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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: * No interface material is needed * Copper with tin-lead plating for improved solderability and assembly * Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for "Tape & Reel" and "Tube" formats * EIA standards and ESD protection are specified * Can be used with water soluble or no clean SMT solder creams or other pastes Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 20 250 Thermal Performance at Typical Load Natural Forced Convection Convection) 55C @ 1W 55C @ 1W 55C @ 1W 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM 217-36CT6 .390 (9.9) 217-36CTT6 .390 (9.9) 217-36CTR6 .390 (9.9) Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH DDPAK DEVICE THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125C LEAD, 40C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: i Device only, NC v Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm SECTION A-A NOTES 1. Material to be "ESD" 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 TAPE DETAILS REEL DETAILS Dimensions: in. All other products, please contact factory for price, delivery, and minimums. 30 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS 217 SERIES BOARD LAYOUT RECOMMENDATIONS TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) 217-36CT6 Dimensions: in. 230 AND 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks Footprint Dimensions in. (mm) Mounting Configuation Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Solderable Tab Option No Tab 01 05 10 No Tab 01 05 230-75AB-05 TO-220 Standard P/N Height Above PC Board in. (mm) Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Thermal Performance at Typical Load Natural Forced Convection Convection) 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM PATENT PENDING 230-75AB .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) 230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Material: Aluminum, Black Anodized 230-75AB-01 230-75AB-10 MECHANICAL DIMENSIONS 230 AND 234 SERIES 230 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 234 SERIES 234-75AB 234-75AB-01 234 SERIES 234-75AB-05 Dimensions: in. (mm) Normally stocked 31 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Self-Locking Wavesolderable Heat Sinks Footprint Dimensions in. (mm) Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Vetrical No Tab 01 05 10 No Tab 01 05 10 Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole TO-220 Standard P/N Height Above PC Board in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM PATENT PENDING 233-60AB .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-01 .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-05 .500 (12.7) .600 (15.2) x .570 (14.5) 233-60AB-10 .725 (18.4) .570 (14.5) x .500 (12.7) 236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-01 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-05 .500 (12.7) 1.500 (38.1) x .570 (14.5) 236-150AB-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 233 AND 236 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 233-60AB-01 236-150AB-01 233-60AB-10 236-150AB-10 233-60AB-05 236-150AB-05 236-150AB 233-60AB Dimensions: in. (mm) 275 AND 231 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Footprint Dimensions in. (mm) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .835 (21.2) x .400 (12.7) .690 (17.5) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .750 (19.1) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2 x .400 (12.7) 1.375 (34.9) x .835 (12.7) .835 (21.2) x .400 (12.7) TO-220 Standard P/N Height Above PC Board in. (mm) .750 (19.1) .750 (19.1) .875 (12.7) .690 (18.4) .400 (38.1) .690 (38.1) .750 (12.7) .400 (41.3) .750 (34.9) 1.375 (10.2) .400 (10.2) 1.375 (10.2) Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical No Tab 01 10 No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection 44 C @ 2W 44C @ 2W 44C @ 2W 45C @ 2W 45C @ 2W 45C @ 2W 43C @ 2W 43C @ 2W 43C @ 2W 32C @ 2W 32C @ 2W 32C @ 2W 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM PATENT 5381041 275-75AB 275-75AB-01 275-75AB-10 231-69PAB 231-69PAB-13H 231-69PAB-XXX 231-75PAB 231-75PAB-13H (14V ) 231-75PAB-XXX 231-137PAB 231-137PAB-13H (15V ) 231-137PAB-XXX Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) MECHANICAL DIMENSIONS 275 AND 231 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 13H All versions No Tab TAB 14V TAB 13V NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 01 TAB 10 TAB 15V TAB 13H Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 32 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Horizontal Vertical Solderable Tab Options No Tab 01 05 10 235 SERIES TO-220 Standard P/N Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Thermal Performance at Typical Load Natural Forced Convection Convection 40C @ 2W 40C @ 2W 40C @ 2W 40C @ 2W 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM PATENT 5381041 235-85AB .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-05 .500 (12.7) .850 (21.6) x1.000 (25.4) 235-85AB-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized 235-85AB MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 235-85AB-05 235-85AB-01 235-85AB-10 Dimensions: in. (mm) 243 SERIES Labor-Saving Clip-On Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Verl./Horiz. Solderable Tab Options No Tab No Tab Mounting Style Clip Clip TO-220 Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection 50C@ 2W 78C@ 2W 4.5C/W @ 400 LFM 8.2C/W @ 400 LFM 243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) 243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Material: Aluminum, Pre-anodized Black MECHANICAL DIMENSIONS 243 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS SECTION A-A VIEW B-B Dimensions: in. (mm) 239 SERIES Snap-Down Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz Vertical Vertical Solderable Tab Options No Tab 03 04 Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole TO-220 Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 2W 38C @ 2W 38C @ 2W 6C/W @ 400 LFM 6C/W @ 400 LFM 6C/W @ 400 LFM PATENT PENDING 239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 239-75AB 239 SERIES SECTION A-A NATURAL AND FORCED CONVECTION CHARACTERISTICS 239-75AB-03 239-75AB-04 Dimensions: in. (mm) Normally stocked 33 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Standard P/N Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Vertical Solderable Tab Options No Tab 01 02 Mounting Style Mtg Hole Mtg Hole Mtg Hole TO-218, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 49C @ 2W 49C @ 2W 49C @ 2W 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM 273-AB .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-01 .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-02 .375 (9.5) .750 (19.1) x .750 (19.1) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 273 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 273-AB 273-AB-01 273-AB-02 Dimensions: in. (mm) 274 SERIES Standard P/N 274-1AB 274-1AB-01 274-1AB-02 274-2AB 274-2AB-01 274-2AB-02 274-3AB 274-3AB-01 274-3AB-02 281-1AB 281-2AB Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. (mm) .375 (9.5) .375 (9.5) .375 (9.5) .500 (12.7) .500 (12.7) .500 (12.7) .250 (6.4) .250 (6.4) .250 (6.4) .375 (9.5) .500 (12.7) Footprint Dimensions in. (mm) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) 274 SERIES 274-XAB-01 274-XAB-02 TO-220 Material: Aluminum, Black Anodized Mounting Configuration Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vertical Vertical Solderable Tab Options No Tab 01 02 No Tab 01 02 No Tab 01 02 No Tab No Tab Mounting Style Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Thermal Performance at Typical Load Natural Forced Convection Convection 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 274 SERIES 281 SERIES Dimensions: in. (mm) 240 SERIES Standard P/N Labor-Saving Twisted Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vertical Vertical Solderable Tab Options 22 22 Mounting Style Clip/Mtg Hole Clip/Mtg Slot TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 55C @ 4W 55C @ 4W 5.3C/W @ 400 LFM 5.3C/W @ 400 LFM 240-118ABH-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) 240-118ABS-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 240 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 240-118ABS-22 240-118ABH-22 Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 34 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vertical Solderable Tab Options 22 Mounting Style Mtg Hole TO-220 Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection 48C @ 2W 6.2C/W @ 400 LFM 242-125AB-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Material: Aluminum, Black Anodized 242-125AB-22 MECHANICAL DIMENSIONS 242 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 232 AND 238 SERIES Staggered Fin Heat Sinks for Vertical Mounting Footprint Dimensions in. (mm) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 238-200AB TO-202, TO-220 Standard P/N 232-200AB 232-200AB-23 238-200AB 238-200AB-23 Height Above PC Board in. (mm) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) Mounting Configuration Vertical Vertical Verlical Verlical 238-200AB-23 Solderable Tab Options 2, Twisted 2, Solderable 2, Twisted 2, Solderable Mounting Style Clip/Mtg Hole Clip/Mtg Hole Mtg Slot Mtg Slot Thermal Performance at Typical Load Natural Forced Convection Convection 48C @ 4W 48C @ 4W 48C @ 4W 48C @ 4W 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 232-200AB 232-200AB-23 238 SERIES 232 AND 238 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 251 SERIES Slim-Profile Heat Sinks With Integral Clips Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vert./Horiz. Vertical Solderable Tab Options No Tab No Tab 19 Mounting Style Clip Clip Clip 15 Lead Multiwatt Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection 66C @ 3W 64C @ 3W 64C @ 3W 66C/W @ 400 LFM 66C/W @ 400 LFM 66C/W @ 400 LFM 251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) 251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) 251-80AB-19 .875 (22.2) .910 (23.1) x .380 (9.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 251 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 251-62AB 251-80AB 251-80AB-19 Dimensions: in. (mm) Normally stocked 35 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert/Horiz, Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 44C @ 4W 44C @ 4W 4.4C/W @ 400 LFM 4.4C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .0160 (7.25) .0170 (7.20) 244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) 244-145AB-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Ver.t/Horiz. Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 4W 38C @ 4W 3.2C/W @ 400 LFM 3.2C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .0160 (7.25) .0170 (7.20) 245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) 245-145AB-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 246 SERIES Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4W 35C @ 4W 2.8C/W @ 400 LFM 2.8C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .0240 (10.90) .0250 (11.40) 246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. 246-197AB-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 36 Normally stocked Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 25C@ 4W 25C@ 4W 2.4C/W @ 400 LFM 2.4C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .0330 (15.10) .0340 (15.60) 247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. 247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 248 SERIES Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert/Horiz. Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4w 35C @ 4w 2.5C/W @ 400 LFM 2.5C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .026 (11.60) .027 (12.20) 248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) 248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Order SpeedClipTM 285SC or 330SC separately. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Order SpeedClipsTM separatley for use with Series 246, 247, 248 or 249 Dimensions: in. (mm) 249 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C@ 4W 35C@ 4W 3.29C/W @ 400 LFM 3.29C/W @ 400 LFM MULTIWATT Standard P/N Weight lbs. (grams) .020 (8.90) .021 (9.40) 249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, 249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) Normally stocked 37 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Height Above PC Board in. (mm) 1.250 (31.8) Maximum Footprint in. (mm) 0.875 (22.2) x 0.215 (5.5) Thermal Performance at Typical Load Natural Forced Convection Convection 85C @ 4W 12C/W @ 200 LFM TO-220, TO-202 Standard P/N 288-1AB Weight lbs. (grams) 0.0057 (2.59) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 288 SERIES Dimensions: in. (mm) 271 SERIES Top-Mount Booster Heat Sinks for Use with 270/272/280 Series Height Above Semiconductor Case in. (mm) 0.500 (12.7) Horizontal Mounting Footprint Dimensions in. (mm) 1.750 (44.5) x 0.700 (17.8) Thermal Performance at Typical Load Natural Forced Convection Convection 62C @ 4W (NOTE A) 31 C @ 4W (NOTE B) 5.1C/W @ 400 LFM 1.8C/W 400 LFM (NOTE B) TO-220 Standard P/N 271-AB Weight lbs. (grams) 0.0052 (2.36) Material: Aluminum, Black Anodized This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. MECHANICAL DIMENSIONS 271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 38 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Small Footprint Low-Cost Heat Sinks Horizontal Mounting Maximum Footing in. (mm) Solderable Tab Options -- 01,02 -- Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 4W 42C @ 4W 70C @ 4W 6.0C/W @ 400 LFM 3.6C/W @ 400 LFM 6.0C/W @ 400 LFM TO-220, TO-202 Standard P/N Height Above PC Board in. (mm) Weight lbs. (grams) 0.0052 (2.36) 0.0105 (5.72) 0.0048 (2.18) 270-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 272-AB 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissi- pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix "O1" or "02" to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 270 SERIES 280 SERIES 272 SERIES 272AB01 272AB02 Dimensions: in. (mm) 289 AND 290 SERIES Low-Cost Single or Dual Package Heat Sinks Height Above PC Board in. (mm) Horizontal Mounting Maximum Footing in. (mm) 1.000 (25.4) x O.710 (18.1) 1.000 (25.4) x 0.710 (18.1) 1.000 (25.4) x 1.180 (30.0) 1.000 (25.4) x 1.180 (30.0) Thermal Performance at Typical Load Natural Forced Convection Convection 50C @ 2W 50C @ 2W 44C @ 2W 44C @ 2W TO-218, TO-202, TO-220 Standard P/N Weight lbs. (grams) 0.0055 (2.49) 0.0055 (2.49) 0.0082 (3.72) 0.0081 (3.67) 289-AB 0.500 (12.7) 289-AP 0.500 (12.7) 290-1AB 0.500 (12.7) 290-2AB 0.500 (12.7) Material: Aluminum, Black Anodized 44C/W @ 400 LFM 44C/W @ 400 LFM 35C/W @ 400 LFM 35C/W @ 400 LFM Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with 289 SERIES no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. MECHANICAL DIMENSIONS 290 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Normally stocked 39 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES Standard P/N High-Performance Slim Profile Heat Sinks With Integral Clips Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Vertical 250-122AB-09 Multiwatt Mounting Style Clip Clip Clip Thermal Performance at Typical Load Natural Forced Convection Convection 50C @ 4W 50C @ 4W 50C @ 4W 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM Solderable Tab Options No Tab 09 25 250-122AB-25 250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 250 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 250-122AB Dimensions: in. (mm) 237 AND 252 SERIES Standard P/N High-Performance, High-Power Vertical Mount Heat Sinks Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Height Above PC Board in. (mm) 237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 237-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM 252-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM Order SpeedClipsTM 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 237 AND 252 SERIES 227-167 252-167 237-167AB2 252-167AB2 237-167AB2-24 252-167AB2-24 NATURAL AND FORCED CONVECTION CHARACTERISTICS 237-167AB3 252-167AB3 237 AND 252 SERIES 237-167AB3 252-167AB3 Dimensions: in. (mm) 291 SERIES Labor-Saving Clip-on Heat Sinks Height Above PC Board in. (mm) Vertical Mounting Footprint Dimensions in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 80 C @ 2W 68 C @ 2W 24C/W @ 600 LFM 16C/W @ 600 LFM TO-220 Standard P/N Mounting Style TO-220 (Clip) TO-220 (Mtg. Hole) Weight lbs. (grams) 0.0026 (1.18) 0.0026 (1.18)) 291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) 291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles. One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 291 SERIES Dimensions: in. (mm) 291-C2 291-H All other products, please contact factory for price, delivery, and minimums. 40 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Height Above PC Board in. (mm) 1.190 (30.2) 1.190 (30.2) 1.190 (30.2) Maximum Footprint in. (mm) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection 58C @ 4W 58C @ 4W 58C @ 4W 7.4CW @ 200 LFM 7.4CW @ 200 LFM 7.4CW @ 200 LFM TO-220 Standard P/N 286-AB 286-CBT 286-CT Material Aluminum, Anodized Copper, Black Copper, Tinned Weight lbs. (grams) 0.0085 (3.86) 0.0250 (11.34) 0.0250 (11.34) Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili- ty. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 286 SERIES Dimensions: in. (mm) 287 SERIES Wave-Solderable Low-Cost Heat Sinks Height Above PC Board in. (mm) Maximum Footprint "A" in. (mm) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 1.000 (25.4) Thermal Performance at Typical Load Natural Forced Convection Convection 65C @ 4W 5510 @ 4W 7.8CW @ 200 LFM 6.4CW @ 200 LFM TO-220 Standard P/N Mounting Slot Mounting Hole Weight lbs. (grams) 0.0090 (4.08) 0.0140 (6.35) 287-1AB 287-1ABH 1.180 (30.0) 287-2AB 287-2ABH 1.180 (30.0) Material: Aluminum, Black Anodized Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-220 and similar semiconductor packages. MECHANICAL DIMENSIONS 287 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dim. "A" 0.500 (12.7) 1.000 (25.4) 0.500 (12.7) 1.000 (25.4) Standard P/N 287-1AB 287-2AB 287-1ABH 287-2ABH Dimensions: in. (mm) 695 SERIES Space-Saving Heat Sinks for Small Stud-Mounted Diodes Maximum Width in. (mm) 1.330 (33.8) Height in. (mm) 0.530 (13.7) Thermal Performance at Typical Load Natural Forced Convection Convection 72C @ 4.0W 5.2C/W @ 400 LFM STUD-MOUNT Standard P/N 695-1B Weight lbs. (grams) 0.0030 (1.36) Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design provides good heat dissipation for use where height is limited above the printed circuit board or base plate. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 695 SERIES Dimensions: in. (mm) Normally stocked 41 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height (Less Mounting Tab) in. (mm) 0.190 (4.0) Weight lbs. (grams) 0.0005 (0.23) 256-DM TO-92 Standard P/N 256-DM Material Beryllium Copper 260 SERIES Cup Clips for TO-5 Case Style Semiconductors Depth of Tapped Base 0.093 (2.36) 0.125 (3.18) 0.125 (3.18) = = = = = = #4-40 UNC #6-32 UNC #10-32 UNF tapped stud plain Base Style: Semiconductor Case Style: Insulation Type: H = hex 5 = TO-5 E = epoxy B = beryllium TO-5 Characteristics Thermal Resistance - Epoxy Insulated Thermal Resistance - Beryllium Oxide Insulated Breakdown Voltage - Epoxy Type (VAC), 60 Hz Breakdown Voltage - Beryllium Type (VAC), 60 Hz Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating Dusty Conditions: % Hipot Rating Dirty Conditions: % Hipot Rating Temperature Range -- Continuous (C) TO-5 14 C/W 16 C/W 500 1000 50 30 10 to 20 -73/+149 Model 260-4T5E 260-4TH5E 260-4TH5B Thread Size: Mounting Style: 4 6 10 T S P TO-5 CASE STYLE CUP CLIPS -- ORDERING GUIDE Standard P/N 260-4T5E 260-4TH5E 260-6SH5E 260-1OSH5E 260-4TH5B 260-6SH5B 260-10SH5B Insulation Type Epoxy Insulated Epoxy Insulatad Epoxy Insulated Epoxy Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated Outline Dimension L x W x I.D. in. (mm) 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) Weight lbs. (grams) 0.0024 (1.09) 0.0031 (1.41) 0.0037 (1.68) 0.0042 (1.91) 0.0042 (1.91) 0.0039 (1.77) 0.0043 (1.95) Case Style TO-5 TO-5 TO-5 TO-5 TO-5 TO-5 TO-5 Materials and Finish: Cups - beryllium copper, black ebonol "C"; Bases - brass, black ebonol "C"; Ceramic Spacers - beryllium oxide Base Mounting Configurations -- TO-5 Plain Type -- Epoxy bonded, or used with #4 pan head screws. Tapped Base -- #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Epoxy Insulated For TO-5 Beryllium Oxide Insulated For TO-5 260-4T5E 260-4TH5E 260-6SH5E 260-10SH5E 260-4TH5B 260-6SH5B 260-10SH5B Normally stocked All other products, please contact factory for price, delivery, and minimums. 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors Single-Level Star 201, 202,204,205, 211 Series Dual-Level Star 203,207,213 Series Dual-Level Sunburst 209, 215 Series Available Standard P/N & Finish Types 201CB, 201AB 202CB 203CB 204CB , 204SB 205CB , 205SB 205AB, 205AP 207CB , 207SB 207AB , 207AP 209CB, 209SB 211CB 213CB, 213SB 213AB, 213AP 215CB, 215AB 215AP Semiconductor Case Diameter Min/Max in. (mm) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0,275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) Heat Sink Inside Dia. "A" in. (mm) 0.150 (3.8) 0.150 (3.8) 0.150 (3.8) 0.255 (6.5) 0.255 (6.5) 0.255 (6.5) 0.255 (6,5) 0.255 (6.5) 0.255 (6.5) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) Heat Sink Outside Dia. "B" in. (mm) 0.640 (16.2) 0.490 (12.5) 0.640 (16.2) 0.550 (4.8) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 1.280 (32.5) 0.830 (21.1) 0.830 (21.1) 0.830 (21.1) 1.400 (35.6) 1.400 (35.6) Heat Sink Height "C" in. (mm) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.187 (4.8) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.437 (11.1) Natural Convection Forced Case Rise Convection Above Ambient (CA@200 LFM) 65C @ 1W 73C @ 1W 53C @ 1W 68C @ 1W 59C @ 1W 68C @ 1W 46C @ 1W 53C @ 1W 30C @ 1W 50C @ 1W 44C @ 1W 51C @ 1W 28C @ 1W 32C @ 1W 31C/W 43C/W 23C/W 35C/W 28C/W 28C/W 20C/W 20C/W 13C/W 24C/W 19C/W 19C/W 15C/W 15C/W Applicable Power Semiconductor Case Types TO-18, TO-24, TO-28, TO-40, TO-44 TO-5, TO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45 Materials and Finishes Available for 200 Series: CB Beryllium copper; black ebonol "C" Finish Silver-bearing copper; black ebonol "C" Aluminum, black anodized Aluminum, no finish applied SB AB AP TO-8, TO-38 NATURAL AND FORCED CONVECTION CHARACTERISTICS 258 SERIES Standard P/N 258 Thermal Links for Fused Glass Diodes Dimensions in. (mm) 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Material Aluminum Finish DeltaCoateTM 151 on all surfaces except solder pads and base DIODES Weight lbs. (grams) 0.0018 (0.82) MECHANICAL DIMENSIONS The thermal resistance from diode leads to chassis or heat sink is 12C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150C/watt to 22C/watt. 258 SERIES Dimensions: in. (mm) 292 SERIES Standard P/N 292-AB Heat Sink for Single TO-92 Height Above PC Board in. (mm) 0.750 (19.1) TO-92 Overall Fin Width in. (mm) 0. 600 (15.3) Thermal Performance Natural Convection 0.225 C/W @ 0.250 W 292 SERIES Finish Black Anodized Weight lbs. (grams) 0.00049 (0.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Normally stocked 43 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) TO-220 and TO-218 Standard P/N Plain Pin Without Pin 634-10ABP 634-10AB 634-15ABP 634-15AB 634-20ABP 634-20AB Material: Aluminum, Black Anodized. Weight lbs. (grams) 0.016 (7.48) 0.025 (11.21) 0.033 (14.95) These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. MECHANICAL DIMENSIONS Notes: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Dimensions: in. (mm) 637 SERIES High-Efficiency Heat Sinks For Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection 76C @ 6W 65C @ 6w 55C @ 6W 48C @ 6W 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/W @ 200 LFM TO-220 Standard P/N Weight lbs. (grams) 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12) 637-10ABP 1.000 (25.4) 637-15ABP 1.500 (38.1) 637-20ABP 2.000 (50.8) 637-25ABP 2.500 (63.5) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 44 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard P/N High-Efficiency Heat Sinks for Vertical Board Mounting Standard P/N Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) TO-218, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 76C @ 6W 65C @ 6W 55C @ 6W 48C @ 6W 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/M @ 200 LFM 626-10ABP 627-10ABP 1.000 (25.4) 626-15ABP 627-15ABP 1.500 (38.1) 626-20ABP 627-20ABP 2.000 (50.8) 626-25ABP 627-25ABP 2.500 (63-5) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 626 AND 627 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM TO-220, TO-247, TO-218 Weight lbs (grams) 0.0515 (23.36) 0.0760 (34.60) 0.1030 (47.00) 0.1250 (57.00) 657-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 46 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES Standard P/N High-Performance Notched Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM 657-10ABPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPN 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks with SpeedClipsTM for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM 657-10ABPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPSC 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 657 SERIES (EXTRUSION PROFILE 6533) 677 SERIES High-Performance, High-Power Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) TO-218, TO-220, TO-247 15-LEAD Multiwatt Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection 52C @ 6W 46C @ 6W 40C @ 6W 35C @ 6W 3.1C/W @ 200 LFM 2.8C/W @ 200 LFM 2.5C/W @ 200 LFM 2.2C/W @ 200 LFM 677-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 677-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 677-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 677 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm) Normally stocked 47 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. (mm) Outline Dimensions in. (mm) 1.860 (47.2)-sq 1.860 (47.2)-sq 1.860 (47.2)-sq Thermal Performance at Typical Load Natural Forced Convection Convection 44C @ 7.5W 44C @ 7.5W 44C @ 7.5W 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM Semiconductor Mounting Hole Pattern (1) TO-3 (1) TO-66 (2) TO-220 TO-3, TO-66, TO-220 Standard P/N Weight lbs. (grams) 0.0700 (31.75) 0.0700 (31.75) 0.0700 (31.75) 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91C. MECHANICAL DIMENSIONS SEMICONDUCTOR MOUNTING HOLES NATURAL AND FORCED CONVECTION CHARACTERISTICS 690 SERIES TO-3 TO-66 *TWO TO-220'S Dimensions: in. (mm) 680 SERIES Maximum Efficiency Omnidirectional Heat Sinks Height Above PC Board "A" in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 7OC @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM Semiconductor Mounting Hole Pattern (1) TO-3 (1) TO-3 (1) TO-3 (1) TO-3 (2) TO-220 (2) TO-220 (2) TO-220 (2) TO-220 TO-3, TO-220 Standard P/N Weight lbs. (grams) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 680-5A 0.500 (12.7) 680-75A 0.750 (19.1) 680-10A 1.000 (25.4) 680-125A 1.250 (31.8) 680-5220 0.500 (12.7) 680-75220 0.750 (19.1) 680-10220 1.000 (25.4) 680-125220 1.250 (31.8) Material: Aluminum, Black Anodized Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix "K" (Example: 680-5K). MECHANICAL DIMENSIONS 680 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A 220 K Dimensions: in. (mm) TO-3 *TWO TO-220'S All other products, please contact factory for price, delivery, and minimums. 48 Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Low-Height Heat Sinks Footprint Dimensions in. (mm) Height in. (mm) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) Mounting Hole Dia. in. (mm) 0.200 (5.1) 0.270 (6.9) None None Thermal Performance at Typical Load Natural Forced Convection Convection 52C @ 5.0W 52C @ 5.0W 52C @ 5.0W 41C @ 5.0W 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.0C/W @ 175 LFM DO-4/DO-5 Diodes Standard P/N Weight lbs. (grams) 0.0500 (22.68) 0.0500 (22.68) 0.0500 (22.68) 0.0810 (36.74) 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, Black Anodized Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 601 SERIES (EXTRUSION PROFILE 1284) 603 SERIES (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES K E F Dimensions: in. (mm) 635 SERIES Space-Saving Low-Cost Heat Sinks Height Above PC Board "A" in. (mm) Outline Dimensions in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 90C @ 8.0W 77C @ 8.0W 61C @ 8.0W 53C @ 8.0W 6.0C/W @ 300 LFM 4.8C/W @ 300 LFM 3.6C/W @ 300 LFM 3.1C/W @ 300 LFM Semiconductor Mounting Hole Pattern TO-3 TO-3 TO-3 T0-3 TO-3 Standard P/N Weight lbs. (grams) 0.0200 (9.07) 0.0220 (9.98) 0.024 (10.89) 0.028 (12.70) 635-5B2 0.500 (12.7) 1.900 (48.3) x 1.420 (36.0) 635-75B2 0.750 (19.1) 1.900 (48.3) x 1.420 (36.0) 635-10B2 1.000 (25.4) 1.900 (48.3) x 1.420 (36.0) 635-125B2 1.250 (31.8) 1.900 (48.3) x 1.420 (36.0) Material: Aluminum Alloy, Black Anodized Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is available for heat sinking. Four different heights are available, all with TO-3 mounting hole pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 635 SERIES Dimensions: in. (mm) Normally stocked 49 All other products, please contact factory for price, delivery, and minimums. |
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