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wi nc om t e c h co., ltd. product specification mb-tft - 35-s4-s cus t omer cus t omer part no. app r oved by da t e approv e d f or s pe c ifications n approved for speci f i c a t io n s & sa m ple approved by checked by organized by
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d wi nc om 2 record of rev i sion version contents date note a original january. 2007
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d wi ncom 3 1 featur e t hi s single-displa y module is suitable for c ell phone application. the main- lcd adopts one backl i ght w ith high brightne s s 6-lamps w hite led. (1) construction: 3.5 a-si color t f t -lcd, w h ite led backlight, and fpc. (2) main lcd: 2.1 amorphous - t f t 3.5-inch displa y , transmissi v e, normall y w hite t y pe, and 6 o clock. 2.2 320(rgb) x240 dots matri x . 2.3 narro w -contact ledge technique. 2.4 main lcd dri v er ic: hx8218c01 x 1 and hx8615a x 1. 2.5 real 16.7m colo r s displa y . (3) lo w cross talk b y f r ame rate modu l ation. (4) direct data displa y w ith displa y ram. (5) partial displa y f unction: you c an s a v e po w er b y limiting the di s pla y space. (6) rgb inte r face. (7) abundant command f unction s : area scroll f unction displa y direction s w it c hing function po w er sa v ing f unction (8) video signal inte r f ace: pa r allel rgb. electric v olume c ontro l funct i on: y ou are able to program the tempe r ature compen s ation f unction 2 mechanic a l sp e cification s dimensions and w eight 3 a bsolute max r atings and en v ir o nment item spec i f icat i ons unit e x ternal shape d i men s ions 76.9 ( w ) x 63.9 (h) x 3.16(d) mm pi x el si z e 0.073 ( w ) x 0.219(h) mm main lcd acti v e area 70.08 ( w ) x 52.56 (h) mm
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win co m 4 3-1 ab s olute ma x ratings ( t a=25 o c, gnd=0v) item s y mbol min. ma x . unit remarks po w er suppl y v oltage vdd -0.3 +7.0 v po w er suppl y v oltage vcc -0.3 +7.0 v input v oltage vin -0.3 vdd+0.3 v 3-2 en v ironment item spec i f icat i ons remarks storage temperature ma x . +80 o c min. -30 o c note 1: non-condensing operating temperature ma x . +70 o c min. -20 o c note 1: non-condensing 1 ta Q +40 o c ? ? ?? ma x .85%rh ta +40 o c ???? the ma x . humidit y should not e x ceed the hum i dit y with 40 o c 85%rh. 4 electric a l speci f ications 4-1 electrical chara c teristics o f lcm (iov cc =3.0v, t a=25 o c) item s y mbol conditions min. t yp. max. unit po w er suppl y vcc +3 +3.3 +3.6 v s-ic high-l e v el input v oltage v i hc 0.7 iov cc iov cc v s-ic lo w -le v el input v oltage v ilc 0 0.3 iov cc v g-ic high-l e v el input v oltage v i hc 0.7 iov cc iov cc v g-ic lo w -le v el input v oltage v ilc 0 0.3 iov cc v consumption current of led v l ed-on i f =20 ma - 20.4 21.6 v
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win co m 5 4-2 led back light speci f icat i on item s y mbol conditions min. t yp. max. unit for w ard v olta g e v f i f =20ma - 20.4 21.6 v for w ard curre n t i f 6-chip series - 20 - ma po w er consumption p bl i f =20ma - 408 - m w uni f ormit y ( w ith l/g) - i f =20ma 80%*1 - - bare led luminous intensity v f i f 20.4 v 20ma 3200 - - cd/m 2 luminous color w hi te chip connection 6-chip serie s conne c tion 5 optical char a ct e ris t ic s main lcd 5.1 optical c haracteristics led backlight tran s missi v e module: item s y mbol t emp. min. std. ma x. unit conditions respon s e time t r +tf 25 o c - 25 - ms (note 2) contrast ratio cr 25 o c 240 300 - - =0 o , =0 o (note 4) verti cal 25 o c 90 100 - visual angle horiz ontal 25 o c 110 120 - de- gree cr R 10 (note 3) visual angle direction priorit y 6:00 (note 5) brightness 250 cd/ m2 v led =20.4v, 20ma full w hite pattern 5.2 c i e ( x , y ) chro m atici t y ( t a = 25 c)
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 6 t ran s missi v e conditions item s y mbol min. t y p. ma x x 0.588 0.608 0.628 0.628 red y 0.306 0.316 0.326 0.326 x 0.292 0.312 0.332 0.315 green y 0.295 0.305 0.315 0.576 x 0.125 0.135 0.145 0.145 blue y 0.122 0.137 0.152 0.152 x 0.285 0.305 0.325 0.325 w h i te y 0.314 0.334 0.354 0.354 note 1: optical c h a r acteristic measu r ement s y stem note 2: response time definition
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 7 note 3: , definition note 4: contrast de f inition note 5: visual angle direction prio r it y
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 8 6 bloc k diagr a m block diag r am (main lcd) displa y f ormat: a-si tf t transmissi v e, normall y w hite t y pe, 6 o clo c k. displa y composition: 240 x rgb x 320 dots lcd dri v er: hx8218c01/hx8615a back light: w hite led x 6(i led =20ma) 6.1 whole chip block diagram fig 6.1 whole chip bloc k diagram 6.2 ti m ing controlle r block diagram
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win co m 9 fig 6.2 t iming controll e r block dia g ram 6.3 sou r ce d r i v er block diag r am fig 6.3 sour c e dri v er blo c k diagram
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d wi nc om 10 7 int e rfac e spe c ifications pin no. t e r minal functions 1 led-k1 led anode 2 led-k2 led anode 3 led-a1 led cathode 4 led-a2 led cathode 5 nc 6 nc 7 m t he signal to generate vcom 8 rese t reset 9 cs chip sele c t 10 scl serial clock 11 sdi serial data 12~19 b0~b7 blue data 20~27 g0~g7 green data 28~35 r0~r7 red data 36 hsync hori z ontal s y nc input 37 vsync vertical s y nc input 38 dclk data clock 39,40 vdd analog po w er 41,42 vcc digital po w er 43 c4 stable capacitor connection 44,45 vgl gate off po w er 46 nc 47 vgh gate on po w er 48 nc 49 nc 50,51 v com v com po w er 52 enb data enab l e control 53,54 gnd ground 8 wa v eform 8.1 timin g control l er timing cha r t clock an d data w a v eforms
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d w in co m 11 i t u-r b t 601 i t u-r bt656 24 bit rgb mode for 960 x 240 3 - w i r e t iming diagram reset functio n t he hx8216c01/hx8615a is internall y initiali z ed b y rese t input. during the re s et period, no i n s truction or gram data access f rom mpu c an be accepted. the r eset input must be he l d f or at lease 1ms. do not ac c ess the
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win co m 12 gram or initiall y set the instruction until the r -c oscillation f requen cy is stable a f ter po w er has been supplied (10ms). 9 qu a lities a nd rel i a bility 9.1 tes t conditions t e s ts should be c onducted under the f ollo w ing conditions: amb i ent temperature: 25 5 c humidit y : 60 25% r h. 9.2 samplin g p l an sampling method s hall be in acco r dan c e w ith mil-s t d-105e, le v el ii, normal single sampling plan.
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 13 9.3 acceptable qualit y leve l a major de f e c t is de f i ned as one that c ou l d cause failure to or materially reduce the usabilit y of the unit for its i ntended purpose. a minor defect is one that does not materiall y r e duce the usabilit y o f the unit f or its intended purpo s e or i s an in f ringement f rom established standards and has no signi f i c ant bearing on it s ef f ecti v e u s e or operat i on. 9.4 appearanc e an appearan c e te s t should be conducted b y human sight at appro x imatel y 30 cm distan c e f rom the lcd module under f luores c ent light. t he in s pection area o f lcd panel shall be w ithin the range o f follo w ing limits. 9.5 inspection qualit y criteria no item criterion 01 outline dimension in accord with drawing 02 p osition- finding dimension asse m ble dimension in accord with drawin g
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 14 round type: non displ a y 3.1 s m all area lcd unit: m m y x dimension qualified quantity d 0.1 ignore 0.1 d 0.15 2 d 0.15 0 03 lcd black spots, white spots (round type) 3.2large area lcd y x c-stn: if d 0.1, unqualified dimension qualified quantity d 0.1 ignore 0.1 d 0.15 2 0.15 d 0.20 1 d 0.20 0 04 lcd black spots, white spots (line style) 4.1 s m all area lcd unit : m m length width qualified quantity - 0.015 ignore 1.0 2 2.0 0.015 w 0.025 1 1.0 0. 025 w 0.05 1 - d 0.05 according to circle
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 15 4.2large area lcd cstn: if w 0.015, unqualified ignore beyond viewing area length width qualified quantity - 0.015 ignore 2.0 0.015 w 0.025 2 1.0 0.025 w 0.05 1 - d 0.05 according to circle 05 lcd scratch threadlike f iber sa m e to no.3 circle sightline and su r face of lcd is vertical sa m e to no.3 line style 06 p ol it is not ad m issible that p ol is beyond the edge of glass, else, unqualified. it is essential that p ol be over the 50 percent o f width o f frame, else, unqualified. according to the drawing in case of special d e finition. scratch reject intensity of adhesion if l o wer than specification, reject 07 ic/f p c bonding gold f old twist reject silicon according to outline, no gold outside, seal can not be higher than lcd 07 ic/f p c bonding f p c gold sever reject 08 smt lack of c o m ponent p olarity inverse if exist, reject
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d winc om 16 leak solder virtual solder if exist, reject short circuit in solder p oint if exist, reject tin ball if exist, reject tin acu m ination if visu a l, reject height solder p oint if hi g her 0.5mm than co m ponent. reject height of co m ponent either side higher 0.5m m than c o m ponent, reject c o m ponent shift x solder p ad c o m ponent d y z x<3/4z reject y. 1/3d reject
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 17 f ew tin pad p cb if ? 20 reject c o m ponent deflection if y >1/3 d reject c o m ponent carcass sideways if exist with v isual inspection, reject lot tin a: tin accrete the solder side c o m pletely, hollowly, ok b: tin accrete the solder side c o m pletely, full circle a rc, ok c: jointing include wh o le solder side, height of tin>50 percents of height o f c o m ponent, reject 08 smt f ew tin a: tin accrete the solder side c o m pletely, hollowly, ok b: height of tin > 1/3 o f solder side of c o m ponent, ok c: height of tin 1 /3 o f solder side o f c o m ponent, reject d component pad y
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win co m 18 nor m al jointing side 08 smt short circuit open circuit f or bid quality of c stn display 1 rolling strake with visual inspection, forbid 2 difference of color in viewing area with vi s ual inspection (full white red green blue), fo r bid 3 display ch a nge with visual inspection, forbid 09 light according to the specification or sa m ple cust o m er have approved x y white 0.05 0.05 red 0.05 0.05 green 0.05 0.05 blue 0.05 0.05 drive lcd under normal condition, 25 =0 =0 test white red green blue with dms rec o rd 10 color of cie coordinate in accord with product specification drive condition is according to specification measure loc a tion is in f ollow p icture 3 adjust brightness instru m ent torero, burrow against the surface of lcd, press m easure , rec o rd when the display is ste a dy. (yok o gawa-329 8 )
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 19 measure loc a tion 11 brightness according to specification according to product s pecification measure instr u m ent ( dms-501 ) 12 cr (max) according to specification according to product s pecification measure instr u m ent (dms-501) 13 response ti m e according to specification according to product s pecification measure instr u m ent (dms-501) 14 viewing angle c o m pare with the sa m ple cust o mer supply c o m pare with the sample customer supply when asse m ble 15 vibration ring according to the use of product ( m ain f p c of foldaway cell phone 6 th o usand) measure instr u m ent bend angle: 150 f ix f p c in the ca s e m e n t when custo m er supply 16 f requency of fp c bend
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 20 9.7 re l ia b i l it y t e s t item t e s t conditions note high t emperature operation 70 3 c, t=96 hrs lo w t empe r ature operation -20 3 c, t=96 hrs 1,2 high t emperature sto r age 80 3 c, t=96 hrs 1,2 lo w t empe r ature sto r age -30 3 c, t=96 hrs 1,2 humidit y test 40 c, humidit y 90%, 96 hrs 1,2 t hermal shoc k t est -30 c ~ 25 c ~ 80 c 30 min. 5 min. 30 min. (1 c y cle) t otal 5 c y cle 1,2 vibration test (packing) s w eep f requency 10~55~10 h z /1min amplitude: 0.75mm t e s t direction: x.y.z/3 a x is duration: 30min/each a x is 2 static e l ectricit y 150pf 330 ohm + 8kv, 10times air discharge note 1: condensation of water is not permitted o n the module. note 2: the module sho u ld be inspected after 1-h o ur stora g e in normal co n ditions (15-35 c, 45-65%rh). definitions of life end p o int: l current d r ain should be s maller than the spec i f ic v alue. l function of the module s hould be mainta i ned. l appearance and d i spla y qualit y should not ha v e degraded noticeabl y . l contrast ratio s hould be greater than 50 % o f the init i al v alue. 10 use prec a utions 10.1 ha n dlin g pr e cautio n s 1) t he polari z ing plate ma y break easil y so be care f ul w hen handling it. do not tou c h, pres s or rub it w ith a hard - material tool like t w ee z ers. 2) do not touch the polari z ing plate su r f a c e w ith bare hands so as not t o make it dirt y . i f the su r face or other related part o f the polari z ing plate is dirt y , soak a so f t cotton cloth or chamois leather i n ben z ine and w ipe off w ith it. do not u s e chemical liquids such as a c etone, toluene and isoprop y l alcohol. failure to do s o ma y bring chemical reaction phenomena and deteriorations. 3) remo v e an y spit or w ater immediatel y . i f it is left f or hours, the suffered part ma y deform or decolori z e.
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d win com 21 4) i f the lcd element breaks and an y lc stuf f l eak, do not suck or lick it. also i f lc stuff is stuc k on y our skin or cloth i ng, w ash thoroughl y w it h soap a n d w ater immediatel y . 10.2 i n stallin g pr e cautio n s 1) the p c b has man y ics that ma y be damaged easil y b y static electricit y . t o pre v ent breaking b y static electricit y f rom the human bod y and cloth i ng, earth the human bod y properl y using the high resistance and discharge static electricit y during the operat i on. in this ca s e, ho w e v er, the resistance v alue should be appro x . 1m and the resistance s hould be p l aced near the huma n bod y rather than the ground su r f ace. w hen the indoor spa c e is dr y , static electricit y ma y occur easil y so be ca r e f ul. w e re c ommend the indoor spa c e should be kept w ith humidit y o f 60% or more. w hen a soldering iron or othe r similar tool is used f or assembl y , be sure to earth it. 2) w hen installing the module and ics, do not bend or t w ist them. failure t o do so ma y crack lc e l ement and cau s e circuit failure. 3) t o protect l c element, especiall y polari z ing plate, u s e a transparent protecti v e plate (e.g., acrylic plate, glass etc) for the product c ase. 4) do not u s e an adhesi v e like a both-side adhesi v e tape to make l cd surface (polari z ing plate) and product ca s e stick together. failure to do s o ma y cause the polari z ing plate to peel of f . 10.3 st o rage prec a utio n s 1) a v oid a high temperatu r e and hum i dit y area. keep the tempe r ature bet w een 0 c and 35 c and also the humidit y under 60%. 2) choo s e the dark spaces w here the p r oduct is not e x posed to direct sunlight or f luorescent light. 3) store the produ c ts as the y are put in the bo x es pro v ided f rom us or in th e same condition s as w e recommend. 10.4 oper a tin g pr e cautions 1) do not boo s t the applied dri v e v oltage abno r mall y . failure to do s o ma y break ics. w hen appl y ing po w er v oltage, check the electrica l feature s be f orehand and be c are f ul. al w a y s turn of f the po w er to the lc module controller be f ore remo v ing or inserting the lc module i nput connector. if th e input connector is remo v ed or in s erted w hile the po w er is turned on, the l c module internal circuit ma y break. 2) t he displa y respon s e ma y be late i f the operating temperature is under the normal standard, and the displa y ma y be out o f order i f it is abo v e the norma l
MB-TFT-35-S4-S compan y c on f ide n tial v er all r ig h ts r e s e rv e d wi nc om 22 standard. but this is not a f ailure; this w ill be restored i f it is within the no r ma l standard. 3) the lcd c ontra s t v aries depending on the v isual angle, ambient temperature, po w er v o ltage etc. obtain the optimum c ontrast b y ad j usting the lc di v e v oltage. 4) w hen carr y ing out the test, do not ta k e the module out of the lo w- temperature space s uddenl y . failure to do so w ill cause the modu l e condensing, leading to ma l functions. 5) make certain that each signal noise le v el is w ithin the standard (l le v el: 0.2vdd or less and h le v el: 0.8vdd or more) e v en i f the module ha s functioned properl y . i f it is be y ond the standard, the module ma y o f ten ma l f unction. in addit i on, al w a y s connect the module w hen making noise le v e l mea s urements. 6) t he cmos ics are incorporated in the module and the pull-up and pull- do w n f un c tion is not adopted for the input so a v oid putt i ng the input signa l open w hile the po w er is on. 7) the c haracteristic of the s emi c onductor element changes w hen it i s e x posed to light emissions, therefore ics on the lcd ma y ma l funct i on i f the y recei v e light emission s . to pre v ent these ma l functions, design and assemb l e ics so that the y are sh i elded f rom light emissions. 8) crosstalk occurs because of chara c te r istics of the lcd. in genera l , crosstalk occurs w hen the regulari z ed displa y is maintained. also, the l c dri v e v oltage af f e c ts crosstalk. design the contents o f the displa y , considerin g crosstalk. 10.5 ot h er 1) do not disas s emble or take the lc module into pie c es. t he lc modu l e s once disassembled or taken into piece s are not the guarantee articles. 2) t he residual ima g e ma y e x ist i f the same di s pla y pattern i s sho w n f o r hours. this residual image, ho w e v er, disappears w hen another displa y pattern i s sho w n or the dri v e is interrupted and left for a w hile. but this is not a problem on reliabilit y .
MB-TFT-35-S4-S compan y confidential v er a l l right s r e s e r v e d win com 23 11 mech a nic dr a wing ( ) ( ) rev ( ) date description n otes: 1. ? 6 - c hip white led 2. 2 0ma/chip 3 . ???? 2 5 0cd/m ??R 8 0% 4. ??M : 0 . 2 5 . ?? - 2 0 c ~ 7 0 c 6 . ?? - 3 0 c ~ 80 c 7 . ? r o s h 8 . d c b ( ) ( ) 7 edition: edition: 8 a 7 8 65 ( ) ( ? ) 1/1 4 customer's code: m.b model no.: specification for backlight 65 please confirm this description date ( ) approved by: 4 ( ) 3 ? 2 page: 1 d d ate: c b 06/09/01 rev 32 approval date: 1 a customer name: wi n com te ch c o . , l t d . ( ) drawing on/before ? ? curcuit diagram: c i r cuit diagram l e d : 6 dies 2 *76.9 0.1 72.88 0.2 *63.9 0.1 55.36 0.2 2.07 2.01

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