skcd 16 c 060 i hd ? by semikron rev. 0 ? 18.02.2010 1 cal-diode skcd i f = 50 a v rrm = 600 v size: 3,97 mm x 3,97 mm skcd 16 c 060 i hd features ? high current density ? e asy paralleling due to a small forward voltage spread ? positive temperature coefficient ? very soft recovery behavior ? s mall switching losses ? high ruggedness ? compatible to thick wire bonding ? compatible to standard solder processes typical applications* ? freewheeling diode for igbt absolute maximum ratings symbol conditions values unit v rrm t j =25c, i r =0.2ma 600 v i f(av) t s =80c, t j = 175 c 32 a i fsm 10 ms sin 180 t j =25c 345 a t j = 150 c 320 a t jmax 175 c electrical char acteristics symbol conditions min. typ. max. unit i 2 t t j = 150 c, 10 ms, sin 180 512 a 2 s i r t j =25c, v rrm = 600 v 0.20 ma t j = 150 c, v rrm =600v ma v f t j =25c, i f =37a 1.35 v t j = 150 c, i f =37a 1.31 v v (to) t j = 150 c 0.85 v r t t j = 150 c 12.6 m ? dynamic characteristics symbol conditions min. typ. max. unit t rr t j = 25 c, 50 a, 300 v, 1500 a/s s t rr t j = 150 c, 50 a, 300 v, 1500 a/s ns q rr t j = 25 c, 50 a, 300 v, 1500 a/s c q rr t j = 150 c, 50 a, 300 v, 1500 a/s 5.64 c i rrm t j = 25 c, 50 a, 300 v, 1500 a/s a i rrm t j = 150 c, 50 a, 300 v, 1500 a/s 46.6 a thermal characteristics symbol conditions min. typ. max. unit t j -40 175 c t stg -40 175 c t solder 10 min. 250 c t solder 5 min. 320 c r th(j-s) sold. on 0,38 mm dcb, reference point on copper heatsink close to the chip 1.58 k/w mechanical characteristics symbol conditions values unit raster size 3.97 x 3.97 mm 2 area total 15.76 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 651 (5" wafer) pcs
skcd 16 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal.
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