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Product Specification
Part Name: OEL Display Module Part ID: UG-9696HDDAF11 Doc No.: SAS1-J013-B
Customer:
Approved by
From: Univision Technology Inc.
Approved by
Univision Technology Inc.
8, Kebei RD 2, Science Park, Chu-Nan, Taiwan 350, R.O.C.
Notes: 1. Please contact Univision Technology Inc. before assigning your product based on this module specification 2. The information contained herein is presented merely to indicate the characteristics and performance of our products. No responsibility is assumed by Univision Technology Inc. for any intellectual property claims or other problems that may result from application based on the module described herein.
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Revised History
Part Number UG-9696HDDAF11 Revision A New Page 3 Page 5 UG-9696HDDAF11 B Page 7 Page 12 Revision Content Section 1.5 Section 1.6 Section 3.2 Section 4.4
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Revised on August 29, 2008
Update Function Description Modify Application Circuit Update DC Characteristics Update Initialization
January 20, 2009
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Notice:
No part of this material may be reproduces or duplicated in any form or by any means without the written permission of Univision Technology Inc. Univision Technology Inc. reserves the right to make changes to this material without notice. Univision Technology Inc. does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. (c) Univision Technology Inc. 2009, All rights reserved. All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies.
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Revision History ................................................................................................... i Notice ................................................................................................................... ii Contents .............................................................................................................. iii 1. Basic Specifications .................................................................................. 1~5
1.1 1.2 1.3 1.4 1.5 1.6 Display Specifications .................................................................................................1 Mechanical Specifications ...........................................................................................1 Active Area & Pixel Construction ...............................................................................1 Mechanical Drawing....................................................................................................2 Pin Definition...............................................................................................................3 Block Diagram .............................................................................................................5
2. Absolute Maximum Ratings .......................................................................... 6 3. Optics & Electrical Characteristics ......................................................... 7~10
3.1 Optics Characteristics ..................................................................................................7 3.2 DC Characteristics .......................................................................................................7 3.3 AC Characteristics .......................................................................................................8 3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics ...........................8 3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics ...........................9 3.3.3 Serial Interface Timing Characteristics ...........................................................10
4. Functional Specification ....................................................................... 11~13
4.1 Commands .................................................................................................................11 4.2 Power down and Power up Sequence ........................................................................11 4.2.1 Power up Sequence ..........................................................................................11 4.2.2 Power down Sequence .....................................................................................11 4.3 Reset Circuit...............................................................................................................11 4.4 Actual Application Example ......................................................................................12
5. Reliability ...................................................................................................... 14
5.1 Contents of Reliability Tests......................................................................................14 5.2 Lifetime......................................................................................................................14 5.3 Failure Check Standard..............................................................................................14
6. Outgoing Quality Control Specifications .............................................. 15~19
6.1 Environment Required ...............................................................................................15 6.2 Sampling Plan ............................................................................................................15 6.3 Criteria & Acceptable Quality Level .........................................................................15 6.3.1 Cosmetic Check (Display Off) in Non-Active Area ........................................15 6.3.2 Cosmetic Check (Display Off) in Active Area.................................................18 6.3.3 Pattern Check (Display On) in Active Area.....................................................19
7. Package Specifications ................................................................................ 20 8. Precautions When Using These OEL Display Modules ....................... 21~23
8.1 Handling Precautions .................................................................................................21
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8.2 8.3 8.4 8.5
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Storage Precautions....................................................................................................22 Designing Precautions ...............................................................................................22 Precautions when disposing of the OEL display modules.........................................23 Other Precautions.......................................................................................................23
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1. Basic Specifications
1.1 Display Specifications 1) 2) 3) Display Mode: Display Color: Drive Duty: Passive Matrix 65,536 Colors (Maximum) 1/96 Duty
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1.2 Mechanical Specifications 1) 2) 3) 4) 5) 6) 7) Outline Drawing: Number of Pixels: Panel Size: Active Area: Pixel Pitch: Pixel Size: Weight: According to the annexed outline drawing 96 (RGB) x 96 25.80 x 26.15 x 1.40 (mm) 19.852 x 19.856 (mm) 0.069 x 0.207 (mm) 0.049 x 0.191 (mm) 1.95 (g)
1.3 Active Area & Pixel Construction
P0.069x(96x3)-0.02=19.852 (A/A)
P0.207x96-0.016=19.856 (A/A)
0.207 0.187 0.069 0.049
R
G
B
( Column 1 )
( Column 288 )
R<95>
( Row 96 )
R<94>
( Row 95 )
R<1>
( Row 2 )
R<0>
( Row 1 )
0.207 0.191 Detail "A" Scale (10:1)
C<0>
C<287>
1
Item A Remark Original Drawing
Date 20080704
0.70.5 (1.974) (2.974) 5 1.40.1
1.4 Mechanical Drawing
25.80.2 (Panel Size) 25.80.2 (Cap Size) 24.4 (Polarizer) 21.852 (V/A) P0.069x(96x3)-0.02=19.852 (A/A) 10
(2.1) (1.1) 0.50.5 Remove Tape t=0.15mm Max 8 (23.38) (18.38) Polarizer t=0.2mm (27.65) (33.4) C<0>
( Column 1 )
"A"
Active Area 1.10" 96(RGB) x 96 Pixels
N.C. (GND)
VSSH
VCC_R
VCC_C
PRE
IREF
PS
D7
D6
D5
D4
D3
D2
D1
D0
A0
RDB
WRB
RSTB
VDDIO
VSS
PSEL
VDD
VDDR
VCC_C
VSSH
OSC2
OSC1
C80
CSB
N.C. (GND)
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Notes:
1. Driver IC: SEPS114A 2. Die Size: 12620um x 775um 3. COF Number: SEPS114AF00 4. Interface: 8-bit 68XX/80XX Parallel, 4-wire SPI 5. General Tolerance: 0.30 6. The total thickness (1.50 Max) is without polarizer protective film & remove tape. The actual assembled total thickness with above materials should be 1.75 Max.
P0.207x96-0.016=19.856 (A/A) 21.856 (V/A) 23.25 (Polarizer) 24.150.2 (Cap Size) 26.150.2 (Panel Size) (37) R<95>
( Row 96 )
C<287>
( Column 288 )
R<94>
( Row 95 )
(1.5)
R<1>
( Row 2 )
R<0>
( Row 1 )
Glue (7.25) (3.8) (1.56)
Protective Film 23x7.5x0.055mm
10.850.2
31
1
2-R0.50.05 (1.4)
4.5 5 Contact Side 0.1 0.8 Max
0.207 0.187 0.069 0.049
0.1 1.25 2.5
R
G
B
(1.15)
20.50.1 (Alignment Hole) P0.7x(31-1)=210.05 (W0.350.03) 23.50.2
Customer Approval Signature
Unless Otherwise Specified
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Unit
General Roughness
0.191 0.207
(Reference Mechnical Design)
Detail "A" Scale (10:1)
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Symbol N.C. (GND) VSSH VCC_R VCC_C PRE IREF OSC2 OSC1 C80 PS D7 D6 D5 D4 D3 D2 D1 D0 A0 CSB RDB WRB RSTB VDDIO VSS PSEL VDD VDDR VCC_C VSSH N.C. (GND) Drawing Number DFD9696HBCF13
Rev. A Material mm Title UG-9696HDDAF11 Folding Type OEL Display Module Pixel Number: 96(RGB) x 96, 65,536 Colors, COF Package Soda Lime / Polyimide Tolerance 0.3 Dimension Angle 1 By Date Drawn Humphrey Lin 20080704 E.E. Ting-Kuo Hu 20080704 Panel / E. Ivy Lo 20080704 P.M. Cherry Lin 20080704 Scale 1:1 Sheet 1 of 1 Size A3
The drawing contained herein is the exclusive property of Univision. It is not allowed to copy, reproduce and or disclose in any formats without permission of Univision.
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1.5 Pin Definition Pin Number Power Supply Power Supply for Operation 27 VDD P Symbol Type
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Function
This is a voltage supply pin. It must be connected to external source.
Power Supply for Core Logic Circuit 28 VDDR P
This is a voltage supply pin. It can be supplied externally or regulated internally from VDD. A capacitor should be connected between this pin & VSS under all circumstances.
Power Supply for I/O Pin 24 VDDIO P
This pin is a power supply pin of I/O buffer. It should be connected to VDD or external source. All I/O signal should have VIH reference to VDDIO. When I/O signal pins (C80, PS, D0~D7, control signals...) pull high, they should be connected to VDDIO.
Ground of Logic Circuit 25 4, 29 2, 30 Driver External Voltage Reference for Pre-charge Signal 5 PRE I/O
This is the precharge driving voltages for OEL driving segment pins respectively. A zener diode should be connected between this pin and VSS.
VSS VCC_C VSSH
P P P
A reference for the logic pins. external ground.
It must be connected to
Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. It must be connected to external source.
Ground of OEL Panel
This is the ground pins for analog circuits. connected to external ground. It must be
Current Reference for Brightness Adjustment 6 IREF I/O
This is the current reference pin to generate precharge and driving current. A 39k resistor should be connected between this pin and VSS.
Voltage Output High Level for Scan Signal 3 Clock Fine Adjustment for Oscillation 8 7 Configuration Regulator Enable/Disable for Logic Power Supply 26 PSEL I
This pin is the regulator enable/disable input of VDDR. If it is connected to VDD, the internal regulator is used. Otherwise, an external voltage supplier should be used.
VCC_R
P
This is the scan driver power supply pin. A tantalum capacitor should be connected between this pin and VSS.
OSC1 OSC2
I O
The frequency is controlled by external 27k resistor between OSC1 and OSC2. The oscillator signal is used for system clock generation. When the external clock mode is selected, OSC1 is used external clock input.
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1.5 Pin Definition (Continued) Pin Number Interface Select the CPU Type 9 10 23 20 19 C80 PS RSTB CSB A0 I I I I I
Low: 80XX-Series MCU High: 68XX-Series MCU.
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Symbol
Type
Function
Select Parallel/Serial Interface Type
Low: Serial Interface High: Parallel Interface
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of the chip is executed.
Chip Select
Low: SEPS114A is selected and can be accessed. High: SEPS114A is not selected and cannot be accessed.
Data/Command Control
Low: Command High: Parameter/Data
Read or Read/Write Enable 21 RDB I
68XX Parallel Interface: Bus Enabled Strobe (Active High) 80XX Parallel Interface: Read Strobe Signal (Active Low) While using SPI, it must be connected to VDD or VSS.
Write or Read/Write Select 22 WRB I
68XX Parallel Interface: Read (Low)/Write (High) Select 80XX Parallel Interface: Write Strobe Signal (Active Low) While using SPI, it must be connected to VDD or VSS.
Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to the microprocessor's data bus. PS Description D[0] SCL: Synchronous Clock Input D[1] SDI: Serial Data Input 0 D[2] SDO: Serial Data Output D[3] R/W: Serial Read (High)/Write (Low) 1 8-bit Bus: D[7:0] While using SPI, the unused pins must be connected to VSS.
11~18
D7~D0
I/O
Reserve Reserved Pin (Supporting Pin) 1, 31 N.C. (GND) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.
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1.6 Block Diagram
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Active Area 1.10" 96(RGB) x 96 Pixels
C<287>
R<95>
R<94>
R<1>
C<0>
~
~~~
~
SEPS114A
VCC_R VCC_C PRE IREF OSC2 A0 CSB RDB WRB RSTB VDDIO OSC1 C80 PS ~ PSEL VDD D7 D0 VDDR VCC_C VSSH C8 C7 C3 C4 C1 C2 VSSH VSS
R2 C9 D1 R1 C5 C6
MCU Interface Selection: C80, PS Pins connected to MCU interface: D7~D0, A0, CSB, RDB, WRB, and RSTB C1, C3, C5: 0.1F C2, C4, C8: 4.7F C6, C9: 4.7F / 25V Tantalum Capacitor C7: 2.2F R1: 39k R2: 27k D1: 2.7V, 0.5W Zener Diode
R<0>
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2. Absolute Maximum Ratings
Parameter Supply Voltage for Operation Supply Voltage for I/O Pins Supply Voltage for Display Operating Temperature Storage Temperature Symbol VDD VDDIO VCC_C TOP TSTG Min -0.3 -0.3 -0.3 -30 -40 Max 4 4 16 70 80
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Unit V V V C C
Notes 1, 2 1, 2 1, 2 -
Note 1: All the above voltages are on the basis of "VSS = 0V". Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. "Optics & Electrical Characteristics". If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
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3. Optics & Electrical Characteristics
3.1 Optics Characteristics Characteristics Brightness C.I.E. (White) C.I.E. (Red) C.I.E. (Green) C.I.E. (Blue) Dark Room Contrast View Angle Symbol Lbr (x) (y) (x) (y) (x) (y) (x) (y) CR Conditions With Polarizer (Note 3) With Polarizer With Polarizer With Polarizer With Polarizer Min 80
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Typ 100
Max Unit 0.34 0.37 0.68 0.38 0.35 0.66 0.18 0.20 degree cd/m2
0.26 0.30 0.29 0.33 0.60 0.64 0.30 0.34 0.27 0.31 0.58 0.62 0.10 0.14 0.12 0.16 - >2000:1 >160 -
* Optical measurement taken at VDD = 2.8V, VCC_C = 13V. Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics Characteristics Supply Voltage for Operation Supply Voltage for Display High Level Input Low Level Input High Level Output Low Level Output Operating Current for VDD Operating Current for VCC_C Symbol VDD VCC_C VIH VIL VOH VOL IDD ICC_C Note 4 Note 5 IOL = -0.1mA Note 3 Conditions Min 2.4 1.65 12.5 0.8xVDDIO 0 IOH = -0.1mA VDDIO-0.4 Typ 2.8 2.8 13 2.5 12.1 20.2 0.4 3.5 15.2 25.3 Max Unit 3.3 VDD 13.5 VDDIO 0.4 V V V V V V V mA mA mA
Supply Voltage for I/O Pins VDDIO
Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC_C) are subject to the change of the panel characteristics and the customer's request. Note 4: VDD = 2.8V, VCC_C = 13V, 50% Display Area Turn on. Note 5: VDD = 2.8V, VCC_C = 13V, 100% Display Area Turn on. * Software configuration follows Section 4.4 Initialization.
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3.3 AC Characteristics
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3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics: (VDD = 2.8V, Ta = 25C) Symbol tAH6 tAS6 tCYC6 tELR6 tEHR6 tCYC6 tELW6 tEHW6 tRDD6 tRDH6 tDS6 tDH6 Description Address Setup Timing Address Hold Timing System Cycle Timing Read "L" Pulse Width Read "H" Pulse Width System Cycle Timing Write "L" Pulse Width Write "H" Pulse Width Read Data Output Delay Time Data Hold Timing Data Setup Timing Data Hold Timing
* CL = 15pF
Min Max Unit (Read) (Write) (Read) (Write) 10 5 10 5 200 90 90 100 45 45 0 0 40 10 70 70 ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Port CSB RS
E
D[17:9]
* All the timing reference is 10% and 90% of VDD.
( Read Timing )
( Write Timing ) 8
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3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics: (VDD = 2.8V, Ta = 25C) Symbol tAS8 tAH8 tCYC8 tRDLR8 tRDHR8 tCYC8 tWRLW8 tWRHW8 tRDD8 tRDH8 tDS8 tDH8 Description Address Setup Timing Address Hold Timing System Cycle Timing Read "L" Pulse Width Read "H" Pulse Width System Cycle Timing Write "L" Pulse Width Write "H" Pulse Width Read Data Output Delay Time Data Hold Timing Data Setup Timing Data Hold Timing
* CL = 15pF
Min Max Unit 5 5 200 90 90 100 45 45 0 30 10 60 60 ns ns ns ns ns ns ns ns ns ns ns ns
Port CSB A0 RDB
WRB
D[7:0]
* All the timing reference is 10% and 90% of VDD.
( Read Timing )
( Write Timing ) 9
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3.3.3 Serial Interface Timing Characteristics:
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(VDD = 2.8V, Ta = 25C)
Symbol tCYCS tSLW tSHW tDSS tDHS tCSS tCSH tRSS tRSH Item Serial Clock Cycle SCL "L" Pulse Width SCL "H" Pulse Width Data Setup Timing Data Hold Timing CSB-SCL Timing CSB-Hold Timing RS-SCL Timing RS-Hold Timing Min 200 90 90 25 25 25 25 25 25 Max Unit ns ns ns ns ns ns ns ns ns SDI CSB A0 SCL Port
* All the timing reference is 10% and 90% of VDD.
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4. Functional Specification
4.1. Commands Refer to the Technical Manual for the SEPS114A 4.2 Power down and Power up Sequence
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To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 4.2.1 Power up Sequence: 1. 2. 3. 4. 5. 6. Power up VDD & VDDIO Send Display off command Initialization Clear Screen Power up VCC_C Delay 100ms (when VCC_C is stable) 7. Send Display on command 4.2.2 Power down Sequence: 1. Send Display off command 2. Power down VCC_C 3. Delay 100ms (when VCC_C is reach 0 and panel is completely discharges) 4. Power down VDD & VDDIO 4.3 Reset Circuit When RSTB input is low, the chip is initialized with the following status: 1. Standby Mode: On 2. Frame Frequency: 95Hz 3. Oscillation: Internal Oscillator Off 4. DDRAM Write Horizontal Address: XS = 0x00, XE = 0x5F 5. DDRAM Write Vertical Address: YS = 0x00, YE = 0x5F 6. Display Data RAM Write: MDIR1 = 0, MDIR0 = 0, VH = 0 7. Row Scan Shift Direction: R0, R1, ... , R94, R95 8. Column Data Shift Direction: C0, C1, ... , C286, C287 9. Display On/Off: Off 10. Panel Display Size: FX = 0x00, TX = 0x5F, FY = 0x00, TY = 0x5F 11. Display Data RAM Read Column/Row Address: DX = 0x00, DY = 0x00 12. Discharge Time: 8 Clock 13. Peak Pulse Delay: 5 Clock 14. Peak Pulse Width Time (R/G/B): 5 Clock 15. Precharge Current (R/G/B): 0A
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VDD, VDDIO on VCC C on Display on VCC
C
VDD/VDDIO VSS/Ground
Display off VCC C off VDD, VDDIO off VCC
C
VDD/VDDIO VSS/Ground
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16. Driving Current (R/G/B): 0A 4.4 Actual Application Example Command usage and explanation of an actual example
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Set SOFT_RESET 0x01, 0x00
Set RGB_IF 0xE0, 0x00
Set COLUMN_CURRENT_B 0x42, 0xFF
Set STANDBY_ON_OFF 0x14, 0x00
Set RGB_POL 0xE1, 0x00
Set ROW_OVERLAP 0x48, 0x00
Set DISP_ON_OFF 0x02, 0x00
Set DISPLAY_MODE_CONTROL 0xE5, 0x00
Set DISCHARGE_TIME 0x18, 0x02
Set ANALOG_CONTROL 0x0F, 0x40
Set CPU_IF 0x0D, 0x00
Set PEAK_PULSE_DELAY 0x16, 0x05
Set OSC_ADJUST 0x1A, 0x03
Set MEMORY_WRITE/READ 0x1D, 0x00
Set PEAK_PULSE_WIDTH_R 0x3A, 0x05
Set DISPLAY_X1 0x30, 0x00
Set ROW_SCAN_DIRECTION 0x09, 0x00
Set PEAK_PULSE_WIDTH_G 0x3B, 0x05
Set DISPLAY_X2 0x31, 0x5F
Set ROW_SCAN_MODE 0x13, 0x00
Set PEAK_PULSE_WIDTH_B 0x3C, 0x05
Set DISPLAY_Y1 0x32, 0x00
Set COLUMN_CURRENT_R 0x40, 0xEE
Set PRECHARGE_CURRENT_R 0x3D, 0x00
Set DISPLAY_Y2 0x33, 0x5F
Set COLUMN_CURRENT_G 0x41, 0xCB
Set PRECHARGE_CURRENT_G 0x3E, 0x00
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Set PRECHARGE_CURRENT_B 0x3F, 0x00
Clear Screen
Set DISP_ON_OFF 0x02, 0x01
Set ROW_SCAN_ON/OFF 0x17, 0x00
Set DISPLAYSTART_X 0x38, 0x00
Set SCAN_OFF_LEVEL 0x49, 0x04
Set DISPLAYSTART_Y 0x39, 0x00
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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5. Reliability
5.1 Contents of Reliability Tests Item High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage Conditions 70C, 240 hrs -30C, 240 hrs 80C, 240 hrs -40C, 240 hrs
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Criteria
The operational functions work.
High Temperature/Humidity Operation 60C, 90% RH, 120 hrs -40C 85C, 24 cycles Thermal Shock 60 mins dwell * The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests.
5.2 Lifetime End of lifetime is specified as 50% of initial brightness. Parameter Storage Life Time Min 20,000 Max Unit hr hr Condition 100 cd/m2, 50% Checkerboard Ta = 25C, 50% RH Notes 6 Operating Life Time 10,000
Note 6: The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.
5.3 Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 235C; 5515% RH.
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6. Outgoing Quality Control Specifications
6.1 Environment Required Customer's test & measurement are required to be conducted conditions: Temperature: Humidity: Fluorescent Lamp: Distance between the Panel & Lamp: Distance between the Panel & Eyes of the Inspector: Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic.
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under the following 23 5C 55 15 %RH 30W 50 cm 30 cm
6.2 Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level Partition Major Minor AQL 0.65 1.0 Definition Defects in Pattern Check (Display On) Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge)
X
Panel General Chipping
Minor
Y
X
Y
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Check Item Classification
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Criteria Any crack is not allowable.
Panel Crack
Minor
Cupper Exposed (Even Pin or Film)
Minor
Not Allowable by Naked Eye Inspection
Film or Trace Damage
Minor
Not Allowable
Terminal Lead Twist
Minor
Not Allowable
Terminal Lead Broken
Minor
Terminal Lead Prober Mark
Acceptable
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Check Item Classification
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Criteria NG if any bent lead cause lead shorting.
Minor
Terminal Lead Bent (Not Twist or Broken)
NG for horizontally bent lead more than 50% of its width.
Minor
Glue or Contamination on Pin (Couldn't Be Removed by Alcohol) Ink Marking on Back Side of panel (Exclude on Film)
Minor
Acceptable
Ignore for Any
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6.3.2 Cosmetic Check (Display Off) in Active Area
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It is recommended to execute in clear room environment (class 10k) if actual in necessary. Classification Check Item Any Dirt & Scratch on Acceptable Polarizer's Protective Film Scratches, Fiber, Line-Shape Defect Minor (On Polarizer) Dirt, Black Spot, Foreign Material, Minor (On Polarizer) Criteria Ignore for not Affect the Polarizer W 0.1 Ignore W > 0.1, L 2 n1 L>2 n=0 0.1 Ignore 0.1 < 0.25 n1 0.25 < n=0 0.5 Ignore if no Influence on Display 0.5 < n=0
Dent, Bubbles, White spot (Any Transparent Spot on Polarizer)
Minor
Fingerprint, Flow Mark Minor Not Allowable (On Polarizer) * Protective film should not be tear off when cosmetic check. ** Definition of W & L & (Unit: mm): = (a + b) / 2
L
b: Minor Axis W a: Major Axis
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6.3.3 Pattern Check (Display On) in Active Area Check Item No Display Classification Major
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Criteria Not allowable
Bright Line
Major
Missed Line
Major
Pixel Short
Major
Darker Pixel
Major
Wrong Display
Major
Un-Uniform (Luminance Variation within a Display)
Major
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7. Package Specifications
EPE COVER FOAM 351x212x1, ANTISTATIC x 1 Pcs x 1 pcs (Empty)
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16 Pcs Tray Vacuum packing B Module x 15 pcs A Staggered Stacking EPE PROTECTTIVE
Tray 420x285 T=0.8mm
Exsiccator x 2 pcs Brimary Primary Box 4 SET C SET
Wrapped with adhesive tape x 16 pcs B
Vacuum packing bag
EPE PROTECTTIVE 370mm x 280mm x 20mm
CARTON BOX
Label
Primary L450mm x W296 x H110, B wave xC 4Pcs
Univision Technology Inc. Part ID :
Label
Lot ID : Q'ty : QC :
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Item Holding Trays Total Trays Primary Box (A) (B) (C) 15 16 1~4
Quantity per Primary Box per Primary Box (Including 1 Empty Tray) per Carton (4 as Major / Maximum)
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Univision Technology Inc.
8. Precautions When Using These OEL Display Modules
8.1 Handling Precautions 1) 2) 3)
Doc. www..com No: SAS1-J013-B
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Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents Hold the OEL display module very carefully when placing the OEL display module onto/into any device. Do not apply excessive stress or pressure to the OEL module. And, do not over bend the film with electrode layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
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Do not apply stress to the LSI chips and the surrounding molded sections. Do not disassemble nor modify the OEL display module. Do not apply input signals while the logic power is off. Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 11) Protection film is being applied to the surface of the display panel and removes
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Univision Technology Inc.
Doc. www..com No: SAS1-J013-B
the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.
8.2 Storage Precautions 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Univision Technology Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.
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8.3 Designing Precautions 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. As for EMI, take necessary measures on the equipment side basically. When fastening the OEL display module, fasten the external plastic housing section. If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. The electric potential to be connected to the rear face of the IC chip should be as follows: SEPS114A * Connection (contact) to any other potential than the above may lead to rupture of the IC.
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Univision Technology Inc.
8.4 Precautions when disposing of the OEL display modules 1)
Doc. www..com No: SAS1-J013-B
Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
8.5 Other Precautions 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the COF With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
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