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bipolar analog integrated circuit m m m m pc2799gr up convertor for cable modem document no. p13242ej2v0ds00 (2nd edition) date published october 1999 n cp(k) printed in japan data sheet ? 1998, 1999 the mark shows major revised points. description the m pc2799gr is silicon monolithic ic designed for use as up-converter for cable modem. this ic consists of local oscillator, agc amplifier, mixer and so on. m pc1686gv and m pc2798gr are also available as for kit-use with this ic. so, these devices contribute to make rf block small. the package is 20-pin ssop (shrink small outline package) suitable for surface mount. features ? on-chip low distortion agc amplifier, mixer ? low phase noise osc transistor ? packaged in 20-pin ssop suitable for high-density surface mounting ordering information part number package package style m pc2799gr-e1 20-pin plastic ssop (225 mil) embossed tape 12 mm wide. 2.5 k/reel pin 1 indicates pull-out direction of tape for evaluation sample order, please contact your local nec office. (part number for sample order: m pc2799gr) caution electro-static sensitive device the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information.
data sheet p13242ej2v0ds00 2 m m m m pc2799gr internal block diagram and pin configuration (top view) 1 2 3 4 5 6 7 8 9 10 mix out 1 mix out 2 v cc (mix) gnd (mix) rf in gnd (agc) gnd (agc) v agc agc (bypass) agc in 20 19 18 17 16 15 14 13 12 11 v cc (agc) v cc (lo2) v cc (lo1) osc out osc (bypass) osc-c osc-e osc-b gnd (lo) agc out mixer osc agc amp osc out buffer amp example for system application (cable modem) hpf dual pll saw saw lpf a/d qam demo. &fec rf in pc2799gr f 1stif 43.75 mhz dc-10 mhz video amp. pc1686gv pc2798gr mm m
data sheet p13242ej2v0ds00 3 m m m m pc2799gr from osc 12 2 2 5 2 4 9 20 10 pin explanations pin no. symbol pin voltage (v, typ.) explanation equivalent circuit 1 mix out C 2 mix out C 3v cc (mix) 5 power supply pin of mixer block. must be connected bypass capacitor to minimize ground impedance. 4 gnd (mix) 0 ground pin of mixer block. must be connected to the system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. 5 rf in 1.89 input pin of rf signal. 6 gnd (agc) 0 ground pin of agc block. must be connected to the system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. 7v agc 0 to 5 automatic gain control pin. this pins bias govern the agc output level. minimum gain at v agc = 0 v maximum gain at v agc = 5 v recommend to use by deviding agc voltage with externally resistor (ex. 100 k w ). 8agc (bypass) 2.58 bypass pin for agc amplifier. grounded through 2200 pf capacitor. 9 gnd (agc) 0 ground pin of agc block. must be connected to the system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. 10 agc in 1.10 signal input pin of agc amplifier. output pin of mixer. this pin is assigned for the open collector output with high impedance dependent on external inductance.
data sheet p13242ej2v0ds00 4 m m m m pc2799gr power supply pin of local block. must be connected bypass capacitor to minimize ground impedance. 16 18 13 14 15 12 pin no. symbol pin voltage (v, typ.) explanation equivalent circuit 11 agc out 2.5 output pin of agc amplifier. this pin features low-impedance because of its emitter-follower output port. 20 11 6 12 gnd (lo) 0 ground pin of agc block. must be connected to the system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. 13 osc base C 14 osc emitter C 15 osc collector C 16 osc (bypass) 3.18 bypass pin of osc amplifier. grounded through 100 pf capacitor. 17 osc out 3.2 output pin of oscillator frequency. connected to pll synthesizer ics input pin. 19 17 12 18 v cc (lo1) 5 19 v cc (lo2) 5 20 v cc (agc) 5 power supply pin of agc block. must be connected bypass capacitor to minimize ground impedance.
data sheet p13242ej2v0ds00 5 m m m m pc2799gr absolute maximum ratings (t a = 25 c unless otherwise specified) parameter symbol test condition rating unit supply voltage v cc 6.0 v power dissipation p d t a = 85 c *1 433 mw operating ambient temperature t a C40 to +85 c storage temperature range t stg C55 to +150 c osc collector current i osc 48 ma osc collector to base voltage v cbo 6.0 v osc collector to emitter voltage v ceo 4.0 v osc emitter to base voltage v ebo 2.5 v *1. mounted on 50 50 1.6 mm double epoxy glass board. recommended operating range parameter symbol min. typ. max. unit supply voltage vcc 4.5 5.0 5.5 v operating ambient temperature t a - 40 +25 +85 c rf input frequency range f rf 250 C 850 mhz agc voltage v agc 0Cv cc v
data sheet p13242ej2v0ds00 6 m m m m pc2799gr electrical characteristics (t a = 25 c, v cc = 5 v, v agc = 5 v, f rf = 500 mhz, p rf = ?20 dbm, p mix in = ?15 dbm, f osc = 1415 mhz, p osc = ?10 dbm, f if = 915 mhz, unless otherwise specified) parameter symbol min. typ. max. unit test conditions total circuit current icc C 60 78 ma no input signal agc amplifier block agc maximum gain g agcmax 12.5 15.0 17.5 db agc minimum gain g agcmin C0.5Cdbv agc = 0 v gain control range gcr 10 14.5 C db v agc = 0 to 5 v maximum output power 1 p o (sat) 1 3.0 6.0 C dbm p rf = 0 dbm maximum output power 2 p o (sat) 2 C C9.0 C dbm v agc = 0 v, p rf = 0 dbm mixer block conversion gain cg 1.5 4.5 7.5 db maximum output power 3 p o (sat) 3 C1.5 1.5 C dbm p mix in = 0 dbm standard characteristics (for reference) (t a = 25 c, v cc = 5 v, v agc = 5 v, f rf = 500 mhz, f osc = 1415 mhz, p osc = ?10 dbm, f if = 915 mhz, unless otherwise specified) parameter symbol reference values unit test conditions agc amplifier block noise figure 1 nf1 8.5 db input intercept point 1 iip 3 1+0.5dbmf rf 1 = 499 mhz, f rf 2 = 501 mhz input intercept point 2 iip 3 2C2dbmf rf 1 = 499 mhz, f rf 2 = 501 mhz, v agc = 0 v mixer block noise figure 2 nf2 17 db dsb, p osc = C10 dbm noise figure 3 nf3 13 db dsb, p osc = 0 dbm input intercept point 3 iip 3 3+5dbmf rf 1 = 499 mhz, f rf 2 = 501 mhz
data sheet p13242ej2v0ds00 7 m m m m pc2799gr typical characteristics (agc block, t a = 25 c, v cc = 5 v, unless otherwise specified) 80 60 40 20 0 20 15 10 5 0 0 200 400 600 800 1000 ?0 ?0 ?0 ?0 0 10 20 15 10 5 0 10 0 ?0 ?0 ?0 ?0 01234 v cc - supply voltage - v i cc - circuit current - ma v agc - agc voltage - v gain - db 567 0123456 circuit current vs. supply voltage gain vs. agc voltage gain vs. input frequency output power vs. input power f in - input frequency - mhz gain - db p in - input power - dbm p out - output power - dbm no signal total mix block agc block p rf = ?0 dbm f rf = 500 mhz p rf = ?0 dbm f rf = 500 mhz v agc = 5 v v agc = 0 v v agc = 5 v v agc = 0 v
data sheet p13242ej2v0ds00 8 m m m m pc2799gr typical characteristics (mix block, t a = 25 c, v cc = 5 v, unless otherwise specified) 10 8 6 4 2 0 0 100 200 300 400 500 f rf - input frequency - mhz cg - conversion gain - db p osc - oscillator input power - dbm cg - conversion gain - db p in - input power - dbm p out - output power - dbm f if - input frequency - mhz cg - conversion gain - db 600 700 800 900 10 5 0 ? ?0 800 900 1000 1100 10 5 10 0 ?0 ?0 ?0 ?0 ?5 ?0 ?5 ?0 ? 0 5 0 ? ?0 ?0 ?0 0 10 20 conversion gain vs. input frequency conversion gain vs. if frequency conversion gain vs. oscillator input power output power vs. input power p rf = ?5 dbm f if = 915 mhz p osc = ?0 dbm f rf = 500 mhz p rf = ?5 dbm f if = 915 mhz p rf = ?5 dbm f rf = 500 mhz p osc = ?0 dbm f rf = 500 mhz f if = 915 mhz p osc = ?0 dbm
data sheet p13242ej2v0ds00 9 m m m m pc2799gr standard characteristics (t a = 25 c, v cc = 5 v, unless otherwise specified) 10 ?0 ?5 ?0 ?5 p in - input power - dbm p out - output power - dbm p in - input power - dbm p out - output power - dbm ?0 ? 0 ?0 ?5 ?0 ?5 ?0 ? 0 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?00 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 output power vs. input power output power vs. input power f rf 1 = 499 mhz f rf 2 = 501 mhz v agc = 5 v f rf 1 = 499 mhz f rf 2 = 501 mhz f osc = 1415 mhz p osc = ?0 dbm
data sheet p13242ej2v0ds00 10 m m m m pc2799gr measurement circuit 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 mixer osc agc amp osc out buffer amp if out 5.6 nh 12 nh 3.9 k 5.1 k 2 k 1 pf 0.1 f rf in agc in 100 pf 100 pf 2200 pf 2200 pf 2200 pf v cc v agc v cc 100 pf 100 pf 100 pf v cc v cc osc out osc in agc out 1 k 3.9 k 240 m 0.1 f m 0.1 f m 0.1 f m 0.1 f m 0.1 f m
data sheet p13242ej2v0ds00 11 m m m m pc2799gr application circuit example 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 mixer osc agc amp osc out buffer amp if out 3.9 nh 8.2 nh 3.9 k 5 k 2 k 1.5 pf rf in agc in 100 pf 100 pf 100 pf 2200 pf 100 pf v cc v agc v cc 100 pf 1000 pf 100 pf 75 1 k 10 1 k 10 1 k 3.9 k 10 p 100 p 1 p v cc v cc osc out vtu agc out 250 v cc 0.1 f m 0.1 f m 0.1 f m 0.1 f m 0.1 f m 1.5 k 0.1 f m the application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
data sheet p13242ej2v0ds00 12 m m m m pc2799gr package dimensions 20 pin plastic ssop (225 mil) (unit: mm) 20 detail of lead end 1.8 max. 3? +7? C3? 0.65 0.10 m 0.15 0.5 0.2 11 110 6.7 0.3 1.5 0.1 0.1 0.1 0.22 +0.10 C0.05 0.575 max. 0.15 +0.10 C0.05 6.4 0.2 4.4 0.1 1.0 0.2 note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition.
data sheet p13242ej2v0ds00 13 m m m m pc2799gr recommended soldering conditions the following conditions (see table below) must be met when soldering this product. please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e). m m m m pc2799gr soldering process soldering conditions symbol infrared ray reflow peak packages surface temperature: 235 c or below, reflow time: 30 seconds or below (210 c or higher), number of reflow process: 3, exposure limit note : none ir35-00-3 vps peak packages surface temperature: 215 c or below, reflow time: 40 seconds or below (200 c or higher), number of reflow process: 3, exposure limit note : none vp15-00-3 partial heating method terminal temperature: 300 c or below, flow time: 3 seconds or below, exposure limit note : none note exposure limit before soldering after dry-pack package is opened. storage conditions: 25 c and relative humidity at 65% or less. caution do not apply more than single process at once, except for partial heating method.
data sheet p13242ej2v0ds00 14 m m m m pc2799gr [memo]
data sheet p13242ej2v0ds00 15 m m m m pc2799gr [memo]
m m m m pc2799gr the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. ? nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. ? descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. ? while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. ? nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98. 8

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