HF30A060ACE preliminary data sheet pd-20608 rev.a 11/98 hexfred die in wafer form 600 v size 30 5" wafer nominal back metal composition, thickness cr-ni-ag ( 1ka-4ka-6ka ) nominal front metal composition, thickness 99% al, 1% si (3 microns) chip dimensions 0.115" x 0.155" wafer diameter 125mm, with std. < 100 > flat wafer thickness .015" .003" relevant die mechanical dwg. number 01-5161 minimum street width 100 microns reject ink dot size 0.25mm diameter minimum recommended storage environment store in original container, in dessicated nitrogen, with no contamination mechanical data die outline reference standard ir packaged part ( for design ) : hfa15tb60 parameter description guaranteed (min/max) test conditions v fm forward voltage 1.7v max. t j = 25c, i f = 15.0a bv r reverse breakdown voltage 600v min. t j = 25c, i r = 200a i rm reverse leakage current 10a max. t j = 25c, v r = 600v electrical characteristics ( wafer form ) notes : 1. all dimensions are shown in millimeters ( inches ) 2. controlling dimension : ( inch ) 3. dimensional tolerances : bonding pads : < 0.635 tolerance = 0.013 width < (.0250) tolerance = (.0005) & > 0.635 tolerance = 0.025 length > (.0250) tolerance = (.0010) overalldie < 1.270 tolrance = 0.102 width < (.050) tolerance = (.004) & > 1.270 tolerance = 0.203 length > (.050) tolerance = (.008)
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