doc. no : qw0905-l rev. : date : 29 - nov.- 2005 a209b-1/4xg2x-pf b data sheet ligitek electronics co.,ltd. property of ligitek only led array la209b-1/4xg2x-pf lead-free parts pb
3.2 0.3 2.1 6.8 0.5 1.5 0.5 typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 29.5 0.5 1.5 max 1.0min 2.54typ - + 0.5 typ 1.9 4.0 3.2 1.9 lg45840/f181-pf + - 1/5 page part no. la209b-1/4xg2x-pf 18.3 2.2 0.5 2.54 g 17.3 4.6 package dimensions ligitek electronics co.,ltd. property of ligitek only 1.0
-40 ~ +100 tstg storage temperature viewing angle 2 1/2 (deg) 20 forward voltage @ ma(v) spectral halfwidth nm peak wave length pnm luminous intensity @10ma(mcd) material part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. green diffused gap green la209b-1/4xg2x-pf emittedlens 56530 1.7 8.0 2.6 12 78 max. min. typ. min. typical electrical & optical characteristics (ta=25 ) color 2/5 page part no. ma 30 i f forward current operating temperature reverse current @5v t opr ir peak forward current duty 1/10@10khz power dissipationpd i fp -40 ~ +85 10 a 100 120 ma mw absolute maximum ratings at ta=25 parameter symbol g ratings unit ligitek electronics co.,ltd. property of ligitek only la209b-1/4xg2x-pf
3/5 fig.6 directive radiation part no. g chip 3.5 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 80 02040 -40-20 0.9 0.8 100 80 5.0 4.0 3.0 2.0 1.0 0.5 0.0 650 600 550 500 1.2 1.1 1.0 60 40 20 0 -20 -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000 100 10 1.0 1000 100 10 1.0 0.1 1.0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) page f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature la209b-1/4xg2x-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 5 /sec max 0 25 120 time(sec) 150 60 seconds max preheat 0 50 100 2 /sec max temp( c) 260 260 c3sec max page 4/5 part no. soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only la209b-1/4xg2x-pf
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. the purpose of this test is the resistance of the device under tropical for hous. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 page5/5 part no. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only la209b-1/4xg2x-pf
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