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| www..com THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DATA DAT SIZE SUBSTRATE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.020" x 0.020" (0.003") x 0.010" (0.003") SILICON, ALUMINA, QUARTZ, OR GLASS TANT ANTALUM NICHROME OR TANTALUM NITRIDE 15,000 A MINIMUM GOLD 10,000 A MINIMUM ALUMINUM OPTIONAL SUBSTRATE BARE SUBSTRATE GOLD BACK OPTIONAL 0.020" A DAT ELECTRICAL DATA 0.020" RESISTANCE RESISTANCE RANGE SILICON, QUARTZ, GLASS ALUMINA ABSOLUTE TOLERANCE T.C.R. SILICON, QUARTZ, GLASS ALUMINA NICHROME 1.5M 2 TO 1.5M 300K 2 TO 300K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE STANDARD 50ppm/C STANDARD OPTIONAL TO 5ppm/C STANDARD 50ppm/C STANDARD OPTIONAL TO 25ppm/C ANTALUM TANTALUM NITRIDE 1.5M 2 TO 1.5M 300K 2 TO 300K 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE STANDARD 150ppm/C STANDARD OPTIONAL TO 10ppm/C STANDARD 150ppm/C STANDARD OPTIONAL TO25ppm/C Minimum bonding area for < 100 Ohm resistance. Layout varies with value. DAT SERIES DATA CURRENT NOISE DIELECTRIC BREAKDOWN INSULATION RESISTANCE INSULATION RESISTANCE OPERATING VOLT OPERATING VOLTAGE RATING POWER RATING SILICON, ALUMINA QUARTZ, GLASS SHORT TERM OVERLOAD HIGH TEMP EXPOSURE THERMAL SHOCK RESISTANCE MOISTURE RESISTANCE STABILITY STABILITY OPERATING OPERATING TEMP RANGE STRAY DISTRIBUTED CAPACIT ACITANCE CAPACITANCE TaN SILICON / NiCr OR TaN ALUMINA / NiCr TaN ALUMINA / TaN QUARTZ / NiCr TaN QUARTZ / TaN GLASS / NiCr TaN GLASS / TaN 101 250K 101 TO 250K: -40dB 100 250K 100, 250K: -30dB 400V MIN. 1012 MIN. 100 V MAX. DERATED LINEARLY 250mW (70C DERATED LINEARLY TO 150C) P = E 2/R DERATED LINEARLY 50mW (70C DERATED LINEARLY TO 150C) P = E 2/R 0.2 RATED 25 0. 5X RATED POWER, 25C, 5 SEC., 0.25% MAX. R/R: 0.1% MSI TYPICAL 0.25% 0.03 03% 150C, 100 HRS., 0.25% MAX. R/R: 0.03% MSI TYPICAL 107F, 0.25% MIL-STD 202, METHOD 107F, 0.25% MAX. R/R: 0.1% MSI TYPICAL 0.1 0. 0.5 MIL-STD 202, METHOD 106, 0.5% MAX. R/R: 0.1% MSI TYPICAL 70C, POWER, 0.5% 1000 HRS., 70C, 100% POWER, 0.5% MAX. R/R: 0.1% MSI TYPICAL -55 -55C TO +150C 2pF 0.06pF 0.08pF 0.02pF 0.05pF 0.04pF 0.06pF DESIGNATION PART NUMBER DESIGNATION MSTF 2 SERIES X SUBSTRATE SUBSTRATE A G Q S = = = = Alumina Glass Quartz Silicon X RESISTIVE FILM N = Nichrome T = Tantalum Nitride XXXXX OHMIC VALUE 5-Digit Number: 1st 4 Digits Are Significant With "R" As Decimal Point When Required. 5th Digit Represents Number of Zeros. X TOLERANCE S X Q B D F G J K = 0.01%* = 0.02%* = 0.05%* = 0.1% = 0.5% = 1% = 2% = 5% = 10% A B C D E F G GB X OPTION = 50ppm/C = 25ppm/C = 10ppm/C = 5ppm/C = Aluminum Bond Pads = 100ppm/C = Gold Bond Pads Std.** = Gold Backside MINI-SYSTEMS, INC. THIN FILM DIVISION 45 FRANK MOSSBERG DRIVE, ATTLEBORO, MA 02703 508-226-2111 FAX: 508-226-2211 DCN TF 101-D-0698 EXAMPLE: MSTF 2SN-50R00F-GB = 0.020" x 0.020", Silicon Substrate, Resistor, 50 Tol., Nichrome Resistor, 50 , 1% Tol., 50 ppm/C, Gold Backside. * Value dependent on Alumina. Consult sales. **Always used when no other option is required. 9 |
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