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caution electro-static sensitive devices the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. bipolar analog integrated circuits m m m m pc2757t, m m m m pc2758t silicon mmic 1st frequency down-converter for mobile communications ? 1995, 1999 document no. p10716ej4v0ds00 (4th edition) date published april 1999 n cp(k) printed in japan data sheet the mark shows major revision points. description the m pc2757t and m pc2758t are silicon monolithic integrated circuits designed as 1st down-converters for l band mobile communications. the ics consist of mixer and local amplifier. the m pc2757t features low current consumption and the m pc2758t features improved intermodulation. from these two version, you can chose either ic corresponding to your system design. the m pc2757t and m pc2758t are manufactured using necs 20 ghz f t nesat? iii silicon bipolar process. this process uses silicon nitride passivation film and gold electrodes. these materials can protect chip surface from external pollution and prevent corrosion and migration. thus, these products have excellent performance, uniformity and reliability. features ? wide band operation : f rfin = 0.1 ghz to 2.0 ghz ? high-density surface mounting : 6-pin minimold ? low voltage operation : supply voltage 3.0 v typ. ? low power consumption 15 mw : m pc2757t ? power-save function : m pc2757t, m pc2758t ordering information part number markings product type package supplying form m pc2757t-e3 c1x low power consumption m pc2758t-e3 c1y high output ip 3 6-pin minimold embossed tape 8-mm wide. pin 1, 2, 3 face to perforation side of the tape. qty 3 kp/reel. note to order evaluation samples, please contact local nec sales office. (part number for sample order: m pc2757t, m pc2758t)
data sheet p10716ej4v0ds00 2 m m m m pc2757t, m m m m pc2758t pin connections product line-up (t a = +25 c, v cc = 3.0 v, z l = z s = 50 w w w w ) items part no. no rf i cc (ma) 900 mhz ssb nf (db) 1.5 ghz ssb nf (db) 1.9 ghz ssb nf (db) 900 mhz cg (db) 1.5 ghz cg (db) 1.9 ghz cg (db) 900 mhz iip 3 (dbm) 1.5 ghz iip 3 (dbm) 1.9 ghz iip 3 (dbm) m pc2757t m pc2757tb 5.6101013151513 - 14 - 14 - 12 m pc2758t m pc2758tb 11 9 1013191817 - 13 - 12 - 11 m pc8112t m pc8112tb 8.5 9 11 11 15 13 13 - 10 - 9 - 7 items part no. 900 mhz p o(sat) (dbm) 1.5 ghz p o(sat) (dbm) 1.9 ghz p o(sat) (dbm) 900 mhz rf io (db) 1.5 ghz rf io (db) 1.9 ghz rf io (db) if output configuration packages m pc2757t m pc2757tb - 3 -- 8 --- 6-pin minimold 6-pin super minimold m pc2758t m pc2758tb +1 -- 4 --- 6-pin minimold 6-pin super minimold m pc8112t m pc8112tb - 2.5 - 3 - 3 - 80 - 57 - 55 open collector 6-pin minimold 6-pin super minimold remark typical performance. please refer to electrical characteristics in detail. to know the associated product, please refer to each latest data sheet. notice m pc2757 and m pc2758s iip 3 are calculated with d im 3 = 3 which is the same im 3 inclination as m pc8112. on the other hand, oip 3 of standard characteristics in page 4 is cross point ip. pin no. pin name 1 rf input 2gnd 3 lo input 4ps 5v cc 6 if output (top view) 3 2 1 4 5 6 (bottom view) 4 5 6 3 2 1 example marking is for pc2757t m c1x emitter follower
data sheet p10716ej4v0ds00 3 m m m m pc2757t, m m m m pc2758t internal block diagram ( m m m m pc2757t, m m m m pc2758t in common) rf input if output power save gnd v cc lo input to know the detail in associated product, please refer to its latest data sheet.
data sheet p10716ej4v0ds00 4 m m m m pc2757t, m m m m pc2758t pin explanation (both m m m m pc2757t, 2758t) pin no. pin name applied voltage (v) pin voltage (v) note function and application equivalent circuit 1 rf input C 1.2 this pin is rf input for mixer designed as double balance type. this circuit contributes to suppress spurious signal with minimum lo and bias power consumption. also this symmetrical circuit can keep specified performance insensi- tive to process-condition distribution. 1 v cc to if amp. from lo 2 gnd gnd C this pin is ground of ic. must be connected to the system ground with minimum inductance. ground pattern on the board should be formed as wide as possible. (track length should be kept as short as possible.) C 3 lo input C 1.3 this pin is lo input for local buffer designed as differential amplifier. recommendable input level is C15 to C0 dbm. also this symmetrical circuit can keep specified performance insensitive to process- condition distribution. v cc 3 mixer 4ps v cc /gnd C this pin is for power-save function. this pin can control on/off operation with bias as follows; rise time/fall time using this pin are approximately 10 m s. v cc 4 5v cc 2.7 to 3.3 C supply voltage 3.0 0.3 v for operation. must be connected bypass capacitor. (example: 1 000 pf) to minimize ground impedance. C 6 if output C 1.7 this pin is output from if buffer amplifier designed as single-ended push-pull type. this pin is assigned for emitter follower output with low- impedance. in the case of connecting to high-impedance stage, please attach external matching circuit. v cc 6 note each pin voltage is measured with v cc = 3.0 v bias: v operation 3 2.5 on v ps 0 to 0.5 off
data sheet p10716ej4v0ds00 5 m m m m pc2757t, m m m m pc2758t absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25 c 5.5 v ps pin voltage v ps t a = +25 c 5.5 v power dissipation of package allowance p d mounted on 50 50 1.6 mm double sided copper clad epoxy glass board at t a = +85 c 280 mw operating ambient temperature t a C40 to +85 c storage temperature t stg C55 to +150 c recommended operating range parameters symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v operating ambient temperature t a C40 +25 +85 c lo input level p loin C15 C10 0 dbm electrical characteristics (t a = +25c, v cc = v ps = 3.0 v, p loin = C10 dbm, z l = z s = 50 w w w w ) m pc2757t m pc2758t parameters symbol conditions min. typ. max. min. typ. max. unit circuit current i cc no input signal 3.7 5.6 7.7 6.6 11 14.8 db rf frequency response f rfin cg 3 (cg1 C3 db) f ifout = 130 mhz constant 0.1 2.0 0.1 2.0 ghz if frequency response f ifout cg 3 (cg1 C3 db) f rfin = 0.8 ghz constant 20 300 20 300 mhz conversion gain 1 cg1 f rfin = 0.8 ghz, f ifout = 130 mhz p rfin = C40 dbm, upper local 12 15 18 16 19 22 db conversion gain 2 cg2 f rfin = 2.0 ghz, f ifout = 250 mhz p rfin = C40 dbm, lower local 10 13 16 14 17 20 db single sideband noise figure 1 ssb nf1 f rfin = 0.8 ghz, f ifout = 130 mhz, upper local 10 13 9 12 db single sideband noise figure 2 ssb nf2 f rfin = 2.0 ghz, f ifout = 250 mhz, lower local 13 16 13 15 db maximum if output level 1 p o(sat) 1f rfin = 0.8 ghz, f ifout = 130 mhz p rfin = C10 dbm, upper local C11 C3 C7 +1 dbm maximum if output level 2 p o(sat) 2f rfin = 2.0 ghz, f ifout = 250 mhz p rfin = C10 dbm, lower local C11 C8 C7 C4 dbm standard characteristics for reference (unless otherwise specified: t a = +25c, v cc = v ps = 3.0 v, p loin = C10 dbm, z l = z s = 50 w w w w ) reference value parameters symbol conditions m pc2757t m pc2758t unit output 3rd intercept point oip 3 f rfin = 0.8 to 2.0 ghz, f ifout = 0.1 ghz, cross point ip +5 +11 dbm lo leakage at rf pin lo rf f loin = 0.8 to 2.0 ghz C35 C30 dbm lo leakage at if pin lo if f loin = 0.8 to 2.0 ghz C23 C15 dbm power-saving current i ps v ps = 0.5 v 0.1 0.1 m a remark iip 3 is determined by comparing two method; theoretical calculation and cross point of im 3 curve. iip 3 = ( d im 3 p in + cg C im 3 ) ? ( d im 3 C 1) (dbm) [ d im 3 : im 3 curve inclination in linear range]
data sheet p10716ej4v0ds00 6 m m m m pc2757t, m m m m pc2758t schematic supplement for rf, if specifications note m pc2757t m pc2758t min. typ. max. min. typ. max. unit cg1 121518161922db cg1 C 3 db 9 12 15 13 16 19 db cg1 0.1 0.8 2.0 cg1 ? db rf frequency response rf frequency f rfin (ghz) conversion gain cg (db) guaranteed gain level f ifout = 130 mhz p rfin = ?0 dbm cg1 10 150 300 cg1 ? db if frequency response if frequency f ifout (mhz) conversion gain cg (db) guaranteed gain level f rfin = 0.8 ghz p rfin = ?0 dbm
data sheet p10716ej4v0ds00 7 m m m m pc2757t, m m m m pc2758t test circuit m m m m pc2757t, m m m m pc2758t 50 w 50 w 1 000 pf c 1 signal generator 1 000 pf c 2 3 2 1 4 5 6 signal generator 3 v 3 300 pf (top view) 50 w c 3 3 300 pf c 4 spectrum analyzer lo in gnd rf in ps v cc if out power save illustration of the test circuit assembled on evaluation board c 1 c 3 gnd v cc lo input rf input ps bias if output c 2 c 4 component list notes 1. 35 42 0.4 mm double sided copper clad polyimide board. 2. back side: gnd pattern 3. solder plated on pattern 4. { : through holes application this ic is guaranteed on the test circuit constructed with 50 w equipment and transmission line. this ic, however, does not have 50 w input/output impedance, but electrical characteristics such as conversion gain and intermodulation distortion are described herein on these conditions without impedance matching. so, you should understand that conversion gain and intermodulation distortion at input level will vary when you improve vs of rf input with external circuit (50 w termination or impedance matching). external circuits of the ic can be referred to following application notes. ? to rf and if port: m pc2757, m pc2758, m pc8112 application note (document no. p11997e) no. value c 1 , c 2 1 000 pf c 3 to c 5 3 300 pf
data sheet p10716ej4v0ds00 8 m m m m pc2757t, m m m m pc2758t typical characteristics (t a = +25 c) circuit current vs. supply voltage circuit current l cc (ma) 20 15 10 5 0 123456 supply voltage v cc (v) conversion gain and noise figure vs. rf input frequency single sideband noise figure ssbnf (db) 0.5 1.0 1.5 2.0 2.5 3.0 rf input frequency f rfin (ghz) conversion gain vs. local input level conversion gain cg (db) 25 20 10 5 ? ?0 ?0 ?0 ?0 0 +10 lo input level p loin (dbm) no signals v ps = v cc pc2758t m pc2757t m circuit current vs. temperature circuit current l cc (ma) 20 15 10 0 ?0 operating ambient temperature t a ( c) pc2758t m pc2757t m 5 ?0 0 +20 +40 +60 +80 +100 no signals v cc = v ps = 3.0 v 20 15 10 5 25 20 15 10 conversion gain vs. if output frequency 200 400 600 800 1 000 1 200 if output frequency f ifout (mhz) 15 10 5 0 conversion gain cg (db) 30 25 20 pc2758t m pc2757t m cg pc2757t m pc2758t m pc2757t m pc2758t m v cc = v ps =3.0 v p rfin = ?5 dbm p loin = ?0 dbm f ifout = 100 mhz (low-side lo) ssbnf 1.0 v cc = v ps = 3.0 v p rfin = ?5 dbm p loin = ?0 dbm f rfin = 1.5 ghz pc2758t m pc2757t m 15 0 ?0 v cc = v ps = 3.0 v f rfin = 900 mhz f loin = 800 mhz p rfin = ?0 dbm pc2758t m pc2757t m conversion gain vs. local input level conversion gain cg (db) 25 20 10 5 ? ?0 ?0 ?0 ?0 0 +10 lo input level p loin (dbm) 15 0 ?0 v cc = v ps =3.0 v f rfin = 2.0 ghz f loin = 1.9 ghz p rfin = ?0 dbm pc2758t m pc2757t m conversion gain cg (db)
data sheet p10716ej4v0ds00 9 m m m m pc2757t, m m m m pc2758t if output level p ifout (dbm) third order intermodulation distortion im 3 (dbm) 20 10 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 rf input level p rfin (dbm) rf input level p rfin (dbm) ?0 ?0 0 m pc2757t im 3 and if output level vs. rf input level f rfin 1 = 900 mhz f rfin 2 = 905 mhz f loin = 800 mhz p loin = ?0 dbm v cc = v ps = 3.0 v im 3 p out 20 10 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 f rfin 1 = 900 mhz f rfin 2 = 905 mhz f loin = 800 mhz p loin = ?0 dbm v cc = v ps = 3.0 v ?0 ?0 ?0 ?0 0 if output level p ifout (dbm) third order intermodulation distortion im 3 (dbm) m pc2758t im 3 and if output level vs. rf input level im 3 p out if output level p ifout (dbm) third order intermodulation distortion im 3 (dbm) 20 10 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 rf input level p rfin (dbm) ?0 ?0 0 f rfin 1 = 2.0 ghz f rfin 2 = 2.005 ghz f loin = 1.9 ghz p loin = ?0 dbm v cc = v ps = 3.0 v im 3 p out m pc2757t im 3 and if output level vs. rf input level rf input level p rfin (dbm) 20 10 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 0 if output level p ifout (dbm) third order intermodulation distortion im 3 (dbm) m pc2758t im 3 and if output level vs. rf input level f rfin 1 = 2.0 ghz f rfin 2 = 2.005 ghz f loin = 1.9 ghz p loin = ?0 dbm v cc = v ps = 3.0 v im 3 p out
data sheet p10716ej4v0ds00 10 m m m m pc2757t, m m m m pc2758t lo leakage at if pin (dbm) 0 ?0 ?0 ?0 ?0 ?0 ?0 0 lo input frequency f loin (ghz) m pc2757t lo leakage at if pin vs. local input frequency 0.5 1.0 1.5 2.0 2.5 3.0 lo leakage at if pin (dbm) 0 ?0 ?0 ?0 ?0 ?0 ?0 0 m pc2758t lo leakage at if pin vs. local input frequency 0.5 1.0 1.5 2.0 2.5 3.0 lo leakage at rf pin (dbm) 0 ?0 ?0 ?0 ?0 ?0 ?0 0 lo input frequency f loin (ghz) m pc2757t lo leakage at rf pin vs. local input frequency 0.5 1.0 1.5 2.0 2.5 3.0 lo leakage at rf pin (dbm) 0 ?0 ?0 ?0 ?0 ?0 ?0 0 m pc2758t lo leakage at rf pin vs. local input frequency 0.5 1.0 1.5 2.0 2.5 3.0 p loin = ?0 dbm v cc = v ps = 3.0 v p loin = ?0 dbm v cc = v ps = 3.0 v p loin = ?0 dbm v cc = v ps = 3.0 v p loin = ?0 dbm v cc = v ps = 3.0 v lo input frequency f loin (ghz) lo input frequency f loin (ghz)
data sheet p10716ej4v0ds00 11 m m m m pc2757t, m m m m pc2758t s-parameters C m m m m pc2757t C start 0.050000000 ghz stop 3.000000000 ghz rf port v cc =v ps =3.0v 1:500mhz 64.273 w- j250.85 w 2:900mhz 40.93 w- j141.55 w 3:1500mhz 31.09 w- j82.902 w 4:1900mhz 27.545 w- j62.115 w 5:2500mhz 26.459 w- j41.922 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz rf port v cc =3.0v v ps =gnd 1:500mhz 109.98 w- j363.47 w 2:900mhz 79.687 w- j214.84 w 3:1500mhz 60.195 w- j141.38 w 4:1900mhz 50.621 w- j114.52 w 5:2500mhz 42.488 w- j87.531 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz lo port v cc =v ps =3.0v 1:500mhz 99.852 w- j220.24 w 2:900mhz 73.133 w- j139.53 w 3:1500mhz 52.672 w- j91.57 w 4:1900mhz 48.867 w- j74.281 w 5:2500mhz 40.842 w- j55.199 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz lo port v cc =3.0v v ps =gnd 1:500mhz 128.02 w- j354.03 w 2:900mhz 88.133 w- j222.33 w 3:1500mhz 62.516 w- j140.97 w 4:1900mhz 58.312 w- j117.96 w 5:2500mhz 45.59 w- j93.238 w 5 4 2 1 3 start 0.050000000 ghz stop 0.300000000 ghz if port v cc =v ps =3.0v 1:130mhz 24.197 w- j7.668 w 2:250mhz 28.207 w- j13.525 w 2 1 start 0.050000000 ghz stop 0.300000000 ghz if port v cc =3.0v v ps =gnd 1:130mhz 168.88 w- j1.2039k w 2:250mhz 120.56 w- j652.25 w 2 1
data sheet p10716ej4v0ds00 12 m m m m pc2757t, m m m m pc2758t C m m m m pc2758t C start 0.050000000 ghz stop 3.000000000 ghz rf port v cc =v ps =3.0v 1:500mhz 59.633 w- j235.09 w 2:900mhz 37.609 w- j131.38 w 3:1500mhz 29.121 w- j76.48 w 4:1900mhz 26.992 w- j56.742 w 5:2500mhz 26.697 w- j37.975 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz rf port v cc =3.0v v ps =gnd 1:500mhz 105.94 w- j355.98 w 2:900mhz 79.336 w- j214.39 w 3:1500mhz 61.398 w- j139.99 w 4:1900mhz 51.539 w- j113.45 w 5:2500mhz 42.875 w- j87.09 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz lo port v cc =v ps =3.0v 1:500mhz 69.883 w- j177.5 w 2:900mhz 59.047 w- j102.83 w 3:1500mhz 49.656 w- j67.445 w 4:1900mhz 46.871 w- j53.65 w 5:2500mhz 42.143 w- j40.105 w 5 4 2 1 3 start 0.050000000 ghz stop 3.000000000 ghz lo port v cc =3.0v v ps =gnd 1:500mhz 102.48 w- j330.11 w 2:900mhz 79.703 w- j199.25 w 3:1500mhz 60.961 w- j128.63 w 4:1900mhz 59.211 w- j107.32 w 5:2500mhz 48.105 w- j86.215 w 5 4 2 1 3 start 0.050000000 ghz stop 0.300000000 ghz if port v cc =v ps =3.0v 1:130mhz 20.784 w- j10.842 w 2:250mhz 27.586 w- j18.538 w 2 1 start 0.050000000 ghz stop 0.300000000 ghz if port v cc =3.0v v ps =gnd 1:130mhz 182.06 w- j1.1831k w 2:250mhz 117.16 w- j631.63 w 2 1
data sheet p10716ej4v0ds00 13 m m m m pc2757t, m m m m pc2758t system application example analog cellular telephone pc2757t m n pll pll vco mod. sw pa rx tx demo. fm low noise tr digital cellular telephone pc2758t m n pll vco sw pa rx tx demo. low noise tr pll 0? 90? i q i q f these examples show only ics location on the system use schematically, do not present or recommend the actual application circuit in detail.
data sheet p10716ej4v0ds00 14 m m m m pc2757t, m m m m pc2758t package dimensions 6 pin minimold (unit: mm) 12 3 65 4 0.95 0.95 1.9 2.9 ?.2 0.3 +0.1 ?.05 2.8 +0.2 ?.3 1.5 +0.2 ?.1 0.13 ?.1 0 to 0.1 0.8 1.1 +0.2 ?.1
data sheet p10716ej4v0ds00 15 m m m m pc2757t, m m m m pc2758t note on correct use (1) observe precautions for handling because of electrostatic sensitive devices. (2) form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) keep the track length of the ground pins as short as possible. (4) connect a bypass capacitor (example: 1 000 pf) to the v cc pin. recommended soldering conditions this product should be soldered under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nec sales representative. soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235 c or below time: 30 seconds or less (at 210 c) count: 3, exposure limit: none note ir35-00-3 vps package peak temperature: 215 c or below time: 40 seconds or less (at 200 c) count: 3, exposure limit: none note vp15-00-3 wave soldering soldering bath temperature: 260 c or below time: 10 seconds or less count: 1, exposure limit: none note ws60-00-1 partial heating pin temperature: 300 c time: 3 seconds or less (per side of device) exposure limit: none note C note after opening the dry pack, keep it in a place below 25 c and 65 % rh for the allowable storage period. caution do not use different soldering methods together (except for partial heating). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e).
m m m m pc2757t, m m m m pc2758t nesat (nec silicon advanced technology) is a trademark of nec corporation. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. ? nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. ? descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. ? while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. ? nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98. 8

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