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Agilent HSDL-3003 IrDA(R) Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver
Data Sheet
Description The HSDL-3003 is a small form factor enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission operating at the optimum 940 nm wavelength for universal remote control applications. For IR data communication, the HSDL-3003 provides the flexibility of low power SIR applications and remote control applications with no external components needed for the selection of the type of application. The transceiver is compliant to IrDA(R) Physical
IrDA(R) Data Features * Fully compliant to IrDA(R) Physical Layer Specification 1.4 low power from 9.6 kbit/s to 115.2 kbit/s (SIR) - Excellent nose-to-nose operation - Link distance up to 50 cm typically * Complete shutdown for TxD_IrDA, RxD_IrDA, and PIN diode * Low power consumption - Low idle current, 50 A typically - Low shutdown current, 10 nA typically * LED stuck-high protection Applications * Mobile data communication and universal remote control transmission - Personal digital assistants (PDAs) - Mobile phones
General Features * Guaranteed temperature performance, -20 to 70C - Critical parameters are guaranteed over temperature and supply voltage * Low power consumption * Small module size (Front, Top view) - Height: 2.70 mm (F), 2.75 mm (T) - Width: 8.00 mm (F), 7.50 mm (T) - Depth: 2.95 mm (F), 3.58 mm (T) * Minimum external components - Integrated single-biased LED resistor - Direct interoperability to MPU - Programmable Txd features - Integrated remote control FET * Withstands >100 mVp-p power supply ripple typically * VCC supply 2.4 to 3.6 volts * Integrated EMI shield * Designed to accommodate light loss with cosmetic windows * IEC 825-Class 1 eye safe Remote Control Features * Wide angle and high radiant intensity * Spectrally suited to remote control transmission function at 940 nm typically * Typical link distance up to 8 meters
CAUTION: The BiCMOS inherent to this design of this component increases the component's susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Layer Specification Version 1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s (SIR) and it is IEC 825-Class 1 Eye Safe. The HSDL-3003 has very low idle current and can be shutdown completely to achieve very low power consumption. In the
shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery operated handheld products such as PDAs and mobile phones.
Order Information Part Number HSDL-3003-021 HSDL-3003-001 HSDL-3003-028 Packaging Type Tape and Reel Tape and Reel Tape and Reel Package Front View Front View Top View Quantity 2500 500 2500
Marking Information The unit is marked with `yyww' on the shield yy = year ww = work week
VCC
CX2
GND
VCC (6)
CX1
GND (8)
REAR VIEW
HSDL-3003 TRANSCEIVER MODULE TRANSCEIVER IC
VOLTAGE/ CURRENT REFERENCE BLOCK SHUTDOWN
PRE AMP
8
7
6
5
4
3
2
1
RECEIVER RxD_IrDA (4) VLED CX3 R1 LEDA (1) SD (5) TxD_RC (7) TxD_IrDA (3)
RC/IR TRANSMITTER SELECT EYE SAFETY -RC
OUTPUT BUFFER
PHOTODETECTOR
DETECTOR
SHIELD
SHUTDOWN
RC_BUFFER IR_BUFFER
EYE SAFETY -IR
RC_LED
TRANSMITTER
IR_LED
Figure 1. Functional block diagram of low power IrDA link distance and remote control.
2
I/O Pins Configuration Table Pin 1 2 3 Symbol LEDA N.C. TxD_IrDA I/O I - I Description IR and Remote Control LED Driver No Connection IrDA Transmitter Data Input. Active High IrDA Receiver Data Output. Active Low Shutdown. Active High Supply Voltage Remote Control Transmission Input. Active High Connect to System Ground EMI Shield Notes Tied through external resistor, R1, to VLED from 2.4 to 4.5 Volt No Connection Logic high turns on the IrDA LED. If held HIGH longer than ~50 s, the IrDA LED is turned off. TxD_IrDA must be driven either HIGH or LOW. Do not leave the pin floating Output is at LOW pulse response when light pulse is seen Complete shutdown TxD_IrDA, RxD_IrDA, and PIN diode. Do not leave the pin floating Regulated, 2.4 to 3.6 Volt Logic high turns on the RC LED. If held HIGH longer than ~50 s, the RC LED is turned off. TxD_RC must be driven either HIGH or LOW. Do not leave the pin floating Tie this pin to system ground Tie to system ground via a low inductance trace. For best performance, do not tie it to the HSDL-3003 GND pin directly
4 5 6 7
RxD_IrDA SD VCC TxD_RC
O I I I
8 -
GND Shield
I -
Recommended Application Circuit Components Component R1 Recommended Value 1.8 5%, 0.25 Watt for 2.4 VLED 2.7 V 2.7 5%, 0.25 Watt for 2.7 VLED 3.3 V 3.3 5%, 0.25 Watt for 3.0 VLED 3.6 V 4.7 5%, 0.25 Watt for 3.6 VLED 4.5 V CX1[1] CX2[2] CX3 0.47 F 20%, X7R Ceramic 6.8 F 20%, Tantalum 6.8 F 20%, Tantalum
Notes: 1. CX1 must be placed within 0.7 cm of HSDL-3003 to obtain optimum noise immunity. 2. The supply rejection performance can be enhanced by including CX2, as shown in Figure 1, in environment with noisy power supplies.
3
Different Remote Control Configurations for HSDL-3003 The HSDL-3003 can operate in the single-TXD programmable mode or the two-TXD direct transmission mode. Single-TXD Programmable Mode In the single-TXD programmable mode, only one input pin (TxD_IrDA input pin) is used to
turn on either the 875 nm LED or the 940 nm LEDs while the TxD_RC input pin is grounded. The transceiver is in default mode (IrDA) when powered up. User needs to apply the following programming sequence to both the TxD_IrDA and SD inputs to enable the transceiver to operate in either the IrDA or remote control mode.
tC tTL tA tB tC
SHUTDOWN (ACTIVE HIGH)
TxD_IrDA (ACTIVE HIGH)
***
***
***
SHUTDOWN
DRIVE IrDA LED
RC MODE
DRIVE RC LED
RESET
DRIVE IrDA LED
TxD_RC (GND)
Figure 2.
Two-TXD Direct Transmission Mode In the two-TXD direct transmission mode, the 875 nm LED and the 940 nm LEDs are turned on separately by two different input pins. The TxD_IrDA input pin is used to turn on the 875 nm LED while the TxD_RC input pin is used to turn on the 940 nm LEDs. Please refer to the Transceiver I/O truth table for more details.
Transceiver Control I/O Truth Table for Two-TXD Direct Transmission Mode SD 0 0 0 0 1 TXD_IrDA 0 0 1 1 0 TXD_RC 0 1 0 1 0 IrDA LED OFF OFF ON DIM OFF RC LEDs OFF ON OFF ON OFF Remarks IR Rx enabled. Idle mode Remote control operation IrDA Tx operation Not recommended Shutdown mode*
* The shutdown condition will set the transceiver to the default mode (IrDA).
4
Absolute Maximum Ratings at TA = 25C For implementations where case to ambient thermal resistance is 50C/W Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RxD Total LED Current Pulse Amplitude IR LED Current Pulse Amplitude RC LED Current Pulse Amplitude Symbol TS TA VLED VCC VO IVLED (IVLED)IR (IVLED)RC Min. -40 -20 0 0 0 Max. 100 70 6 6 6 580 280 580 Units C C V V V mA mA mA 90 s Pulse Width 20% Duty Cycle 90 s Pulse Width 20% Duty Cycle 90 s Pulse Width 20% Duty Cycle Conditions
Recommended Operating Conditions Parameter Operating Temperature Supply Voltage LED Supply Voltage Logic Input Voltage for TxD_IrDA, TxD_RC Receiver Input Irradiance Receiver Data Rate Logic High Logic Low Logic High Logic Low Symbol TA VCC VLED VIH VIL EIH EIL 9.6 Min. -20 2.4 2.4 0 0.0081 Max. 70 3.6 4.5 Units C V V V mW/cm2 For in-band signals 115.2 kbit/s[3] W/cm2 kbit/s For in-band signals[3] Conditions
2/3 VCC VCC 500 0.3 115.2
1/3 VCC V
5
Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC at 3.0 V unless otherwise noted. Parameter Infrared (IrDA) Receiver Viewing Angle Peak Sensitivity Wavelength RxD_IrDA Output Voltage Logic High Logic Low 21/2 P VOH VOL tr, tf tL tRW IEH 21/2 P VIH VIL IH IL IVLED tTW tA tB tC 25 25 75 1.6 120 600 2.4 36 60 940 2/3 VCC 0 0.02 -0.02 VCC 1/3 VCC 1 1 120 1.65 2.3 2/3 VCC 0 0.02 -0.02 0.02 180 High Low High Low Shutdown 4 30 875 VCC 1/3 VCC 1 1 10 500 VCC - 0.2 0 1 2.3 30 26 75 13 60 30 875 VCC 0.4 7.5 100 50 200 nm V V s ns s s 1/2 15, CL= 9 pF CL= 9 pF EI = 9.0 W/cm2 EI = 10 mW/cm2 IOH = -200 A, EI 0.3 W/cm2 Symbol Min. Typ. Max. Units Conditions
RxD_IrDA Pulse Width (SIR)[4] tRPW RxD_IrDA Rise & Fall Times Receiver Latency Time[5] Receiver Wake Up Time[6] Infrared (IrDA) Transmitter IR Radiant Intensity IR Viewing Angle IR Peak Wavelength TxD_IrDA Logic Levels TxD_IrDA Input Current LED Current Wake Up Time[7] Data setup time Data pulsewidth Programming time Optical Pulse Width (SIR) Maximum Optical Pulse Width[8] TxD Rise & Fall Times (Optical) LED Anode On-State Voltage RC Radiant Intensity RC Viewing Angle RC Peak Wavelength TxD_RC Logic Levels TxD_RC Input Current High Low High Low
mW/sr IVLEDA = 100 mA, 1/2 15, TxD_IrDA VIH, TA = 25C nm V V A A A ns ns ns ns s s ns V IVLEDA = 100 mA, VI (TxD) VIH tPW(TXD) = 1.6 s at 115.2 kbit/s VI VIH 0 VI VIL VI (SD) VIH
tPW(SIR) 1.41 tPW(Max) tr, tf VON (LEDA) IEH 21/2 P VIH VIL IH IL tPW(Max) VON (LEDA) 15[9] 30
Remote Control (RC) Transmitter mW/sr IVLEDA = 400 mA, 1/2 15, TxD_RC VIH, TA = 25C nm V V A A s V ILEDA = 400 mA, VI(TxD) VIH VI VIH 0 VI VIL
Maximum Optical Pulse Width [8] LEDA Voltage 6
Transceiver Parameters Input Current High Low Supply Current Shutdown Idle (Standby) Active Symbol IH IL ICC1 ICC2 ICC3 -1 Min. Typ. 0.01 -0.02 0.01 50 300 Max. 1 1 1 100 Units A A A A A Conditions VI VIH 0 VI VIL VSD VCC - 0.5, TA = 25C VI(TxD) VIL, EI = 0 VI(TxD) VIL, EI = 10 mW/cm2
Notes: 3. An in-band optical signal is a pulse/sequence where the peak wavelength, P, is defined as 850 nm P 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4. 4. For in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 W/cm2 EI 500 mW/cm2. 5. Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity. 6. Receiver Wake Up Time is measured from VCC power ON to valid RxD_IrDA output. 7. Transmitter Wake Up Time is measured from VCC power ON to valid light output in response to a TxD_IrDA pulse. 8. The Optical PW is defined as the maximum time which the IrDA/RC LED will turn on, this is to prevent the long Turn On time for the IrDA and RC LED. 9. This Limits is Production Test Limits.
0.40 0.35 0.30
ILEDA (A)
40
RADIANT INTENSITY (mW/Sr)
35 30 25 20 15 10 5 0 0 0.05 0.1 0.15 0.2 0.25 0.3
0.25 0.20 0.15 0.10 0.05 0 1.5 2.0 2.5 3.0 3.5 4.0
VLEDA (V)
ILED CURRENT (A)
Figure 3. Typical 875 nm LED VLEDA vs. ILEDA at room temperature.
Figure 4. Typical 875 nm LED radiant intensity vs. ILED current at room temperature.
0.8
50
RADIANT INTENSITY (mW/Sr)
0.7 0.6
ILEDA (A)
45 40 35 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.5 0.4 0.3 0.2 0.1 0 1.0 1.2 1.4 1.6 1.8 2.0
VLEDA (V)
ILEDA CURRENT (A)
Figure 5. Typical 940 nm LED VLEDA vs. ILEDA at room temperature performance.
Figure 6. Typical 940 nm LED radiant intensity vs. ILED current at room temperature.
7
tpw VOH 90% 50% 10%
VOL
tf
tr
Figure 7. RXD output waveform.
tpw LED ON 90% 50% 10% LED OFF
tr
tf
Figure 8. LED optical waveform.
TXD
LED
tpw (MAX.)
Figure 9. TXD "Stuck ON" protection.
SD
SD
RX LIGHT
TXD
RXD
TX LIGHT tRW tTW
Figure 10. Receiver wakeup time definition.
Figure 11. Transmitter wakeup time definition.
8
HSDL-3003 Package Outline (With Integrated EMI Shield)
4.00 MOUNTING CENTER 1.025
8.00
2.70 1.425
1 2 3 4
VLEDA NC TXD IRDA RXD
5 6 7 8
SD VCC TXD RC GND
2.70 1.20
2.10 5.10 1.20
;;;; ;;;; ;;; ;; ;;; ;; ;
EMITTER RECEIVER 0.95 R 1.03 R 1.10 2.90 1 2 3 4 5 6 7 8 PITCH 0.95 0.60 0.425
0.80 0.70
2.95
COPLANARITY: +0.05 TO -0.15 mm
0.50 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (mm). 2. DIMENSION TOLERANCE IS 0.2 mm UNLESS OTHERWISE SPECIFIED.
Figure 12. Package outline drawing (front view).
9
HSDL-3003 Package Outline (With Integrated EMI Shield), continued
UNIT = mm TOLERANCE = 0.2 mm COPLANARITY = +0.05 ~ -0.15 mm +0.15 2.75 -0.05
2
1.7
1.7
2
+0.15 1.72 -0.05
3.58 0.05 2.97 2.55 0.03
0.7 1.52
5.1 0.05 7.5 0.03
EMITTER
RECEIVER
0.32
LEDA NC TXDIR RXD
SD
VDD TXDRC GND
MOUNTING CENTER
0.50
0.60 0.95 * 6 = 6.65
PIN 1
Figure 13. Package outline drawing (top view).
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HSDL-3003 Tape and Reel Dimensions
4.0 0.1 5.00 (MAX.) POLARITY PIN 8: GND 1.55 0.05 2.0 0.1 B
1.75 0.10
7.5 0.1 SECTION B-B 8.30 0.10 A PIN 1: VLED B 0.40 0.10 3.00 0.10 5(MAX.) 8.00 0.10 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE 1.50 0.10 A 16.0 0.3
3.25 0.10 SECTION A-A
PROGRESSIVE DIRECTION
EMPTY (40 mm MIN.)
PARTS MOUNTED
LEADER (40 mm MIN.)
EMPTY (40 mm MIN.)
"B" "C" 330 80 UNIT: mm
QUANTITY 2500
DETAIL A
DIA. 13.0 0.50 R 1.0 2.0 0.50
B
C
LABEL
21.0 0.80
16.40
+ 2.00 0
DETAIL A
2.0 0.50
Figure 14. Tape and reel dimensions.
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Moisture Proof Packaging All HSDL-3003 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4.
Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp. 60C 100C 125C Time 48 hours 4 hours 2 hours 1 hour
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
150C
Baking should only be done once.
Recommended Storage Conditions
PACKAGE IS OPENED (UNSEALED)
Storage Temperature 10C to 30C Relative Humidity below 60% RH
ENVIRONMENT LESS THAN 25C, AND LESS THAN 60% RH?
YES
NO
NO BAKING IS NECESSARY
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within two days if stored at the recommended storage conditions. If times longer than 72 hours are needed, the parts must be stored in a dry box.
PACKAGE IS OPENED MORE THAN 72 HOURS?
NO
YES
PERFORM RECOMMENDED BAKING CONDITIONS
Figure 15. Baking conditions chart.
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Recommended Reflow Profile
255
T - TEMPERATURE - (C)
MAX. 260C R3 R4
230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 R1
R2
60 sec. MAX. ABOVE 220C
R5
100
150
200 P3 SOLDER REFLOW
250 P4 COOL DOWN
300
t-TIME (SECONDS) P2 SOLDER PASTE DRY
Figure 16. Reflow graph.
Process Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max.) 255C to 200C 200C to 25C
Maximum T/time 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and I/O pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-3003 I/O pins.
Process zone P2 should be of sufficient time duration (60 to -120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic
growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -6C per second maximum. This limitation is necessary to allow the PC board and transceiver's castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3003.
13
Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil
STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 17. Stencil and PCBA.
1.1 Recommended Land Pattern
MOUNTING CENTER C L 1.35 SHIELD SOLDER PAD
1.25 2.05 0.10
0.775 1.75
FIDUCIAL 0.60 0.475 1.425 2.375 3.325
Figure 18. Land pattern (front view).
4.0
0.91
MOUNTING CENTER
1.275 0.575
1.6
0.6
0.35
0.475 1.425 2.375
Figure 19. Land pattern (top view).
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1.2 Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See the table below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern.
APERTURES AS PER LAND DIMENSIONS
t
w l
Figure 20. Solder stencil aperture.
Aperture size(mm) Stencil thickness, t (mm) 0.152 mm 0.127 mm length, l 2.60 0.05 3.00 0.05 width, w 0.55 0.05 0.55 0.05
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keepout is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. It is recommended that two fiducial crosses be placed at midlength of the pads for unit alignment. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
10.1
0.2 3.85
SOLDER MASK UNITS: mm
3.0
Figure 21. Adjacent land keepout and solder mask areas.
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Appendix B: PCB Layout Suggestion The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield trace. 2. The shield trace is a wide, low inductance trace back to the system ground. CX1, CX2 and CX3 are optional supply filter
capacitors; they may be left out if a clean power supply is used. 3. VLED can be connected to either unfiltered or unregulated power supply. If VLED and Vcc share the same power supply, CX3 need not be used and the connections for CX1 and CX2 should be before the current limiting resistor R1. In a noisy environment, including capacitor CX2 can enhance supply rejection. CX1 is generally a ceramic capacitor of low inductance providing a wide frequency response while
CX2 and CX3 are tantalum capacitors of big volume and fast frequency response. The use of a tantalum capacitor is more critical on the VLED line, which carries a high current. 4. Preferably a multi-layered board should be used to provide sufficient ground plane. Use the layer underneath and near the transceiver module as Vcc, and sandwich that layer between ground connected board layers. Refer to the diagram below for an example of a four-layer board.
TOP LAYER CONNECT THE METAL SHIELD AND MODULE GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2 CRITICAL GROUND PLANE ZONE. DO NOT CONNECT DIRECTLY TO THE MODULE GROUND PIN. LAYER 3 KEEP DATA BUS AWAY FROM CRITICAL GROUND PLANE ZONE.
BOTTOM LAYER (GND)
The area underneath the module at the second layer, and 3 cm in all directions around the module, is defined as the critical ground plane zone. The ground plane should be maximized in this zone.
Refer to application note AN1114 or the Agilent IrDA Data Link Design Guide for details. The layout below is based on a two-layer PCB.
Top View 16
Bottom View
Appendix C: General Application Guide for the HSDL-3003 Infrared IrDA(R) Compliant 115.2 Kb/s Transceiver Description The HSDL-3003, a wide-voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It is spectrally suited to universal remote control transmission function at 940 nm typically. It is fully compliant to IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and
supports most remote control codes. The design of the HSDL3003 also includes the following unique features: * Spectrally suited to universal remote control transmission function at 940 nm typically. * Low passive component count. * Shutdown mode for low power consumption requirement. Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of Vcc as shown on page 3 under "Recommended Application Circuit Components".
Interface to Recommended I/O Chips The HSDL-3003's TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The TXD_RC, (pin 7), or the TXD_IrDA, (pin 3), can be used to send remote control codes. The block diagrams below show how the IrDA port fits into a mobile phone and PDA platform.
SPEAKER
AUDIO INTERFACE DSP CORE MICROPHONE
ASIC CONTROLLER RF INTERFACE TRANSCEIVER MOD/ DE-MODULATOR MICROCONTROLLER USER INTERFACE IR RC
HSDL-3003 MOBILE PHONE PLATFORM
Figure 1. IR layout in mobile phone platform.
17
LCD PANEL
RAM
RC IR HSDL-3003 CPU FOR EMBEDDED APPLICATION
ROM
PCMCIA CONTROLLER
TOUCH PANEL
RS232C DRIVER
COM PORT
PDA PLATFORM
Figure 2. IR layout in PDA platform.
The link distance testing was done using typical HSDL-3003 units with SMC's FDC37C669 and FDC37N769 Super I/O controllers. An IrDA link distance of up to 70 cm was demonstrated. Remote Control Operation The HSDL-3003 is spectrally suited to universal remote control transmission function at 940 nm typically. Remote control applications are not governed by any standards, owing to which there are numerous remote control codes in the market. Each of these standards results in
receiver modules with different sensitivities, depending on the carrier frequencies and responsivity to the incident light wavelength. Based on a survey of some commonly used remote control receiver modules, the irradiance is found to be in the range of 0.05 ~ 0.07 mW/cm2. Based on a typical irradiance of 0.05 mW/ cm2 and 0.075 mW/cm2 and turning on the RC LED, a typical link distance of 8 m and 7 m is achieved typically.
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;;;;;;;; ;;;;;; ;;;;;;;;; ;;;;;;; ;;;;;;;;; ;;;;;;;; ;;;;; ;; ;;
OPAQUE MATERIAL IR TRANSPARENT WINDOW Y X IR TRANSPARENT WINDOW Z
Appendix D: Window Designs for HSDL-3003 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met
without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 and the maximum size corresponds to a cone angle of 60.
OPAQUE MATERIAL
In the figure above, X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3003 to the back
of the window. Our simulations result in the following tables and graphs.
Module Depth (Z, mm) 0.5 1.0 1.5 2.0 3.0 4.0 5.0 19
Min Aperture Width (X, mm) 11.45 11.75 12.00 12.50 13.50 15.15 15.65
Min Aperture Height (Y, mm) 4.20 4.45 5.00 5.25 6.30 8.40 9.45
Aperture width (X) vs. module depth.
18 APERTURE HEIGHT (Y) - mm APERTURE WIDTH (X) - mm 16 14 12 10 8 6 4 X MIN. 2 0 0 1 2 3 4 5 6 10 9 8 7 6 5 4 3 2 1 0 0
Aperture height (Y) vs. module depth.
Y MIN. 1 2 3 4 5 6
MODULE DEPTH (Z) - mm
MODULE DEPTH (Z) - mm
For module depth values that are not shown on the table above, the minimum X and Y values can be interpolated. An example of this interpolation for module depth of 0.8 mm is as follows: 0.8 - 0.5 x (11.75 - 11.45) + 11.45 = 11.63 1.0 - 0.5 0.8 - 0.5 x (4.45 - 4.20) + 4.20 = 4.35 1.0 - 0.5
Xmin =
Ymin =
Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window Material # Lexan 141 Lexan 920A Lexan 940A Light Transmission 88% 85% 85%
should be 10% or less for best optical performance. Light loss should be measured at 875 nm. The recommended plastic materials for use as a cosmetic window are available from General Electric Plastics. Recommended Plastic Materials: Haze 1% 1% 1% Refractive Index 1.586 1.586 1.586
Note: 920A and 940A are more flame retardant than 141. Recommended Dye: Violet #21051 (IR transmissant above 625 nm)
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Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radiation pattern is dependent
upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.
Flat Window (First choice)
Curved Front and Back (Second choice)
Curved Front, Flat Back (Do not use)
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2003 Agilent Technologies, Inc. Obsoletes 5988-9510EN November 26, 2004 5989-1961EN

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