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z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 1 specification SWT821-S customer ap pro v al ap pro v al drawn ssc
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 2 contents 1. feature & application 2. absolute maximum ratings 3. electro cha r acteristi cs 4. opti cal characteristi cs 5. rank of SWT821-S 6. color & binning 7 . o u tlin e dimen s ion 8. packi n g 9 . s o lder ing 10. precaution for use 11. handl i n g of si licone resin leds 12. reliability test item and condition
z-power led x10490 technical data sheet rev. 03 rev. 03 may 2008 may 2008 www.zled.com www.zled.com document no. : ssc-qp-7-07-24 (rev.00) 3 SWT821-S SWT821-S description features ?? ?w h i t e c o l o r e d s m t package. ? m at eria l : in gan / sic ? e ncapsu l a t i ng resi n : silicon resin ? h i g h reli abili ty ? s u i t a bl e f o r all sm t ass e mb ly me t h od s ; su it a b l e f o r all soldering meth ods ?r o h s c o m p l i a n t this surface-mount led comes in plcc sta n dard package di mens io n. it h a s a substrate made up of a mo lded plastic reflector sitting on top of a b e nt lead frame. the die is a t tached within the refl ector ca vity and the cavity is encapsula t ed b y ep oxy or silicone. the p a ckage desig n coupled with careful selectio n of compon e n t materials allow these products to p e rform with high reliability in a larger temperature range - 40 to 100 . the high reliability feature is crucial to automoti ve interior and indoor es s. applications ? i nte r i o r a u tomo ti v e ? e lectron i c sign s and signa l s ? o ffi ce au t o mat i on, e l e c t r ica l a ppl ian c es, i n dustr i al eq ui pme n t
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 4 2. absolute maximum ratings oc -40 ~ +100 t st g st orag e te mp eratur e oc -40 ~ +85 t opr opera t ing te mp eratur e v 5 v r r e vers e v o ltag e (per die) ma 100 i fm *2 peak for w a r d current ma 90 i f forward curren t mw 342 p d power di ssipat ion un it valu e symbol paramet e r *1 care i s to b e taken that p o wer d i ssi p ati o n does no t ex c eed t h e abso l u te max i m u m rati n g o f t h e pr o d uct. *2 ifm was measured at t w 1 m s e c of puls e wi d t h an d d 1/10 o f d u ty rati o. 3. e l ectric ch aracteris t ics k/w - 65 - i f =60 ma rt h ja t h e r m a l res i sta n ce lm/ w - 70 - i f =60 ma op opt i cal effic i en cy deg - 120 - i f =60 ma 2 ? viewing an gle *2 k 4800 - 12000 i f =60 ma cc t color te mpe r ature lm 16 13.5 11 i f =60 ma v lu minance fl ux mcd 6500 5500 4000 i f =60 ma i v lu minance in t e n s ity *1 a 10 - - v r =5v i r r e vers e c u rren t (per die) v 3.8 3.2 2.8 i f =60 ma v f forward voltag e (per die) un it ma x ty p mi n condit ion symbol paramet e r *1. the lumino us int e nsit y iv wa s m e as u r e d at th e pe ak o f th e s p at i a l pat t e r n whi c h m a y not be align e d wi th th e m e ch ani c al axi s of th e l e d pac k age . lumin o us in t e nsit y m e as u r e m ent allowan c e i s 10 % *2. 2 ? is t h e o f f - ax is w h er e t h e l u m i n o us i n te ns it y is 1 / 2 o f t h e peak i n t e ns ity . *3. rth j a r e s ult s from mounting on pcb fr4( p a d siz e ? 1 6 mm2 per pad, th ick n ess r 0.6mm )
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 5 4. optical ch aracteris t ics fo rwa r d cu rren t vs. fo rwa r d voltage (pe r die) ( t a =25 o c ) 2 . 02 . 5 3 . 03 . 5 4 . 0 1 10 f o rward v o l t age[v ] f o r w ard cur r ent [ m a] relative l u minou s in tensity vs f o rward cu rren t ( t a =25 o c ) 0 1 5 3 04 56 07 5 9 0 1 0 5 1 2 0 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 1. 8 2. 0 relativ e l u mi n o si ty ( a . u .) f o rw a r d c u rr en t i f [m a ]
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 6 4. optical ch aracteris t ics am bien t t e mpe r a t u r e vs. allow a ble fo rwa r d cu rren t (per die) - 2 5 0 25 50 75 10 0 0 5 10 15 20 25 30 35 f o rward current i f (ma ) a m b i ent t e m p er at ur e t a ( o c) radiatio n dia g ra m ( t a =25 o c ) -90 -6 0 -30 90 60 30 0
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 7 4. optical ch aracteris t ics spectru m ( t a =25 , i f =60m a) 30 0 4 0 0 50 0 6 0 0 70 0 8 0 0 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 norma liz ed i n t ens it y[ a. u. ] w a v e l e ng th [nm ]
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 8 5. rank of swt 8 21-s .r ank na me cie iv vf x3 x2 x1 .forwa r d voltage[v ] 3.4 3.3 a1 3.2 3.1 z2 3.5 3.4 a2 3.3 3.2 z3 v 3.1 3.0 z1 unit max min ran k name .l uminous in tensity [iv] 6500 5000 n 5000 4000 mm c d unit max min ran k name [no t e] all me asur ements we re mad e un de r the s t an d a r d i z e d en vi ro nment o f s s c.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 9 6. col o r & b i nning 0.0 0 .1 0.2 0 .3 0.4 0 .5 0.6 0 .7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 cct y x
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 10 ; co lo r rank * measuremen t uncertain t y o f th e co lor co o r dinates : 0.01 0. 26 0 . 2 8 0. 30 0. 32 0 . 3 4 0 . 3 6 0. 26 0. 28 0. 30 0. 32 0. 34 0. 36 0. 38 10000k 8200k 5600k 6200k 12000k 7000k 4800k y x a1 a2 b1 b2 c1 c2 d1 d2 e1 e2 f1 f2 0.358 0.33 0.338 0.33 0.343 0.316 0.325 0.318 0.374 0.346 0.353 0.345 0.358 0.33 0.338 0.33 0.353 0.345 0.335 0.344 0.338 0.33 0.318 0.33 0.338 0.33 0.318 0.33 0.325 0.318 0.306 0.32 y x y x y x y x f2 f1 e2 e1 0.329 0.303 0.3104 0.3065 0.312 0.289 0.295 0.295 0.343 0.316 0.325 0.318 0.329 0.303 0.3104 0.3065 0.325 0.318 0.306 0.32 0.3104 0.3065 0.2935 0.31 0.3104 0.3065 0.2935 0.31 0.295 0.295 0.281 0.3 y x y x y x y x d2 d1 c2 c1 0.297 0.279 0.282 0.286 0.284 0.271 0.271 0.278 0.312 0.289 0.295 0.295 0.297 0.279 0.282 0.286 0.295 0.295 0.281 0.3 0.282 0.286 0.27 0.292 0.282 0.286 0.27 0.292 0.271 0.278 0.259 0.285 y x y x y x y x b2 b1 a2 a1
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 11 xu ` wu x\ wu \ w wu _\ wu _ w xu \ w yu _ w wu ^\ zu y w w ? ? ? ? ? ?g t ? ? ? goh ? ?? ? p x y yu [ w [ z j? ? ? ? ? ? y h? ? ? ? [ z j ? ? ? ??? j ? ? ? ??? x cj?????? g???? ? ??e attenti o n m a rki n g o n led i s common a n ode(+) 8. packing ( t o l e r a n c e : 0. 2, unit: mm ) 7.out l ine dimension 0.2 2.0 60 30 -3 +0 0 . 2 lable 11.4 0.3 9. 0 0 . 1 18 0 13 10 22 3.83 0.1 5 8 0. 1 1.7 5 0 .1 3.5 0.1 8 1 . 0 0. 1 3. 1 0. 1 2. 0 0 . 0 5 4. 0 0. 1 1. 5 5 0 . 0 5 0. 2 2 0 . 0 5 2. 22 0. 1 (1 ) quantity : 20 00pcs/ ree l (2 ) cu mu la t i ve t o le r a nce : cu mu la t i ve t o le r a nc e/10 p i t c h e s t o b e 0. 2mm (3 ) ad hesion stre ng th of cover t a p e : ad hesi on st r e n g th to be 0 . 1- 0. 7n wh e n the c o v e r tape i s tur n ed off from the car r i e r tape a t the a n gl e of 10o t o the car r i e r tape ( 4 ) packa g e : p/n, manufactu ri n g data code n o . and qua n ti ty to be i n di cated o n a damp pr oof packag e
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 12 1 si d e o u t e r b o x s t ru ct u r e m a t e r i a l : p a p e r( s w 3 b (b )) a b c 1 h u m i di t y i n di c a tor a l u m i n um v i nyl b a g r eel d e si pa k pa r t n u m ber : l o t nu m b e r : x x x x xx xxx x q u a n t i t y : xx xx s e o u l s e m i c o ndu c t or c o . , l t d . pa r t n u m ber : l o t nu m b e r : x x x x xx xxx x q u a n t i t y : xx xx s e o u l s e m i c o ndu c t or c o . , l t d . pa r t n u m ber : l o t nu m b e r : x x x x xx xxx x q u a n t i t y : xx xx s e o u l s e m i c o ndu c t or c o . , l t d . ty p e 7i nc h si z e ( m m) 22 0 24 5 24 5 2 2 0 a b 10 2 14 2 c ac r i c h e se m i c o nd u c t o r ec o l i g h t ro h s tu v ma d e i n k o r e a
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 13 9. s o lde r ing 10 sec. max. soldering t i me condit ion 24 0 le a d s o l d e r 2. 5 ~ 5 c / se c . o o o pre - h e a t i n g 120 ~ 1 5 0 c 120 s ec. m a x . 60 s e c . m a x . ab o v e 20 0 c o 2 4 0 c m ax. 10 s ec. m a x . 2. 5 ~ 5 c / s e c . (1) lead so lde r 10 sec. max. soldering t i me condit ion 26 0 260 c m a x . o 60 se c. m a x . a b o v e 22 0 c 1 20sec. m a x . pr e - h e at i n g 1 50~ 2 0 0 c 1 ~ 5 c / sec. o o o o 1 ~ 5 c / sec. l e ad-fram e s o l d e r (2) lead-fre e s o lde r 10 sec. m a x . (3) han d so l d e r in g co n d it io ns d o n o t excee d 4 s e con d s at max i mum 315oc und er so l d er in g iron. (4) t h e enca ps ulated mate r i al of t h e leds is s ili con e . prec au t i on s s h ou ld be t a ken to avoid th e s t rong pres sure on th e enc a p s u l at ed p a r t . so w h e n u s in g t h e c h i p m o u n t e r, th e p i ckin g up nozzl e th a t do e s n o t af f e ct th e sil i c o n e resi g n s h o u ld be use d . n o te : in c a s e th at th e s o lde r e d produ c t s ar e reu s e d in s o lde r ing proc e s s , we do n ? t gu aran t e e the produ c t s .
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 14 10. p r ecaution for use (1 ) storage i n o r d e r to a v o i d the a b so r p ti on o f m o i s tu r e , i t i s r e comme n d e d to s t o r e i n a d r y b o x (or a desica t o r) with a des i c c ant. oth e rwis e, t o st or e th e m in th e fo llowing envir o n m en t is r e c o mm end e d. tempera t ure : 5oc ~ 30oc hum i d i ty : maximum 70%rh (2 ) att e nt ion after open. l e d is c o rr e s p o n d t o s m d, wh en l e d be s o ld e r ed di p, in t e rf ac ial s ep arat i o n may affect th e light tran smiss i on efficiency, ca u s in g t h e li gh t i n t e n s it y t o drop. at t e n t i o n i n followed; keepi n g of a fraction tempera t ure : 5 ~ 40oc hum i d i ty : le ss tha n 10% (3 ) in the case of more than 1 week passed after op en ing or chang e c o lor of ind i cat o r on des i c c an t, c o mp on en t s shall b e dried 10-12hr. at 60 5o c. (4 ) an y mechan i c al force or any excess vi brat ion shall n o t be ac c e pt ed t o app l y durin g cooling proc ess t o norm a l t e mp eratur e after so ld er ing. (5 ) qui c k c ooli n g shall be avoided. (6) c o mp on en ts s h all n o t be m o u n t ed o n warped d i re c t io n of pc b. (7) anti radioac t ive ray des i gn is n o t c o ns id er ed for th e p r odu c ts. (8 ) thi s devi ce sh ou l d not be used in any type of fluid su c h as water, oil, organ i c s o lv e n t et c. wh en w a sh in g i s req u ir ed, ip a sh o u ld b e u s ed . (9 ) when th e le ds are ill uminat i n g, oper at ing c u rren t sh ou ld b e decid e d after c o ns id er ing th e amb i en t maximum t e mp eratur e . (10) the le ds mus t be s o ld ere d wit h in s e ven days a f ter open i n g th e moi s ture-proof packing. (11) repack unused products wi th anti -moi stu r e packi n g, fol d t o close any open i n g and th en st ore in a dry plac e. (12) the appearan c e and spec ifica t ions of the prod uc t may be modif i ed for i m provement wi th out not i ce.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 15 11. handl i ng o f s i l i cone r e sin l e d s (1 ) during proc es sing, mechanical stress on th e surfac e sh ou ld b e min i miz e d as much as poss ib le. sh arp ob jec t s of all typ e s sh ou ld n o t be us ed t o pierc e t h e sealing c o mp ou nd. (2 ) in general , leds sh ou l d on l y b e handled fr om th e si de. b y the wa y , thi s also applies t o led s wi thout a sili co ne seal an t, sinc e th e su rface can als o bec o me scratch ed. (3 ) w h e n p o pul a ti ng bo a r ds i n s m t p r o d uc t i on, there are basically no restrict ion s regard ing t h e form of the p i ck and plac e n o zzl e, excep t th at mechanic al pressure on t h e surface of the re s i n mu st b e preve n t e d. this is as su red by choosing a pick and pl ac e n o zzle which is larg er tha n th e le d?s reflect o r area. (4 ) si li con e di ffers from mat e ri als convent i onall y used for t h e man u facturi n g of le ds. thes e c o nd it ions mu s t be c o n s id er ed dur i ng t h e hand ling of such devices. comp ared t o stan dard en capsu l ant s , silicon e is gen e rall y soft er, and the surface i s more l i k el y t o attract du st . as men t ion e d previous ly, the in creas e d s e n s i t i v i t y t o du st requ ir es sp e c ia l car e durin g proc ess i ng. in c a s e s where a min i mal level of dirt and dust partic les can n o t be guarant e ed, a suitab le c l ean i ng s o lu t i on mus t b e app l ied t o the surfac e after the soldering of compon en t s . ( 5 ) ssc su gge st s u s in g is o p r o py l al c o h o l f o r cl ean i n g . in cas e o t h e r s o lv en t s are u s ed, it mus t be as s u red t h at th es e solven t s do n o t d i s s olve t h e package or resin. ul trason i c clean i ng i s n o t recommended. ultr a s on ic c l ean i ng may caus e damag e t o th e led.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) 16 12. reliability test it em and condi t ion 0/22 3 time 1kv at 1.5 k ? ; 100pf mil-std - 883d esd(h b m ) 0/22 1000 hour s t a =-40 o c, i f =20ma in t e rna l re fe re nce lo w temp erat ure li fe test 0/22 500 hour s t a =85 o c, i f =20ma in t e rna l re fe re nce high temp erat ure li fe test 0/22 300 hour s t a =85 o c, rh =85%, i f =15ma in t e rna l re fe re nce high temp erat ure high hum i d i ty li fe test 0/22 1000 hour s t a =25 o c, i f =20ma in t e rna l re fe re nce opera t ing enduran c e te st 0/22 1000 hour s t a =-40 o c eiaj ed - 4701 lo w temp erat ure st orag e 0/22 1000 hour s t a =85 o c, rh =85% eiaj ed - 4701 high temp erat ure high hum i d i ty st orag e 0/22 1000 hour s t a =100 o c eiaj ed - 4701 high temp erat ure st orag e 0/22 100 cycle t a =-40 o c (30min) ~ 2 5 o c (5 min) ~ 100 o c (30min) ~ 25 o c (5 min) eiaj ed - 4701 temp erat ure cycle 0/22 100 cycle t a =-40 o c (30min) ~ 1 0 0 o c (30 m in) eiaj ed - 4701 thermal sh ock numb er of damage durat ion / cycle test cond it ion re fe re nce ite m cr iteria f o r ju d g in g th e damage - lsl *2 0.5 i f =20ma i v lu min o us in t e n s ity us l *1 2.0 - v r =5v i r r e vers e curren t us l *1 1.2 - i f =20ma v f forward voltag e max min c r it er ia f o r j u dgem e n t condit ion symbol ite m note : * 1 us l : upper st a n dar d lev e l *2 ls l : lower s t an dar d lev e l

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