations. the write start address is specified by the column address and the bank select address at the write command set cycle. "z w][ w C =w " w jg jv jf = jz j6 jk j7 q]jcjz q]jcj4 q]jcj6 q]jcj9 "wC jg jg jg jz jz j4 j4 j7 w]jcj4-j7 burst write 2. single write: a single write operation is enabled by setting opcode (a9, a8) to (1, 0). in a single write operation, data is only written to the column address and the bank select address specified by the write command set cycle without regard to the burst length setting. (the latency of data input is 0 clock). "z w][ w C =w " w jg = "wC single write
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 30 auto precharge read with auto-precharge in this operation, since precharge is automatically performed after completing a read operation, a precharge command need not be executed after each read operation. the command executed for the same bank after the execution of this command must be the bank active (act) command. in addition, an interval defined by lapr is required before execution of the next command. [clock cycle time] /cas latency precharge start cycle 3 2 cycle before the final data is output 2 1 cycle before the final data is output w][ =" "= =" w]c4jjw w]c7jjw C C 'bjjzjtjjjjjjjrjjjjjrsjj =jjjj"=jy"=,jjjjjjy=w,jjjjjjrjjjjjrsjj =w "+=C= =w 7 4 z g "= =w "+=C= =w 7 4 z g burst read (bl = 4) write with auto-precharge in this operation, since precharge is automatically performed after completing a burst write or single write operation, a precharge command need not be executed after each write operation. the command executed for the same bank after the execution of this command must be the bank active (act) command. in addition, an interval of ldal is required between the final valid data input and input of next command. w][ w C C=] z "= =w "z= g z 4 7 =w 'bjjzjtjjjjjjjrjjjjjrs jjjj"=jy"=,jjjjjjy=w,jj jjjrjjjjjrs burst write (bl = 4)
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 31 w][ w C C=] z"= =w "z= =w 'bjjzjtjjjjjjjrjjjjjrs jjjj"=jy"=,jjjjjjy=w,jj jjjrjjjjjrs single write
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 32 burst stop command during a read cycle, when the burst stop command is issued, the burst read data are terminated and the data bus goes to high-z after the /cas latency from the burst stop command. w][ w C yw]jcj4, C yw]jcj7, "+=C q t t burst stop at read during a write cycle, when the burst stop command is issued, the burst write data are terminated and data bus goes to high-z at the same clock with the burst stop command. w][ w C q "z+ t burst stop at write
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 33 command intervals read command to read command interval 1. same bank, same row address: when another read command is executed at the same row address of the same bank as the preceding read command execution, the second read can be performed after an interval of no less than 1 clock. even when the first command is a burst read that is not yet finished, the data read by the second command will be valid. w][ w C jq7 = jqz jq4 q =w " wj= "+=C "+=C wjq j=g jqg qg = wjc= " wjcq " wjc= C wjcq C w]jcj7 q]jcj6 qjg read to read command interval (same row address in same bank) 2. same bank, different row address: when the row address changes on same bank, consecutive read commands cannot be executed; it is necessary to separate the two read commands with a precharge command and a bank active command. 3. different bank: when the bank changes, the second read can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. even when the first command is a burst read that is not yet finished, the data read by the second command will be valid. w][ w C jq7 = jqz jq4 q =w "jg "jz =w "+=C wj= j=g jqg qg = q7 = qg " q7 " "+=C wjq qg C q7 C w]jcj7 q]jcj6 read to read command interval (different bank)
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 34 write command to write command interval 1. same bank, same row address: when another write command is executed at the same row address of the same bank as the preceding write command, the second write can be performed after an interval of no less than 1 clock. in the case of burst writes, the second write command has priority. w][ w C jq7 = jqz jq4 q =w " wj= "z "z wjq j=g jqg qg = wjc= wjcq qjj; q]jcj6 qjg write to write command interval (same row address in same bank) 2. same bank, different row address: when the row address changes, consecutive write commands cannot be executed; it is necessary to separate the two write commands with a precharge command and a bank active command. 3. different bank: when the bank changes, the second write can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. in the case of burst write, the second write command has priority. w][ w C jq7 = jqz jq4 q =w "jg "jz =w "z wj= j=g jqg qg = q7 = qg q7 "z wjq qjj; q]jcj6 write to write command interval (different bank)
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 35 read command to write command interval 1. same bank, same row address: when the write command is executed at the same row address of the same bank as the preceding read command, the write command can be performed after an interval of no less than 1 clock. however, dqm must be set high so that the output buffer becomes high-z before data input. w][ w Cjy, jq4 jq7 "+=C "z jqg jqz t Cjy, w]c4 w]c7 C; q]jcj6 qj read to write command interval (1) - - g 9*g -k7 -kv g 7u read to write command interval (2) 2. same bank, different row address: when the row address changes, consecutive write commands cannot be executed; it is necessary to separate the two commands with a precharge command and a bank active command. 3. different bank: when the bank changes, the write command can be performed after an interval of no less than 1 cycle, provided that the other bank is in the bank active state. however, dqm must be set high so that the output buffer becomes high-z before data input.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 36 write command to read command interval: 1. same bank, same row address: when the read command is executed at the same row address of the same bank as the preceding write command, the read command can be performed after an interval of no less than 1 clock. however, in the case of a burst write, data will continue to be written until one clock before the read command is executed. w][ w Cjy, "z "+=C j=g jqz jq4 jq7 jqg Cjy, wjcj= wjcjq " wjcjq C 8w=j] C; qjj; w]jcj4 q]jcj6 qjg write to read command interval (1) w][ w Cjy, "z "+=C j=g jqz jq4 jq7 jqg Cjy, wjcj= wjcjq " wjcjq C 8w=j] j=z C; qjj; w]jcj4 q]jcj6 qjg write to read command interval (2) 2. same bank, different row address: when the row address changes, consecutive read commands cannot be executed; it is necessary to separate the two commands with a precharge command and a bank active command. 3. different bank: when the bank changes, the read command can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. however, in the case of a burst write, data will continue to be written until one clock before the read command is executed (as in the case of the same bank and the same address).
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 37 read with auto precharge to read command interval 1. different bank: when some banks are in the active state, the second read command (another bank) is executed. even when the first read with auto-precharge is a burst read that is not yet finished, the data read by the second command is valid. the internal auto-precharge of one bank starts at the next clock of the second command. w][ w q C "+=C= "+=C j=g j=z jqg jqz w]cj7 q]jcj6 g "j= 7 " 'bjzjtjjjjjjjrjjjjjjjrs read with auto precharge to read command interval (different bank) 2. same bank: the consecutive read command (the same bank) is illegal. write with auto precharge to write command interval 1. different bank: when some banks are in the active state, the second write command (another bank) is executed. in the case of burst writes, the second write command has priority. the internal auto-precharge of one bank starts 2 clocks later from the second command. w][ w q C "z= "z jqz jq4 jq7 j=g j=z jqg q]cj6 g j= 7 'bjzjtjjjjjjjrjjjjjjjrs write with auto precharge to write command interval (different bank) 2. same bank: the consecutive write command (the same bank) is illegal.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 38 read with auto precharge to write command interval 1. different bank: when some banks are in the active state, the second write command (another bank) is executed. however, dqm must be set high so that the output buffer becomes high-z before data input. the internal auto- precharge of one bank starts at the next clock of the second command. w][ w q Cjy, Cjy, w]jcj4 w]jcj7 "+=C= "z jqg jqz jq4 jq7 q]jcj6 g "= 7 'bjzjtjjjjjjjrjjjjjjjrs C; t read with auto precharge to write command interval (different bank) 2. same bank: the consecutive write command from read with auto precharge (the same bank) is illegal. it is necessary to separate the two commands with a bank active command. write with auto precharge to read command interval 1. different bank: when some banks are in the active state, the second read command (another bank) is executed. however, in case of a burst write, data will continue to be written until one clock before the read command is executed. the internal auto-precharge of one bank starts at 2 clocks later from the second command. w][ w q Cjy, Cjy, "z= "+=C jqg jqz jq4 jq7 w]jcj7 q]jcj6 g = 7 " 'bjzjtjjjjjjjrjjjjjjjrs C; j=g write with auto precharge to read command interval (different bank) 2. same bank: the consecutive read command from write with auto precharge (the same bank) is illegal. it is necessary to separate the two commands with a bank active command.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 39 read command to precharge command interval (same bank) when the precharge command is executed for the same bank as the read command that preceded it, the minimum interval between the two commands is one clock. however, since the output buffer then becomes high-z after the clocks defined by lhzp, there is a case of interruption to burst read data output will be interrupted, if the precharge command is input during burst read. to read all data by burst read, the clocks defined by lep must be assured as an interval from the final data output to precharge command execution. w][ w C "+=C "+8=]] j=g j=z j=4 j=7 w]c4 +jcjtzj read to precharge command interval (same bank): to output all data (cl = 2, bl = 4) w][ w C "+=C "+8=]] j=g j=z j=4 j=7 w]c7 +jcjt4j read to precharge command interval (same bank): to output all data (cl = 3, bl = 4) w][ w C "+=C "+8=]] j=g t cj4 read to precharge command interval (same bank): to stop output data (cl = 2, bl = 1, 2, 4, 8) w][ w C "+=C "+8=]] j=g c7 t read to precharge command interval (same bank): to stop output data (cl = 3, bl = 1, 2, 4, 8)
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 40 write command to precharge command interval (same bank) when the precharge command is executed for the same bank as the write command that preceded it, the minimum interval between the two commands is 1 clock. however, if the burst write operation is unfinished, the input data must be masked by means of dqm for assurance of the clock defined by tdpl. w][ w C "z "+8=]] C] C; w][ j=g j=z w C "z "+8=]] C; C] write to precharge command interval (same bank) (bl = 4 (to stop write operation)) w][ j=g j=z j=4 w C "z "+8=]] j=7 C; C] write to precharge command interval (same bank) (bl = 4 (to write all data))
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 41 bank active command interval 1. same bank: the interval between the two bank active commands must be no less than trc. 2. in the case of different bank active commands: the interval between the two bank active commands must be no less than trrd. w][ w = q qjg j= =w " =w " qjg j= "w bank active to bank active for same bank w][ w = q qjg j= qj7 j= =w "bg =w "bz ""C bank active to bank active for different bank mode register set to bank active command interval the interval between setting the mode register and executing a bank active command must be no less than lmrd. w][ w = ; "j q = ;" z;"C =w qjwj" wC+ mode register set to bank active command interval
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 42 dqm control the dqm mask the dq data. the udqm and ldqm mask the upper and lower bytes of the dq data, respectively. the timing of udqm/ldqm is different during reading and writing. reading when data is read, the output buffer can be controlled by dqm. by setting dqm to low, the output buffer becomes low-z, enabling data output. by setting dqm to high, the output buffer becomes high-z, and the corresponding data is not output. however, internal reading operations continue. the latency of dqm during reading is 2 clocks. writing input data can be masked by dqm. by setting dqm to low, data can be written. in addition, when dqm is set to high, the corresponding data is not written, and the previous data is held. the latency of dqm during writing is 0 clock. w][ C jg jz CCjcj4j] j7 C; t reading w][ C jg jz CzCjcjgj] j7 C; writing
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 43 refresh auto-refresh all the banks must be precharged before executing an auto-refresh command. since the auto-refresh command updates the internal counter every time it is executed and determines the banks and the row addresses to be refreshed, external address specification is not required. the refresh cycles are required to refresh all the row addresses within tref (max.). the output buffer becomes high-z after auto-refresh start. in addition, since a precharge has been completed by an internal operation after the auto-refresh, an additional precharge operation by the precharge command is not required. self-refresh after executing a self-refresh command, the self-refresh operation continues while cke is held low. during self- refresh operation, all row addresses are refreshed by the internal refresh timer. a self-refresh is terminated by a self-refresh exit command. before and after self-refresh mode, execute auto-refresh to all refresh addresses in or within tref (max.) period on the condition 1 and 2 below. 1. enter self-refresh mode within time as below* after either burst refresh or distributed refresh at equal interval to all refresh addresses are completed. 2. start burst refresh or distributed refresh at equal interval to all refresh addresses within time as below*after exiting from self-refresh mode. note: tref (max.) / refresh cycles. others power-down mode the sdram enters power-down mode when cke goes low in the idle state. in power down mode, power consumption is suppressed by deactivating the input initial circuit. power down mode continues while cke is held low. in addition, by setting cke to high, the sdram exits from the power down mode, and command input is enabled from the next clock. in this mode, internal refresh is not performed. clock suspend mode by driving cke to low during a bank active or read/write operation, the sdram enters clock suspend mode. during clock suspend mode, external input signals are ignored and the internal state is maintained. when cke is driven high, the sdram terminates clock suspend mode, and command input is enabled from the next clock. for details, refer to the "cke truth table".
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 44 timing waveforms read cycle :u0 * :u0 :u0 - -9 =- * -g =* =-* =9 : *+0 * g gucl gucl - - *- *- - *- - =-*uuku7 :uukuq :u0u uuuuuuukuuu *-
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 45 write cycle - -9 =- * -g =* =-* =9 : *+0 * gucl gucl - - - - g :u0 :u0 * :u0 -uku7 :ukuq :u0u uuuuuuukuuu g mode register set cycle 0 + 7 v q 5 h z w +0 ++ +7 +v +q +5 + +h +z +w - -9 =- =* =-* =9 : * g gucl gucl . hv h+ h7 hv g -lu -g u u :uv * :uv lu -lu u -g uukuv =-*uukuv :uukuq uuuuuuukuuu
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 46 read cycle/write cycle 0 + 7 v q 5 h z w +0+++7+v+q+5++h+z+w70 l -l l -l -ln -lg h+ h7 hv h+ h7 hv n nh+ g gh+ gh7 ghv -9 =* =- =-* =9 * g gucl gucl - : l -l l -l -ln -lg h+ h7 hv h+ h7 hv n nh+ g gh+ gh7 ghv :u0 * :u0 :uv * :uv :uv :uv :u0 :uv :u0 * :u0 :uv * :uv :uv :uv :u0 :uv -9 =* =- =-* =9 * g gucl gucl : . . u =*.=-*uukuv =-*uukuv :uukuq uuuuuuuku uu u =*.=-*uukuv =-*uukuv :uukuq uuuuuuukuuu
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 47 read/single write cycle 0 + 7 v q 5 h z w +0 ++ +7 +v +q +5 + +h +z +w 70 l -l l -ln l -l -l :u0 * :u0 :uv * :u0 :u0 :uv :u0 * :u0 :u0 :u0 l :uv * -l :u0 h+ h7 hv :u0 :u0 -9 =* =- =-* =9 * g gucl gucl - : -9 =* =- =-* =9 * g : -l h+ hv h+ h7 hv -l =u =*.=-*uukuv =-*uukuv :uukuq uuuuuuuku uu gucl gucl
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 48 read/burst write cycle 0 + 7 v q 5 h z w +0 ++ +7 +v +q +5 + +h +z +w 70 l -l l -ln l -l -l h+ h7 hv h+ h+ h7 hv :u0 * :u0 :u0 :u0 l :uv * -9 =* =- =-* =9 * g - : -9 =* =- =-* =9 * g : h+ h7 hv hv :u0 * :u0 :uv * - :u0 :u0 :uv =:u =*.=-*uukuv =-*uukuv :uukuq uuuuuuuku uu gucl gucl gucl gucl auto refresh cycle 0 + 7 v q 5 h z w +0 ++ +7 +v +q +5 + +h +z +w 70 - -9 =- =-* =9 : * g gucl gucl . u *u * :u0 - - *u :u0 l -l *+0k+ =* h+ uu u =*.=-*uuku7 =-*uuku7 :uukuq uuuuuuukuuu
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 49 self refresh cycle - -9 =- =* =-* =9 : * g gucl gucl u u uu * uu u uuu -9u *+0k+ - uu =*.=-*uukuv -ukuv :ukuq uuuuuuuku uu . - 9 uu u clock suspend mode 0+7v q 5 h z w +0+++7+v+q+5++h+z+w70 l -l l h+ h7 hv h+ h7 l -l l -l h+ h7 h+ h7 hv -l :0 * *u u *u u :0 :v * u u :0 :v 9u:v :0 :0 * *u u *u u :v * u u :v :0 9u:v hv -9 =* =- =-* =9 * g - : -9 =* =- =-* =9 * g : hv . . u =*.=-*uuku7 =-*uuku7 :uukuq uuuuuuukuuu u =*.=-*uuku7 =-*uuku7 :uukuq uuuuuuukuuu gucl gucl gucl gucl
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 50 power down mode - -9 =- =* =-* =9 : * g gucl gucl u u uu *u:u0 uu u -9u lu *+0k+ . uu =*.=-*uukuv =-*uukuv :uukuq uuuuuuukuuu initialization sequence hzw+0 57 5v 5q qz qw 50 5+ *u :u u - - *u 0 +7vq5 - -9 =- =* =-* =9 * g g g *u u 55 .
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 51 package drawing 90-ball fbga w0.
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 52 86-pin tsop (ii) 0y50 +y7uy 0y0wuu0y70 z qq +qv : * 77y77u ?
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 53 recommended soldering conditions please consult with our sales offices for soldering conditions of the eds1232aa. type of surface mount device eds1232aabb: 90-ball fbga eds1232aata: 86-pin tsop (ii)
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 54 notes for cmos devices 1 precaution against esd for mos devices exposing the mos devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the mos devices operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. mos devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. mos devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor mos devices on it. 2 handling of unused input pins for cmos devices no connection for cmos devices input pins can be a cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. the unused pins must be handled in accordance with the related specifications. 3 status before initialization of mos devices power-on does not necessarily define initial status of mos devices. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the mos devices with reset function have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o settings or contents of registers. mos devices are not initialized until the reset signal is received. reset operation must be executed immediately after power-on for mos devices having reset function. cme0107
eds1232aabb, eds1232aata data sheet e0205e30 (ver. 3.0) 55 ;gz+gzgf 'jjjjjjjjjjjjjjjjjjjj jjj+j;-jzs +j;-jzsjjjjjjjjjjjjj yjjjjj-j-jjjj,jj+j;-jzsjj jjjjjjjjjjjjjjjjsj'j-j -jjj-jjjjj-jjjjjj jj+j;-jzsjjs Cjj-jjjjjjjjjjjj jjjjjjjjsjjjj j-jjjjjjjjjmjjjjjj jjjjjsj+j;-jzsjjjjjjj jjjjjjjjjjjj-jjjs [product applications] elpida memory, inc. makes every attempt to ensure that its products are of high quality and reliability. however, users are instructed to contact elpida memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [product usage] design your application so that the product is used within the ranges and conditions guaranteed by elpida memory, inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. elpida memory, inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating elpida memory, inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the elpida memory, inc. product. [usage environment] this product is not designed to be resistant to electromagnetic waves or radiation. this product must be used in a non-condensing environment. if you export the products or technology described in this document that are controlled by the foreign exchange and foreign trade law of japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of japan. also, if you export products/technology controlled by u.s. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. if these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. the information in this document is subject to change without notice. before using this document, confirm that this is the late st version.

▲Up To Search▲

Price & Availability of EDS1232AABB-60L

	To Download EDS1232AABB-60L Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .