? semiconductor components industries, llc, 2003 january, 2003 - rev. 0 1 publication order number: murb1620ctr/d murb1620ctr preferred device switchmode ? power rectifier d 2 pak power surface mount package . . . designed for use in negative switching power supplies, inverters and as free wheeling diodes. also, used in conjunction with common cathode dual ultrafast rectifiers, makes a single phase full-wave bridge. these state-of-the-art devices have the following features: ? common anode dual rectifier (8.0 a per leg or 16 a per package) ? ultrafast 35 nanosecond reverse recovery times ? exhibits soft recovery characteristics ? high temperature glass passivated junction ? low leakage specified @ 150 c case temperature ? current derating @ both case and ambient temperatures ? epoxy meets ul94, v o @ 1/8 ? complement to murb1620ct common cathode device mechanical characteristics: ? case: epoxy, molded ? weight: 1.7 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds ? shipped 50 units per plastic tube ? available in 24 mm tape and reel, 800 units per reel by adding a t4o suffix to the part number ? marking: u1620r maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward voltage (rated v r , t c = 160 c) per leg per total device i f(av) 8.0 16 a peak repetitive surge current (rated v r , square wave, 20 khz, t c = 140 c) per diode i fm 16 a non-repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction and storage temperature range t j , t stg -65 to +175 c device package shipping ordering information murb1620ctr d 2 pak 50 units/rail ultrafast rectifier 16 amperes 200 volts 1 3 2, 4 preferred devices are recommended choices for future use and best overall value. http://onsemi.com d 2 pak case 418b style 5 3 4 1 marking diagram murb1620ctrt4 d 2 pak 800/tape & reel yww u1620r = specific device code y = year ww = work week u1620r
murb1620ctr http://onsemi.com 2 thermal characteristics (per leg) rating symbol value unit thermal resistance - junction to case r q jc 2.0 c/w electrical characteristics (per leg) maximum instantaneous forward voltage (note 1) (i f = 8.0 amps, t c = 25 c) (i f = 8.0 amps, t c = 150 c) v f 1.2 1.1 volts maximum instantaneous reverse current (note 1) (rated dc voltage, t c = 25 c) (rated dc voltage, t c = 150 c) i r 5.0 500 m a maximum reverse recovery time (i f = 1.0 amp, di/dt = 50 amps/ m s) (i f = 0.5 amp, di/dt = 100 amps/ m s) t rr 85 35 ns 1. pulse test: pulse width = 5.0 ms, duty cycle 10%. dc figure 1. typical forward voltage (per leg) v f, instantaneous voltage (volts) 0 0.6 0.4 0.8 30 0.1 0.3 0.2 2.0 1.0 100 20 7.0 3.0 0.5 5.0 50 v r , reverse voltage (volts) 060 40 100 120 500 1000 0.1 0.05 0.02 10 5 2 200 50 20 100 t j = 175 c 20 80 200 figure 2. typical reverse current* (per leg) t c , case temperature ( c) 140 150 0 4.0 2.0 6.0 10 8.0 14 12 180 figure 3. current derating, case (per leg) 0.7 10 70 1.0 1.4 1.2 100 c t j = 175 c 25 c 160 180 140 1 0.5 0.2 100 c 25 c 160 170 16 rated v r applied square wave 0.2 150 c r jc = 2 c/w 0.01 150 c * the curves shown are typical for the highest voltage device in the voltage grouping. typical reverse current for lower voltage selections can be estimated from these same curves if v r is sufficiently below rated v r . i r , reverse current ( a) i f(av) , average forward current (amps) i f , instantaneous forward current (amps)
murb1620ctr http://onsemi.com 3 0 4.0 2.0 4.0 6.0 8.0 0 8.0 12 16 i f(av) , average forward current (amps) figure 4. power dissipation (per leg) t j = 175 c dc square wave 2.0 6.0 10 14 10 12 14 16 p f(av) , average power dissipation (watts) 0.01 0.02 0.05 0.1 0.2 0.5 1.0 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000 t, time (ms) figure 5. thermal response d = 0.5 0.05 single pulse p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 z q jc(t) = r(t) r q jc d curves apply for power pulse train shown read time at t 1 t j(pk) - t c = p (pk) z q jc(t) 1000 0 200 100 300 1.0 10 100 v r , reverse voltage (volts) figure 6. typical capacitance (per leg) c, capacitance (pf) 0.1 0.01 400 500 600 700 800 900 0.1 0.2 0.3 0.5 0.7 0.2 0.3 0.5 0.7 20 30 50 70 r(t), transient thermal resistance (normalized)
murb1620ctr http://onsemi.com 4 information for using the d 2 pak surface mount package minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 0.33 8.38 0.04 1.016 0.67 17.02 0.42 10.66 0.12 3.05 0.24 6.096 d 2 pak power dissipation the power dissipation of the d 2 pak is a function of the drain pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient; and the operating temperature, t a . using the values provided on the data sheet for the d 2 pak package, p d can be calculated as follows: p d = t j(max) - t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 3.0 watts. p d = 175 c - 25 c = 3.0 watts 50 c/w the 50 c/w for the d 2 pak package assumes the recommended drain pad area of 158k mil 2 on fr-4 glass epoxy printed circuit board to achieve a power dissipation of 3.0 watts using the footprint shown. another alternative is to use a ceramic substrate or an aluminum core board such as thermal clad ? . by using an aluminum core board material such as thermal clad, the power dissipation can be doubled using the same footprint. general soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 5 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * due to shadowing and the inability to set the wave height to incorporate other surface mount components, the d 2 pak is not recommended for wave soldering.
murb1620ctr http://onsemi.com 5 recommended profile for reflow soldering for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must set temperatures for several heating zones, and a figure for belt speed. taken together, these control settings make up a heating profileo for that particular circuit board. on machines controlled by a computer, the computer remembers these profiles from one operating session to the next. figure 7 shows a typical heating profile for use when soldering the d 2 pak to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. the two profiles are based on a high density and a low density board. the vitronics smd310 convection/infrared reflow soldering system was used to generate this profile. the type of solder used was 62/36/2 tin lead silver with a melting point between 177 -189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 ramp" step 2 vent soak" step 3 heating zones 2 & 5 ramp" step 4 heating zones 3 & 6 soak" step 5 heating zones 4 & 7 spike" step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies desired curve for high mass assemblies 100 c 150 c 160 c 170 c 140 c figure 7. typical solder heating profile for d 2 pak
murb1620ctr http://onsemi.com 6 package dimensions d 2 pak case 418b-04 issue h seating plane s g d -t- m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 -b- m b w w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 418b-01 thru 418b-03 obsolete, new standard 418b-04. f 0.310 0.350 7.87 8.89 l 0.052 0.072 1.32 1.83 m 0.280 0.320 7.11 8.13 n 0.197 ref 5.00 ref p 0.079 ref 2.00 ref r 0.039 ref 0.99 ref m l f m l f m l f variable configuration zone r n p u view w-w view w-w view w-w 123 style 5: pin 1. cathode 2. anode 3. cathode 4. anode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. typicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including typicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and re asonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employ er. publication ordering information japan : on semiconductor, japan customer focus center 2-9-1 kamimeguro, meguro-ku, tokyo, japan 153-0051 phone : 81-3-5773-3850 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. murb1620ctr/d switchmode is a trademark of semiconductor components industries, llc. thermal clad is a registered trademark of the bergquist company. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax : 303-675-2176 or 800-344-3867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 800-282-9855 toll free usa/canada
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