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data sheet july 2000 FC250F1 power module: dc-dc converter; 18 vdc to 36 vdc input, 3.3 vdc output; 165 w the FC250F1 power module uses advanced, surface-mount technology and delivers high-quality, compact, dc-dc conversion at an economical price. applications n redundant and distributed power architectures n computer equipment n communications equipment options n heat sinks available for extended operation features n size: 61.0 mm x 116.8 mm x 13.5 mm (2.40 in. x 4.60 in. x 0.53 in.) n wide input voltage range n high ef?iency: 78% typical n parallel operation with load sharing n adjustable output voltage n overtemperature protection n output voltage set-point adjustment (trim) n synchronization n power good signal n output current monitor n output overvoltage and overcurrent protection n remote sense n remote on/off n constant frequency n case ground pin n input-to-output isolation n iso * 9001 certi?d manufacturing facilities n ul ? 1950 recognized, csa c22.2 no. 950-95 certi?d, and vde 0805 (en60950, iec950) licensed description the FC250F1 power module is a dc-dc converter that operates over an input voltage range of 18 vdc to 36 vdc and provides a precisely regulated dc output. the outputs are fully isolated from the inputs, allowing versatile polarity con?urations and grounding connections. the module has a maximum power rating of 165 w at a typ- ical full-load ef?iency of 78%. two or more modules may be paralleled with forced load sharing for redundant or enhanced power applications. the package, which mounts on a printed-circuit board, accommodates a heat sink for high-temperature applications. * iso is a registered trademark of the international organization of standardization. ? ul is a registered trademark of underwriters laboratories, inc. csa is a registered trademark of canadian standards association. vde is a trademark of verband deutscher elektrotechniker e.v.
2 lucent technologies inc. data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; absolute maximum ratings stresses in excess of the absolute maximum ratings can cause permanent damage to the device. these are abso- lute stress ratings only. functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. exposure to absolute maximum ratings for extended periods can adversely affect device reliability. electrical speci?ations unless otherwise indicated, speci?ations apply over all operating input voltage, resistive load, and temperature conditions. table 1. input speci?ations fusing considerations caution: this power module is not internally fused. an input line fuse must always be used. this encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. to preserve maximum ?xibility, internal fus- ing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. the safety agencies require a normal-blow fuse with a maximum rating of 25 a (see safety considerations section). based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. refer to the fuse manufacturers data for further information. parameter symbol min max unit input voltage (continuous) v i 50 vdc i/o isolation voltage (for 1 minute) 1500 vdc operating case temperature (see thermal considerations section and figure 18.) t c ?0 100 ? storage temperature t stg ?5 125 ? parameter symbol min typ max unit operating input voltage v i 18 28 36 vdc maximum input current (v i = 0 v to 36 v) i i, max 15 a inrush transient i 2 t 4.0 a 2 s input re?cted-ripple current, peak-to-peak (5 hz to 20 mhz, 12 ? source impedance; see figure 8.) i i 10 map-p input ripple rejection (120 hz) 60 db
lucent technologies inc. 3 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; electrical speci?ations (continued) table 2. output speci?ations * consult your sales representative or the factory. ? these are manufacturing test limits. in some situations, results may differ. parameter symbol min typ max unit output voltage set point (v i = 28 v; i o = i o, max ; t c = 25 ?) v o, set 3.25 3.3 3.35 vdc output voltage (over all operating input voltage, resistive load, and temperature conditions until end of life; see figure 10 and feature descriptions.) v o 3.20 3.40 vdc output regulation: line (v i = 18 v to 36 v) load (i o = i o, min to i o, max ) temperature (t c = ?0 ? to +100 ?) 0.01 0.05 15 0.1 0.2 50 %v o %v o mv output ripple and noise voltage (see figures 4 and 9.): rms peak-to-peak (5 hz to 20 mhz) 40 150 mvrms mvp-p external load capacitance 0 * f output current (at i o < i o, min , the modules may exceed output ripple speci?ations.) i o 0.5 50 a output current-limit inception (v o = 90% of v o, set ; see feature descriptions.) i o, cli 51.5 57.5 65 ? %i o, max output short-circuit current (v o = 1.0 v; inde?ite duration, no hiccup mode; see figure 2.) 150 %i o, max ef?iency (v i = 28 v; i o = i o, max ; t c = 25 ?; see figures 3 and 10.) h ?8 % switching frequency 500 khz dynamic response ( d i o / d t = 1 a/10 ?, v i = 28 v, t c = 25 ?; tested with a 10 ? aluminum and a 1.0 ? ceramic capacitor across the load; see figures 5 and 6.): load change from i o = 50% to 75% of i o, max : peak deviation settling time (v o < 10% of peak deviation) load change from i o = 50% to 25% of i o, max : peak deviation settling time (v o < 10% of peak deviation) 50 200 50 200 mv ? mv ?
4 lucent technologies inc. data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; electrical speci?ations (continued) table 3. isolation speci?ations general speci?ations feature speci?ations unless otherwise indicated, speci?ations apply over all operating input voltage, resistive load, and temperature conditions. see feature descriptions for further information. table 4. feature speci?ations * these are manufacturing test limits. in some situations, results may differ. parameter min typ max unit isolation capacitance 1700 pf isolation resistance 10 m w parameter min typ max unit calculated mtbf (i o = 80% of i o, max ; t c = 40 ?) 1,900,000 hours weight 200 (7) g (oz.) parameter symbol min typ max unit remote on/off signal interface (v i = 0 v to 36 v; open collector or equivalent compatible; signal referenced to v i (? terminal; see figure 11 and feature descriptions.): logic low?odule on logic high?odule off logic low: at i on/off = 1.0 ma at v on/off = 0.0 v logic high: at i on/off = 0.0 ? leakage current turn-on time (i o = 80% of i o, max ; v o within ?% of steady state) output voltage overshoot v on/off i on/off v on/off i on/off 0 30 0 1.2 1.0 15 50 50 5 v ma v ? ms %v o, set output voltage adjustment (see feature descriptions.): output voltage remote-sense range output voltage set-point adjustment range (trim) 60 1.2 110 v %v o, nom output overvoltage protection 4* 5* v output current monitor (i o = i o, max , t c = 70 ?) i o, mon 0.067 v/a synchronization: clock amplitude clock pulse width fan-out capture frequency range 4.00 0.4 450 5.00 1 550 v ? khz
lucent technologies inc. 5 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; feature speci?ations (continued) table 4. feature speci?ations (continued) solder, cleaning, and drying considerations post solder cleaning is usually the ?al circuit-board assembly process prior to electrical testing. the result of inad- equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the ?ished circuit-board assembly. for guidance on appropriate soldering, cleaning, and drying procedures, refer to lucent technologies board-mounted power modules soldering and cleaning application note (ap97-021eps). parameter symbol min typ max unit overtemperature protection (see figure 18.) t c 105 c forced load share accuracy 10 %i o, rated power good signal interface (see feature descriptions.): low impedance?odule operating high impedance?odule off r pwr/good i pwr/good r pwr/good v pwr/good 1 100 1 40 w ma m w v
6 6 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 characteristic curves the following ?ures provide typical characteristics for the power module. 8-2875 (f) figure 1. typical FC250F1 input characteristics at room temperature 8-3277 (f) figure 2. typical FC250F1 output characteristics at room temperature 8-2876 (f) figure 3. typical FC250F1 ef?iency vs. output current at room temperature 8-2877 (f) note: see figure 9 for test conditions. figure 4. typical FC250F1 output ripple voltage at room temperature and 50 a output 12 10 0 input voltage, v i (v) input current, i i (a) 8 6 4 2 0 5 10152025303540 i o = 50 a i o = 25 a i o = 5 a 3.5 3 0 output current, i o (a) output voltage, v o (v) 2.5 2 1.5 1 0.5 20 30 40 50 60 70 0 10 v i = 36 v v i = 28 v v i = 18 v 81 80 0 output current, i o (a) efficiency, h (%) 79 78 77 76 71 5 101520253035 50 v i = 18 v v i = 28 v v i = 36 v 75 74 73 72 40 45 time, t (500 ns/div) output voltage, v o (a) (20 mv/div) v i = 36 v v i = 28 v v i = 18 v
lucent technologies inc. 7 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; characteristic curves (continued) 8-2881 (f) note: tested with a 10 ? aluminum and a 1.0 ? ceramic capacitor across the load. figure 5. typical FC250F1 transient response to step decrease in load from 50% to 25% of full load at room temperature and 28 v input (waveform averaged to eliminate ripple component.) 8-2878 (f) note: tested with a 10 ? aluminum and a 1.0 ? ceramic capacitor across the load. figure 6. typical FC250F1 transient response to step increase in load from 50% to 75% of full load at room temperature and 28 v input (waveform averaged to eliminate ripple component.) 8-2882 (f) note: tested with a 10 ? aluminum and a 1.0 ? ceramic capacitor across the load. figure 7. typical FC250F1 start-up transient at room temperature, 28 v input, and full load time, t (20 m s/div) output voltage, v o (v) (100 mv/div) output current, i o (a) (5 a/div) time, t (20 m s/div) output voltage, v o (v) (100 mv/div) output current, i o (a) (5 a/div) time, t (5 ms/div) output voltage, v o (v) (1 v/div) no capacitance 5870 m f full load 2200 m f full load 1000 m f full load 470 m f full load no load
8 8 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 test con?urations 8-203 (c).o note: measure input re?cted-ripple current with a simulated source inductance (l test ) of 12 ?. capacitor c s offsets possible bat- tery impedance. measure current as shown above. figure 8. input re?cted-ripple test setup 8-513 (c).m note: use a 0.1 ? ceramic capacitor and a 10 ? aluminum or tantalum capacitor. scope measurement should be made using a bnc socket. position the load between 50 mm and 76 mm (2 in. and 3 in.) from the module. figure 9. peak-to-peak output noise measurement test setup 8-683 (c).f note: all measurements are taken at the module terminals. when socketing, place kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. figure 10. output voltage and ef?iency measurement test setup design considerations input source impedance the power module should be connected to a low ac-impedance input source. highly inductive source impedances can affect the stability of the power mod- ule. for the test con?uration in figure 8, a 100 ? electrolytic capacitor (esr < 0.3 w at 100 khz) mounted close to the power module helps ensure sta- bility of the unit. for other highly inductive source impedances, consult the factory for further application guidelines. safety considerations for safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., ul -1950, csa 22.2 no. 95-950, and vde 0805 (en60950, iec950). for the converter output to be considered meeting the requirements of safety extra-low voltage (selv), the input must meet selv requirements. if the input meets extra-low voltage (elv) require- ments, then the converters output is considered elv. the input to these units is to be provided with a maxi- mum 25 a normal-blow fuse in the ungrounded lead. feature descriptions overcurrent protection to provide protection in a fault (output overload) condi- tion, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlim- ited duration. at the point of current-limit inception, the unit shifts from voltage control to current control. if the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). the unit operates normally once the output current is brought back into its speci?d range. to oscilloscope 12 ? v i (+) v i (? battery l test cs 220 ? esr < 0.1 w @ 20 c, 100 khz 100 ? esr < 0.3 w @ 100 khz v o (+) v o (? 1.0 ? resistive load scope copper strip 10.0 ? v i (? v o (+) sense(+) sense(? v o (? v i (+) i o load contact and distribution losses supply i i contact resistance h v o + () v o () [] i o v i + () v i () [] i i ------------------------------------------------- - ? ?? x 100 % =
lucent technologies inc. 9 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; feature descriptions (continued) remote on/off to turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the v i (? terminal (v on/off ). the switch can be an open collector or equivalent (see figure 11). a logic low is v on/off = 0 v to 1.2 v, during which the module is on. the maximum i on/off during a logic low is 1 ma. the switch should maintain a logic-low voltage while sinking 1 ma. during a logic high, the maximum v on/off generated by the power module is 15 v. the maximum allowable leakage current of the switch at v on/off = 15 v is 50 ?. if not using the remote on/off feature, short the on/off pin to v i (?. 8-580 (c).d figure 11. remote on/off implementation remote sense remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. the voltage between the remote-sense pins and the output terminals must not exceed the out- put voltage sense range given in the feature speci?a- tions table, i.e.: [v o (+) ?v o (?] ?[sense(+) ?sense(?] 1.2 v the voltage between the v o (+) and v o (? terminals must not exceed the minimum value indicated in the output overvoltage protection section of the feature speci?ations table. this limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim), see figure 12. if not using the remote-sense feature to regulate the out- put at the point of load, connect sense(+) to v o (+) and sense(? to v o (? at the module. although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. the maximum increase is the larger of either the remote sense or the trim. consult the factory if you need to increase the output voltage more than the above limitation. the amount of power delivered by the module is de?ed as the voltage at the output terminals multiplied by the output current. when using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. 8-651 (c).e figure 12. effective circuit con?uration for single-module remote-sense operation output voltage set-point adjustment (trim) output voltage trim allows the user to increase or decrease the output voltage set point of a module. this is accomplished by connecting an external resistor between the trim pin and either the sense(+) or sense(? pins. the trim resistor should be positioned close to the module. if not using the trim feature, leave the trim pin open. with an external resistor between the trim and sense(? pins (r adj-down ), the output voltage set point (v o, adj ) decreases (see figure 13). the following equa- tion determines the required external-resistor value to obtain a percentage output voltage change of d %. the test results for this con?uration are displayed in figure 14. this ?ure applies to all output voltages. + i on/off v on/off case on/off v i (+) v i (? sense(+) sense(? v o (+) v o (? v o (+) sense(+) sense(? v o (? v i (+) v i (? i o load contact and distribution losses supply i i contact resistance r adj-down 205 d % --------- - 2.255 ? ?? k w =
10 10 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 feature descriptions (continued) output voltage set-point adjustment (trim) (continued) with an external resistor connected between the trim and sense(+) pins (r adj-up ), the output voltage set point (v o, adj ) increases (see figure 15). the following equation determines the required exter- nal-resistor value to obtain a percentage output voltage change of d %. the test results for this con?uration are displayed in figure 16. the voltage between the v o (+) and v o (? terminals must not exceed the minimum value of the output over- voltage protection as indicated in the feature speci? cations table. this limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). see figure 12. although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. the maximum increase is the larger of either the remote sense or the trim. consult the factory if you need to increase the output voltage more than the above limitation. the amount of power delivered by the module is de?ed as the voltage at the output terminals multiplied by the output current. when using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. 8-748 (c).b figure 13. circuit con?uration to decrease output voltage 8-2883 (f) figure 14. resistor selection for decreased output voltage 8-715 (c).b figure 15. circuit con?uration to increase output voltage 8-2884 (f) figure 16. resistor selection for increased output voltage r adj-up v o, nom 1 d % 100 --------- - + () 1.225 () 1.225 d % () ------------------------------------------------------------------------- 205 2.255 ? ? ? ?? k w = v i (+) v i (? on/off case v o (+) v o (? sense(+) trim sense(? r adj-down r load 1m 0 % change in output voltage ( d %) adjustment resistor value ( w ) 10k 1k 10 20 40 30 100k v i (+) v i (? on/off case v o (+) v o (? sense(+) trim sense(? r adj-up r load 1m 100k 0 % change in output voltage ( d %) adjustment resistor value ( w ) 10k 24 10 6 8
lucent technologies inc. 11 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; feature descriptions (continued) output overvoltage protection the output voltage is monitored at the v o (+) and v o (? pins of the module. if the voltage at these pins exceeds the value indicated in the feature speci?ations table, the module will shut down and latch off. recovery from latched shutdown is accomplished by cycling the dc input power off for at least 1.0 second or toggling the primary referenced on/off signal for at least 1.0 second. output current monitor the current mon pin provides a dc voltage propor- tional to the dc output current of the module given in the feature speci?ations table. for example, on the FC250F1, the v/a ratio is set at 67 mv/a 10% @ 70 c case. at a full load current of 50 a, the voltage on the current mon pin is 3.685 v. the current moni- tor signal is referenced to the sense(? pin on the secondary and is supplied from a source impedance of approximately 2 k w . it is recommended that the cur- rent mon pin be left open when not in use, although no damage will result if the current mon pin is shorted to secondary ground. directly driving the cur- rent mon pin with an external source will detrimen- tally affect operation of the module and should be avoided. synchronization any module can be synchronized to any other module or to an external clock using the sync in or sync out pins. the modules are not designed to operate in a master/slave con?uration; that is, if one module fails, the other modules will continue to operate. sync in pin this pin can be connected either to an external clock or directly to the sync out pin of another fc250x mod- ule. if an external clock signal is applied to the sync in pin, the signal must be a 500 khz (?0 khz) square wave with a 4 vp-p amplitude. operation outside this frequency band will detrimentally affect the perfor- mance of the module and must be avoided. if the sync in pin is connected to the sync out pin of another module, the connection should be as direct as possible, and the v i (? pins of the modules must be shorted together. unused sync in pins should be tied to v i (?. if the sync in pin is unused, the module will operate from its own internal clock. sync out pin this pin contains a clock signal referenced to the v i (? pin. the frequency of this signal will equal either the mod- ules internal clock frequency or the frequency estab- lished by an external clock applied to the sync in pin. when synchronizing several modules together, the modules can be connected in a daisy-chain fashion where the sync out pin of one module is connected to the sync in pin of another module. each module in the chain will synchronize to the frequency of the ?st module in the chain. to avoid loading effects, ensure that the sync out pin of any one module is connected to the sync in pin of only one module. any number of modules can be synchronized in this daisy-chain fashion. overtemperature protection to provide protection in a fault condition, the unit is equipped with an overtemperature shutdown circuit. the shutdown circuit will not engage unless the unit is operated above the maximum case temperature. recovery from overtemperature shutdown is accomplished by cycling the dc input power off for at least 1.0 second or toggling the primary referenced on/ off signal for at least 1.0 second. forced load sharing (parallel operation) for either redundant operation or additional power requirements, the power modules can be con?ured for parallel operation with forced load sharing (see figure 17). for a typical redundant con?uration, schottky diodes or an equivalent should be used to protect against short-circuit conditions. because of the remote sense, the forward-voltage drops across the schottky diodes do not affect the set point of the voltage applied to the load. for additional power requirements, where multiple units are used to develop combined power in excess of the rated maximum, the schottky diodes are not needed.
12 12 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 feature descriptions (continued) forced load sharing (parallel operation) (continued) good layout techniques should be observed for noise immunity. to implement forced load sharing, the follow- ing connections must be made: n the parallel pins of all units must be connected together. the paths of these connections should be as direct as possible. n all remote-sense pins should be connected to the power bus at the same point, i.e., connect all sense(+) pins to the (+) side of the power bus at the same point and all sense(? pins to the (? side of the power bus at the same point. close proximity and directness are necessary for good noise immunity. when not using the parallel feature, leave the parallel pin open. 8-581 (c) figure 17. wiring con?uration for redundant parallel operation power good signal the pwr good pin provides an open-drain signal (referenced to the sense(? pin) that indicates the operating state of the module. a low impedance (<100 w ) between pwr good and sense(? indi- cates that the module is operating. a high impedance (>1 m w ) between pwr good and sense(? indi- cates that the module is off or has failed. the pwr good pin can be pulled up through a resistor to an external voltage to facilitate sensing. this external volt- age level must not exceed 40 v, and the current into the pwr good pin during the low-impedance state should be limited to 1 ma maximum. thermal considerations introduction the power modules operate in a variety of thermal environments; however, suf?ient cooling should be provided to help ensure reliable operation of the unit. heat-dissipating components inside the unit are ther- mally coupled to the case. heat is removed by conduc- tion, convection, and radiation to the surrounding environment. proper cooling can be veri?d by mea- suring the case temperature. peak temperature occurs at the position indicated in figure 18. 8-1303 (c).a note: top view, measurements shown in millimeters and (inches). pin locations are for reference only. figure 18. case temperature measurement location v o (+) parallel sense(+) sense(? v o (? case v i (+) on/off v i (? v o (+) parallel sense(+) sense(? v o (? case v i (+) on/off v i (? 30.5 (1.20) 82.6 (3.25) case sync in v i (? v i (+) v o (+) v o (? sync out measure case temperature here on/off
lucent technologies inc. 13 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; thermal considerations (continued) introduction (continued) the temperature at this location should not exceed 100 ?. the maximum case temperature can be limited to a lower value for extremely high reliability. the output power of the module should not exceed the rated power for the module as listed in the ordering information table. for additional information about these modules, refer to the lucent technologies thermal management for fc- and fw-series 250 w?00 w board-mounted power modules technical note (tn96-009eps). heat transfer without heat sinks derating curves for forced-air cooling without a heat sink are shown in figures 19 and 20. these curves can be used to determine the appropriate air?w for a given set of operating conditions. for example, if the unit with air?w along its length dissipates 20 w of heat, the correct air?w in a 40 ? environment is 1.0 m/s (200 ft./min.). 8-1315 (c) figure 19. convection power derating with no heat sink; air?w along width; transverse orientation 8-1314 (c) figure 20. convection power derating with no heat sink; air?w along length; longitudinal orientation heat transfer with heat sinks the power modules have through-threaded, m3 x 0.5 mounting holes, which enable heat sinks or cold plates to be attached to the module. the mounting torque must not exceed 0.56 n-m (5 in.-lb.). for a screw attachment from the pin side, the recommended hole size on the customers pwb around the mounting holes is 0.130 ?0.005 inches. if a larger hole is used, the mounting torque from the pin side must not exceed 0.25 n-m (2.2 in.-lb.). thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. total mod- ule thermal resistance ( q ca) is de?ed as the maximum case temperature rise ( d t c, max ) divided by the module power dissipation (p d ): the location to measure case temperature (t c ) is shown in figure 18. case-to-ambient thermal resis- tance vs. air?w for various heat sink con?urations is shown in figures 21 and 22. these curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. 0 10203040 100 0 40 60 70 local ambient temperature, t a ( c) power dissipation, p d (w) 30 20 10 90 80 70 60 50 50 4.0 m/s (800 ft./min.) 3.5 m/s (700 ft./min.) 3.0 m/s (600 ft./min.) 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 0.1 m/s (20 ft./min.) nat. conv. 0 10203040 100 0 40 60 70 local ambient temperature, t a ( c) power dissipation, p d (w) 30 20 10 90 80 70 60 50 4.0 m/s (800 ft./min.) 3.5 m/s (700 ft./min.) 3.0 m/s (600 ft./min.) 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 50 0.1 m/s (20 ft./min.) nat. conv. q ca d t c max , p d -------------------- - t c t a () p d ------------------------ ==
14 14 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 thermal considerations (continued) heat transfer with heat sinks (continued) 8-1321 (c) figure 21. case-to-ambient thermal resistance curves; transverse orientation 8-1320 (c) figure 22. case-to-ambient thermal resistance curves; longitudinal orientation these measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are gener- ally lower than the resistance of the heat sink by itself. the module used to collect the data in figures 21 and 22 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. to choose a heat sink, determine the power dissipated as heat by the unit for the particular application. figure 23 shows typical heat dissipation for a range of output currents and three voltages for the FC250F1. 8-2885 (f) figure 23. FC250F1 power dissipation vs. output current at 25 ? example if an 85 ? case temperature is desired, what is the minimum air?w necessary? assume the FC250F1 module is operating at v i = 28 v and an output current of 40 a, maximum ambient air temperature of 40 ?, and the heat sink is 1.0 inch. solution given: v i = 28 v i o = 40 a t a = 40 ? t c = 85 ? heat sink = 1.0 inch determine p d by using figure 23: p d = 35 w then solve the following equation: 0.0 0.5 3.0 3.5 4.0 4.5 2.5 2.0 1.0 1 1/2 in. heat sink 1 in. heat sink 1/2 in. heat sink 1/4 in. heat sink no heat sink 1.5 air velocity, m/s (ft./min.) 0 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) case-to-ambient thermal resistance, q ca ( c/w) 0 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) 0.0 0.5 3.0 3.5 4.0 4.5 2.5 2.0 1.0 1 1/2 in. heat sink 1 in. heat sink 1/2 in. heat sink 1/4 in. heat sink no heat sink 1.5 air velocity, m/s (ft./min.) case-to-ambient thermal resistance, q ca ( c/w) 50 45 0 output current, i o (a) power dissipation, p d (w) 40 35 30 25 0 5 101520253035 50 20 15 10 5 40 45 v i = 18 v v i = 28 v v i = 36 v q ca t c t a () p d ------------------------ = q ca 85 40 () 35 ----------------------- - = q ca 1.3 ?/w =
lucent technologies inc. 15 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; thermal considerations (continued) heat transfer with heat sinks (continued) use figures 21 and 22 to determine air velocity for the 1.0 inch heat sink. the minimum air?w necessary for this module depends on heat sink ? orientation and is shown below: n 1.0 m/s (200 ft./min.) (oriented along width) n 1.15 m/s (230 ft./min.) (oriented along length) custom heat sinks a more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. the total module resistance can be separated into a resistance from case-to-sink ( q cs) and sink-to-ambient ( q sa) as shown in figure 24. 8-1304 (c) figure 24. resistance from case-to-sink and sink- to-ambient for a managed interface using thermal grease or foils, a value of q cs = 0.1 ?/w to 0.3 ?/w is typical. the solution for heat sink resistance is: this equation assumes that all dissipated power must be shed by the heat sink. depending on the user- de?ed application environment, a more accurate model, including heat transfer from the sides and bot- tom of the module, can be used. this equation provides a conservative estimate for such instances. emc considerations for assistance with designing for emc compliance, please refer to the fltr100v10 data sheet (ds99-294eps). layout considerations copper paths must not be routed beneath the power module mounting inserts. for additional layout guide- lines, refer to the fltr100v10 data sheet (ds99-294eps). p d t c t s t a cs sa q sa t c t a () p d ------------------------ - q cs =
16 lucent technologies inc. data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; outline diagram dimensions are in millimeters and (inches). tolerances: x.x mm ?0.5 mm (x.xx in. ?0.02 in.), x.xx mm ?0.25 mm (x.xxx in. ?0.010 in.) 8-1650 (c).a * side label includes lucent logo, product designation, safety agency markings, input/output voltage and current ratings, and b ar code. top view side view bottom view case sync in on/off v i v i + 2.54 (0.100) typ v o v o + sync out sense sense+ trim parallel current mon pwr good 5.1 (0.20) 50.8 (2.00) 30.48 (1.200) 22.86 (0.900) 12.7 (0.50) 5.08 (0.200) 10.16 (0.400) 15.24 (0.600) 20.32 (0.800) 25.40 (1.000) 30.48 (1.200) 35.56 (1.400) 66.04 (2.600) mounting inserts m3 x 0.5 through, 4 places 5.1 (0.20) 2.54 (0.100) typ 106.68 (4.200) 7.62 (0.300) 17.78 (0.700) 12.70 (0.500) 13.5 (0.53) 5.1 (0.20) min 1.57 0.05 (0.062 0.002) dia solder-plated brass, 11 places (vout? vout+, vin? vin+) 1.02 0.05 (0.040 0.002) dia solder-plated brass, 9 places side label* 116.8 (4.60) 61.0 (2.40)
lucent technologies inc. 17 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; recommended hole pattern component-side footprint. dimensions are in millimeters and (inches). 8-1650 (c).a ordering information table 5. device codes input voltage output voltage output power device code comcode 28 v 3.3 v 165 w FC250F1 108178740 5.1 (0.20) 10.16 (0.400) m o untin g in s ert s 5.1 (0.20) 2.54 (0.100) typ 2.54 (0.100) typ 5.08 (0.200) 15.24 (0.600) 20.32 (0.800) 25.40 (1.000) 30.48 (1.200) 35.56 (1.400) 106.68 (4.200) 66.04 (2.600) 50.8 (2.00) 30.48 (1.200) 22.86 (0.900) 17.78 (0.700) 12.70 (0.500) 12.7 (0.50) 7.62 (0.300) case sync in on/off v i v i + v o v o + sense sense+ trim parallel current mon pwr good sync out 7.62 (0.300) 7.62 (0.300)
18 18 lucent technologies inc. 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; data sheet july 2000 ordering information (continued) table 6. device accessories dimension are in millimeters and (inches). 8-2830 (c) figure 25. longitudinal heat sink 8-2831 (c) figure 26. transverse heat sink accessory comcode 1/4 in. transverse kit (heat sink, thermal pad, and screws) 847308335 1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 847308327 1/2 in. transverse kit (heat sink, thermal pad, and screws) 847308350 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 847308343 1 in. transverse kit (heat sink, thermal pad, and screws) 847308376 1 in. longitudinal kit (heat sink, thermal pad, and screws) 847308368 1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 847308392 1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 847308384 1/4 in. 1/2 in. 1 in. 1 1/2 in. 60.45 (2.38) 115.82 (4.56) 1/4 in. 1/2 in. 1 in. 1 1/2 in. 59.94 (2.36) 115.82 (4.56)
lucent technologies inc. 19 data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; notes
data sheet july 2000 18 vdc to 36 vdc input, 3.3 vdc output; 165 w FC250F1 power module: dc-dc converter; copyright ?2000 lucent technologies inc. all rights reserved printed in u.s.a. july 2000 ds99-265eps printed on recycled paper for additional information, contact your lucent technologies account manager or the following: power systems unit: network products group, lucent technologies inc., 3000 skyline drive, mesquite, tx 75149, usa +1-800-526-7819 (outside u.s.a.: +1-972-284-2626 , fax +1-888-315-5182) (product-related questions or technical assistance) internet: http://www.lucent.com/networks/power e-mail: techsupport1@lucent.com asia pacific: lucent technologies singapore pte. ltd., 750d chai chee road #07-06, chai chee industrial park, singapore 469004 tel. (65) 240 8041 , fax (65) 240 8438 china: lucent technologies (china) co. ltd., scitech place no. 22 jian guo man wai avenue, beijing 100004, prc tel. (86) 10-6522 5566 ext. 4187 , fax (86) 10-6512 3694 japan: lucent technologies japan ltd., mori building no. 21, 4-33, roppongi 1-chome, minato-ku, tokyo 106-8508, japan tel. (81) 3 5561 5831 , fax (81) 3 5561 1616 latin america: lucent technologies inc., room 416, 2333 ponce de leon blvd., coral gables, fl 33134, usa tel. +1-305-569-4722 , fax +1-305-569-3820 europe: technical inquiries: germany: (49) 89 95086 0 (munich), united kingdom: (44) 1344 865 900 (ascot), france: (33) 1 40 83 68 00 (paris), sweden: (46) 8 594 607 00 (stockholm), finland: (358) 9 4354 2800 (helsinki), italy: (39) 02 6608131 (milan), spain: (34) 91 807 1441 (madrid) lucent technologies inc. reserves the right to make changes to the product(s) or information contained herein without notice. n o liability is assumed as a result of their use or application. no rights under any patent accompany the sale of any such product(s) or information.

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