2007-08-16 1 bas3010s... low vf schottky diode ? forward current: 1 a ? reverse voltage: 30 v ? low forward voltage and smallest package form factor (1.0 x 0.6 x < 0.4 mm) for mobile phone battery charger application ? pb-free (rohs compliant) package 1) ? qualified according aec q101 BAS3010S-03LRH 2 1 3 type package configuration marking BAS3010S-03LRH* tslp-3-7 single 1s * preliminary data maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit diode reverse voltage 2) v r 30 v forward current 2)3) i f 1 a repetitive peak forward current 3) ( t p 1 ms, d 0.25) i frm 3.5 non-repetitive peak surge forward current 3) ( t 10 ms) i fsm 5 junction temperature t j 150 c operating temperature range t o p -55 ... 125 storage temperature t st g -65 ... 150 1 pb-containing package may be available upon special request 2 for t a > 25c the derating of v r and i f has to be considered. 3 only valid if pin 1 and 2 are connected in parallel
2007-08-16 2 bas3010s... thermal resistance parameter symbol value unit junction - soldering point 1) r thjs 38 k/w electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics reverse current 2) v r = 5 v v r = 10 v v r = 30 v i r - - - - - - - - - 15 30 300 a forward voltage 2) i f = 100 ma i f = 350 ma i f = 1000 ma v f - - - - - 340 400 570 - 390 450 650 mv ac characteristics diode capacitance v r = 5 v, f = 1 mhz c t - 10 15 pf 1 for calculation of r thja please refer to application note thermal resistance 2 pulsed test: t p = 300 s; d = 0.01
2007-08-16 3 bas3010s... diode capacitance c t = ? (v r ) f = 1mhz 0 5 10 15 20 v 30 v r 0 5 10 15 20 25 pf 35 c t reverse current i r = ? ( t a ) v r = parameter 0 25 50 75 100 c 150 t a -6 10 -5 10 -4 10 -3 10 -2 10 a i r 30 v 20 v 10 v 5 v reverse current i r = ? ( v r ) t a = parameter 0 5 10 15 20 v 30 v r -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 a i r ta = - 40c ta = + 25c ta = + 85c ta = + 125c forward voltage v f = ? ( t a ) i f = parameter -50 -25 0 25 50 75 100 c 150 t a 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 v 0.65 v f if = 100 ma if = 350 ma if = 1a
2007-08-16 4 bas3010s... forward current i f = ? ( v f ) t a = parameter 0 0.1 0.2 0.3 0.4 v 0.6 v f -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 a i f ta= +125c +85c +25c - 40c
2007-08-16 5 bas3010s... package tslp-3-7 2 3 1 reel ?180 mm = 15.000 pieces/reel for board assembly information please refer to infineon website "packages" package outline foot print marking layout standard packing stencil apertures copper solder mask 0.275 0.2 0.315 0.945 0.45 0.17 0.355 0.2 0.35 0.225 1 0.6 0.225 0.15 0.35 0.3 r0.1 1 2 0.05 0.35 0.035 2 x 0.15 1) bottom view 0.035 0.5 1) 0.05 0.6 3 0.05 0.65 0.035 2x 0.25 1) 0.035 0.25 1) 1 0.05 +0.01 0.39 -0.03 pin 1 marking 0.05 max. top view 1) dimension applies to plated terminal 2) only for diodes, cathode marking on pin 3 cathode 2) marking type code pin 1 marking type code cathode marking only for diodes, cathode marking on pin 3 standard only for diodes, cathode marking on pin 3 standard 0.76 4 1.16 0.5 cathode marking 8 0.76 4 1.16 pin 1 marking 8
2007-08-16 6 bas3010s... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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