2009-02-02 1 BAS3010S-02LRH low vf schottky diode ? reverse voltage: 30 v ? forward current: 1 a ? low forward voltage and smallest package form factor (1.0 x 0.6 x < 4 mm) for mobile phone battery charger application ? pb-free (rohs compliant) package ? qualified according aec q101 BAS3010S-02LRH 2 1 type package configuration marking BAS3010S-02LRH tslp-2-17 single 1t maximum ratings at t a = 25 c, unless otherwise specified parameter symbol value unit diode reverse voltage 1) v r 30 v forward current 1) , t s 114 c i f 1 a non-repetitive peak surge forward current ( t p 10 ms) i fsm 4 junction temperature t j 150 c operating temperature range t o p -55 ...150 storage temperature t st g -65 ...150 thermal resistance junction - soldering point 2) r thjs 60 k/w 1 for t a > 25 c the derating of v r and i f has to be considered 2 for calculation of r thja please refer to application note thermal resistance
2009-02-02 2 BAS3010S-02LRH electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics reverse current 1) v r = 10 v v r = 30 v i r - - - - 30 300 a forward voltage 1) i f = 1 ma i f = 100 ma i f = 700 ma i f = 1000 ma v f - - - - 200 340 500 570 250 390 570 650 mv ac characteristics diode capacitance v r = 5 v, f = 1 mhz c t - 10 15 pf 1 pulsed test: t p = 300 s; d = 0.01
2009-02-02 3 BAS3010S-02LRH diode capacitance c t = ? (v r ) f = 1mhz 0 5 10 15 20 v 30 v r 0 5 10 15 20 25 pf 35 c t reverse current i r = ? ( t a ) v r = parameter 0 25 50 75 100 c 150 t a -6 10 -5 10 -4 10 -3 10 -2 10 a i r 30 v 20 v 10 v 5 v reverse current i r = ? ( v r ) t a = parameter 0 5 10 15 20 v 30 v r -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 a i r ta = - 40c ta = + 25c ta = + 85c ta = + 125c forward voltage v f = ? ( t a ) i f = parameter -50 -25 0 25 50 75 100 c 150 t a 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 v 0.65 v f if = 100 ma if = 350 ma if = 1a
2009-02-02 4 BAS3010S-02LRH forward current i f = ? ( v f ) 0 0.1 0.2 0.3 0.4 v 0.6 v f -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 a i f ta= +125c +85c +25c - 40c permissible reverse voltage v r = ? ( t a ) t p = paramter, duty cycle < 0.01 device mounted on pcb with r th = 160 k/w 0 20 40 60 80 100 c 130 t a 0 5 10 15 20 25 v 35 v rmax dc 20 ms 1 ms forward current i f = ? ( t s ) BAS3010S-02LRH 0 15 30 45 60 75 90 105 120 c 150 t s 0 100 200 300 400 500 600 700 800 900 ma 1100 i f
2009-02-02 5 BAS3010S-02LRH package tslp-2-17 1 2 0.05 0.6 1 2 0.05 0.65 0.035 0.25 1) 1 0.05 0.05 max. +0.01 0.39 -0.03 1) dimension applies to plated terminal cathode marking 1) 0.035 0.5 bottom view top view package outline foot print marking layout (example) standard packing reel ?180 mm = 15.000 pieces/reel reel ?330 mm = 50.000 pieces/reel (optional) for board assembly information please refer to infineon website "packages" 0.45 0.275 0.275 0.375 0.925 copper solder mask stencil apertures 0.35 1 0.6 0.35 0.3 0.76 4 1.16 0.5 cathode marking 8 bar90-02lrh type code cathode marking laser marking
2009-02-02 6 BAS3010S-02LRH edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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