16 specifications (characteristics) recommended soldering pattern external dimensions (unit: mm) do not connect #2 and #3 to external device. internal connection (unit: mm) #1 #1 #2 #2 #4 #4 #4 #1 #3 #3 #3 #2 0.1 0.1 6.7 7.0 max. 0.2 0.2 0.2 0.25 1.5 max. 0.3 0.55 0.3 0.4 0.4 0.15 1.4 max. 1.2 1.2 5.1 0.6 0.6 0.3 ea99 crystal unit MC-146 high-density mounting-type smd of 1.4 mm thickness. small packaging area and light weight. excellent shock resistance and environmental capability. most suitable for small communications devices. item nominal frequency storage temperature operating temperature maximum drive level soldering condition frequency tolerance(standard) peak temperature(frequency) temperature coefficient(frequency) load capacitance series resistance motional capacitance shunt capacitance insulation resistance aging shock resistance symbol f t stg t opr gl t sol ? f/f t a c l r 1 c 1 c 0 ir fa s.r. specifications 32.768 khz 75.000 khz -55 c to +125 c -40 c to +85 c 1.0 w max. twice at under +260 c within 10 s or under +230 c within 3 min. 20 x 10 -6 , 50 x 10 -6 +25 c 5 c -0.04 x 10 -6 / c 2 max. 7 pf, 12.5 pf 65 k ? max. 30 k ? max. 1.9 ff typ. 0.8 pf typ. 500 m ? min. 3 x 10 -6 /year max. 5 x 10 -6 max. remarks please contact us for inquiries about usable frequencies ta=+25 c, dl=0.1 w please specify ta=+25 c 3 c, first year three drops on a hard board from 750 mm or excitation test with 29400 m/s 2 0.3 ms 1/2 sine wave 3 directions actual size thin smd low/medium-frequency crystal unit metal may be exposed on the top of this product. this won't affect any quality, reliability or electrical spec. temperature range operating drive level 0.5 w max.
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