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| MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM7179-6UL TECHNICAL DATA FEATURES HIGH POWER P1dB=38.5dBm at 7.1GHz to 7.9GHz HIGH GAIN G1dB=9.0dB at 7.1GHz to 7.9GHz BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point Drain Current Gain Flatness Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 Tch IDS1 G G1dB SYMBOL P1dB ( Ta= 25C ) UNIT dBm MIN. 37.5 8.0 -44 TYP. MAX. 38.5 9.0 1.6 39 -47 1.3 1.9 0.6 1.5 80 CONDITIONS VDS= 10V IDSset=1.3A dB A dB % f = 7.1 to 7.9GHz add IM3 Two-Tone Test Po= 27.5dBm (Single Carrier Level) (VDS X IDS+Pin-P1dB) X Rth(c-c) dBc A C Recommended gate resistance(Rg) : Rg= 150 (MAX.) ELECTRICAL CHARACTERISTICS CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL ( Ta= 25C ) UNIT S V A V C/W MIN. -1.0 -5 TYP. MAX. 1.24 -2.5 3.6 3.8 -4.0 4.6 gm VGSoff IDSS VGSO Rth(c-c) CONDITIONS VDS= 3V IDS= 2.0A VDS= 3V IDS= 20mA VDS= 3V VGS= 0V IGS= -70A Channel to Case The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. Rev. May 2009 TIM7179-6UL ABSOLUTE MAXIMUM RATINGS CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 C) Channel Temperature Storage ( Ta= 25C ) SYMBOL VDS VGS IDS PT Tch Tstg UNIT V V A W C C RATING 15 -5 5.0 32.6 175 -65 to +175 PACKAGE OUTLINE (2-11D1B) Unit in mm Gate Source Drain HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2 TIM7179-6UL RF PERFORMANCE Output Power vs. Frequency 42 41 Po (dBm) 40 39 38 37 36 VDS= 10V IDS 1.6A Pin= 29.5dBm 6.8 7 7.2 7.4 7.6 7.8 8 8.2 Frequency (GHz) Output Power vs. Input Power 40 39 38 37 Po (dBm) 36 add f= 7.5GHz VDS= 10V IDS 1.6A 90 Po 80 70 60 50 40 30 20 10 0 add (%) 35 34 33 32 31 23 25 27 29 Pin (dBm) 31 33 3 TIM7179-6UL Power Dissipation vs. Case Temperature 50 40 30 P T (W) 20 10 0 0 40 80 120 160 200 Tc ( ) IM3 vs. Output Power Characteristics -20 VDS= 10V IDS 1.6A f= 7.5GHz f= 5MHz -30 IM3 (dBc) -40 -50 -60 23 25 27 29 31 33 Po(dBm), Single Carrier Level 4 |
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