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 PD-96144A
IRF7750GPBF
HEXFET(R) Power MOSFET
l l l l l l l
Ultra Low On-Resistance Dual P-Channel MOSFET Very Small SOIC Package Low Profile ( < 1.1mm) Available in Tape & Reel Lead-Free Halogen-Free
VDSS = -20V RDS(on) = 0.030
Description
HEXFET(R) power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer
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with an extremely efficient and reliable device for battery and load management.
The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into extremely thin environments such as portable electronics and PCMCIA cards.
TSSOP-8
Absolute Maximum Ratings
Parameter
VDS ID @ TA = 25C ID @ TA = 70C IDM PD @TA = 25C PD @TA = 70C VGS TJ, TSTG Drain- Source Voltage Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range
Max.
-20 4.7 3.8 38 1.0 0.64 0.008 12 -55 to + 150
Units
V A W W/C V C
Thermal Resistance
Parameter
RJA Maximum Junction-to-Ambient
Max.
125
Units
C/W
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05/14/09
IRF7750GPBF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Min. -20 --- --- -0.45 11 --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Typ. Max. Units Conditions --- --- V VGS = 0V, ID = -250A 0.012 --- V/C Reference to 25C, ID = -1mA --- 0.030 VGS = -4.5V, ID = -4.7A --- 0.055 VGS = -2.5V, ID = -3.8A --- -1.2 V VDS = VGS, ID = -250A --- --- S VDS = -10V, ID = -4.7A --- -1.0 VDS = -20V, VGS = 0V A --- -25 VDS = -16V, VGS = 0V, TJ = 70C --- -100 VGS = -12V nA --- 100 VGS = 12V 26 39 ID = -4.7A 3.9 5.8 nC VDS = -16V 8.0 12 VGS = -5.0V 15 --- VDD = -10V 54 --- ID = -1.0A ns 180 --- RD = 10 210 --- RG = 24 1700 --- VGS = 0V 380 --- pF VDS = -15V 270 --- = 1.0MHz
Source-Drain Ratings and Characteristics
IS
ISM
VSD trr Qrr
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge
Min. Typ. Max. Units --- --- --- --- 26 16 -1.0 A -38 -1.2 39 24 V ns nC
Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = -1.0A, VGS = 0V TJ = 25C, IF = -1.0A di/dt = 100A/s
D
S
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
When mounted on 1 inch square copper board, t<10 sec
Pulse width 300s; duty cycle 2%.
2
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IRF7750GPBF
1000
VGS -7.50V -5.00V -4.00V -3.50V -3.00V -2.50V -2.00V BOTTOM -1.50V TOP
1000
-I D , Drain-to-Source Current (A)
100
-I D , Drain-to-Source Current (A)
100
VGS -7.50V -5.00V -4.00V -3.50V -3.00V -2.50V -2.00V BOTTOM -1.50V TOP
10
10
1
-1.50V
-1.50V
1
0.1 0.1
20s PULSE WIDTH TJ = 25 C
1 10 100
0.1 0.1
20s PULSE WIDTH TJ = 150 C
1 10 100
-VDS , Drain-to-Source Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
100
-I D , Drain-to-Source Current (A)
TJ = 25 C TJ = 150 C
10
-ISD , Reverse Drain Current (A)
10
TJ = 150 C
1
TJ = 25 C
1 1.5
V DS = -15V 20s PULSE WIDTH 2.0 2.5 3.0
-VGS , Gate-to-Source Voltage (V)
0.1 0.2
V GS = 0 V
0.4 0.6 0.8 1.0 1.2
-VSD ,Source-to-Drain Voltage (V)
Fig 3. Typical Transfer Characteristics
Fig 4. Typical Source-Drain Diode Forward Voltage
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IRF7750GPBF
2500
2000
-VGS , Gate-to-Source Voltage (V)
VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd
10
ID = -4.7A VDS =-16V
8
C, Capacitance (pF)
Ciss
1500
6
1000
4
500
Coss Crss
1 10 100
2
0
0
0
10
20
30
40
-VDS , Drain-to-Source Voltage (V)
QG , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
1.00
1000
OPERATION IN THIS AREA LIMITED BY RDS(on)
-V GS(th) , Variace ( V )
-ID , Drain Current (A) I
0.80
100 10us 10 100us 1ms 1 10ms
0.60
ID = -250A
0.40
0.20 -75 -50 -25 0 25 50 75 100 125 150
0.1 0.1
TA = 25 C TJ = 150 C Single Pulse
1 10 100
T J , Temperature ( C )
-VDS , Drain-to-Source Voltage (V)
Fig 7. Threshold Voltage Vs. Temperature
Fig 8. Maximum Safe Operating Area
4
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IRF7750GPBF
5.0
20
4.0
16
-ID , Drain Current (A)
2.0
Power (W)
25 50 75 100 125 150
3.0
12
8
1.0
4
0.0
0 0.01 0.10 1.00 10.00 100.00
TC , Case Temperature ( C)
Time (sec)
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 10. Typical Power Vs. Time
1000
Thermal Response (Z thJA )
100
D = 0.50 0.20
10
0.10 0.05 0.02 0.01 PDM t1 t2 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJA + TA 0.01 0.1 1 10 100
1
0.1 0.00001
0.0001
0.001
t1 , Rectangular Pulse Duration (sec)
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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IRF7750GPBF
RDS(on) , Drain-to-Source On Resistance (Normalized)
RDS (on) , Drain-to-Source On Resistance ()
2.0
ID = -4.7A
0.08
1.5
0.06
1.0
0.04
VGS = -2.5V
0.5
0.02 VGS = -4.5V 0.00 0 10 20 30 40 -I D , Drain Current (A)
0.0 -60 -40 -20
VGS = -4.5V
0 20 40 60 80 100 120 140 160
TJ , Junction Temperature ( C)
Fig 12. Normalized On-Resistance Vs. Temperature
Fig 13. Typical On-Resistance Vs. Drain Current
RDS(on) , Drain-to -Source On Resistance ()
0.08
0.06
0.04
ID = -4.7A
0.02
0.00 2.0 2.5 3.0 3.5
-V GS, Gate -to -Source Voltage (V)
Fig 14. Typical On-Resistance Vs. Gate Voltage
6
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IRF7750GPBF
TSSOP8 Package Outline
Dimensions are shown in milimeters (inches)
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Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRF7750GPBF
TSSOP8 Part Marking Information
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TSSOP-8 Tape and Reel Information
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Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 05/2009
8
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