7- 17 description the HSCH-9551 is an integrated antiparallel pair of gaas schott- ky barrier diodes. it is a beamless version of the hsch-9251 anti- parallel pair beam lead diode. applications the HSCH-9551 is a high-perfor- mance millimeter wave diode that can be used as a sub-har- monically pumped mixer or frequency multiplier in micro- wave and millimeter wave transceivers. agilent HSCH-9551 gaas schottky diode antiparallel pair data sheet chip size: 620 325 m m (24.4 12.8 mils) chip size tolerance: 10 m m ( 0.4 mils) chip thickness: 100 m m ( 4 mils) chip thickness tolerance: 15 m m ( 0.6 mils) bond pad sizes: 100 200 m m (3.9 7.9 mils) this data sheet contains a variety of typical and guaranteed performance data. the information supplied should not be interpreted as a complete list of circuit specifications. in this data sheet the term typical refers to the 50th percentile performance. for additional information contact your local agilent technologies sales representative. features ? low junction capacitance ? typically 40 ff ? low series resistance ? typically 3 w ? large bond pads suitable for automated wire-bonding or flip-chip assembly ? polyimide scratch protection specifications ? v f (1 ma): 700-800 mv ? v f (10 ma): 800-850 mv ? r s (5 ma): <6 w ? c j (per diode): <0.050 pf assembly techniques gaas schottky diodes are esd sensitive. esd preventive mea- sures must be employed in all as- pects of storage, handling, and assembly. esd precautions, handling con- siderations, die attach and bond- ing methods are critical factors in successful diode performance and reliability. agilent application note #54, "gaas mmic esd, die attach and bonding guidelines" pro- vides basic information on these subjects.
7- 18 hmmc-xxxx /rev.x.x notes:
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