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MA4SPS502
SURMOUNTTM PIN Diode
Rev. V2
Features
Surface Mount Device No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS* Compliant and 260C Reflow Compatible
Case Style Outline Drawing ODS-12701,2
Description and Applications
This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power (10 W C.W.) or higher incident peak power (500 W) series, shunt, or seriesshunt switches. Small parasitic inductance, 0.35 nH, and an excellent RC time constant, 0.22 pS, make these devices ideal for switch applications where higher P1dB and IP3 values are required. These diodes can also be used in p, T, tapered resistance, and switched-pad attenuator control circuits for 50W or 75W systems.
1. Backside metal: 0.1 M thick. 2. Hatched areas indicate backside ohmic gold contacts.
INCHES DIM Min. Max. Min.
MM Max.
A B C D E
0.058 0.026 0.004 0.020 0.013
0.062 0.030 0.006 0.022 0.015
1.47 0.66 0.10 0.51 0.33
1.57 0.76 0.15 0.56 0.38
Absolute Maximum Ratings @ TAMB = 25C
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power ( RF & DC ) Absolute Maximum 600mA | -275 V | -65C to +125C -55 C to +150C +175C 3W
Ordering Information Tape and Reel Gel Pack (100 pieces) MA4SPS502
1
Pocket Tape (3000 pieces) MADP-000502-12700P
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS502
SURMOUNTTM PIN Diode
Rev. V2
Electrical Specifications @ TAMB = +25C Symbol
CT -40V, 1GHz 100mA, 100MHz RS 20mA, 100MHz VF VR IR JL TL 10mA 10A -200V -40V Steady State +10mA / -6mA ( 50% - 90% V ) pF V V A nA C/W S 8 50 2.8 | -200 | 0.090 1.4 2.4 0.87 | -275 | | -10 | 2.2 3.2 1.00
Conditions
-40V, 1MHz
Units
pF
Min.
Typical
0.140
Max.
0.200
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn or RoHS compliant solders is recommended. A conductive silver epoxy may also be used .
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended to use a Gold-Tin interface at the circuit board mounting pads. Position the device so that its mounting pads are force aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 grams of perpendicular to the top surface of the die. The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce thermal and/or mechanical stresses. It is also not recommended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attach is completed.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS502
SURMOUNTTM PIN Diode
Rev. V2 Typical Total Resistance (Rs) vs. Forward Current (If) and Frequency
4.0 3.5 3.0 20mA 2.5 500mA 2.0 1.5 1.0 0.5 0.0 0.00E+00 2.00E+08 4.00E+08 6.00E+08 8.00E+08 1.00E+09
0.00E+00 0.00E+00 2.00E+08 4.00E+08 6.00E+08 8.00E+08 1.00E+09 1.00E-13 -40V
Typical Total Capacitance (CT)vs. Reverse (Vr) Voltage and Frequency
2.00E-13
10mA
1.50E-13
0V -5V
100mA
5.00E-14
Frequency (Hz)
Frequency (Hz)
CT vs. Vr @ 100MHz and 1GHz
2.0E-13 1.0E+06
Parallel Resistance (Rp) vs. Vr @ 100MHz
100MHz
1.5E-13 100MHz 1.0E+05
1.0E-13
1GHz 5.0E-14
1.0E+04
1GHz
0.0E+00 0 5 10 15 20 Vr (V) 25 30 35 40
1.0E+03 0 5 10 15 20 Vr (V) 25 30 35 40
Rs vs. If @ 100MHz and 1GHz
10
Series Inductance (Ls) vs. Frequency @ 10mA
1.0E-08
1GHz
1.0E-09
100MHz
1 0.001 0.010 If (A) 0.100
1.0E-10 5.00E+08 7.00E+08 9.00E+08 1.10E+09 1.30E+09 1.50E+09 1.70E+09 Frequency (Hz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS502
SURMOUNTTM PIN Diode
Rev. V2
MA4SPS502 ADS SPICE Model & Schematic
MA4SPS502 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=40 um Rr=20 K Ohm Cmin=0.12 pF Tau=2.8 usec Rs=0.1 Ohm Cj0=0.18 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=2.5E+7 A/m^2 Kf=0.0 Af=1.0 wBv=200 V wPmax=2.0 W Ffe=1.0
MA4SPS502 Lumped Element Model
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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