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DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
M3D302
BZA418A Quadruple ESD transient voltage suppressor
Product data sheet 2002 Sep 02
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
FEATURES * ESD rating >8 kV, according to IEC1000-4-2 * SOT457 surface mount package * Common anode configuration * Non-clamping range -0.5 to 18 V * Maximum reverse peak power dissipation: 19.6 W at tp = 1 ms * Maximum clamping voltage at peak pulse current: 27 V at IZSM = 0.7 A. APPLICATIONS * Computers and peripherals * Audio and video equipment * Communication systems * Medical equipment.
1 2 3
MAM357
BZA418A
PINNING PIN 1 2 3 4 5 6 cathode 1 common cathode 2 cathode 3 common cathode 4 DESCRIPTION
handbook, halfpage 6
5
4 1 3 4 6 2 5
DESCRIPTION Monolithic transient voltage suppressor diode in a six lead SOT457 (SC-74) package for 4-bit wide ESD transient suppression at 18 V level.
Top view
Marking code: L1.
Fig.1 Simplified outline (SOT457) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM IZSM Ptot PZSM Tstg Tj Notes 1. Ts is the temperature at the soldering point of the anode pin. 2. DC working current limited by Ptot max. working current continuous forward current non-repetitive peak forward current non-repetitive peak reverse current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature Ts = 60 C; note 1 Ts = 60 C tp = 1 ms; square pulse tp = 1 ms; square pulse; see Fig.2 Ts = 60 C; see Fig.3 square pulse; tp = 1 ms; see Fig.4 - - - - - - -65 -65 note 2 100 3.75 0.7 720 19.6 +150 +150 mA mA A A mW W C C PARAMETER CONDITIONS MIN. MAX. UNIT
2002 Sep 02
2
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point CONDITIONS one or more diodes loaded
BZA418A
VALUE 125
UNIT K/W
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL Per diode VZ VF VZSM IR rdif SZ Cd working voltage forward voltage reverse current differential resistance temperature coefficient of working voltage diode capacitance IZ = 1 mA IF = 200 mA VR = 14 V IZ = 1 mA IZ = 5 mA see Fig.5 VR = 0; f = 1 MHz - - - 48 14 pF pF VR = 13 V; f = 1 MHz - 17.1 - - - - - 18 - - - - 14.4 18.9 1.3 27 75 125 - V V V nA mV/K PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
non-repetitive peak reverse voltage IZSM = 0.7 A; tp = 1 ms
2002 Sep 02
3
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
BZA418A
handbook, halfpage
10
MDA197
handbook, halfpage
1000 Ptot
MDA198
IZSM (A)
(mW) 800
600 1 400
200
10-1 10-1
1
tp (ms)
10
0 0 50 100 150 Ts (oC) 200
All diodes loaded.
Fig.2
Maximum non-repetitive peak reverse current as a function of pulse time.
Fig.3 Power derating curve.
102 handbook, halfpage
MDA199
handbook, halfpage
50 Cd
MDA200
PZSM (W)
(pF) 40
30
10
20
10
1 10-1
1
tp (ms)
10
0 0 5 10 VR (V) 15
PZSM = VZSM x IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM.
Tj = 25 C; f = 1 MHz.
Fig.4
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
Fig.5
Diode capacitance as a function of reverse voltage; typical values.
2002 Sep 02
4
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
APPLICATION INFORMATION Typical common anode application
BZA418A
A quadruple transient suppressor in a SOT457 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs 6 and 7.
handbook, full pagewidth
keyboard, terminal, printer, etc.
I/O
A B C D FUNCTIONAL DECODER
BZA418A GND
MGU788
Fig.6 Computer interface protection.
handbook, full pagewidth
VDD address bus VGG
RAM
ROM
data bus I/O
CPU CLOCK
control bus
BZA418A GND
MGU789
Fig.7 Microprocessor protection.
2002 Sep 02
5
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA418A is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point.
BZA418A
2002 Sep 02
6
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
PACKAGE OUTLINE
BZA418A
Plastic surface mounted package; 6 leads
SOT457
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A A1 c
1
2
3
Lp
e
bp
wM B detail X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.1 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT457
REFERENCES IEC JEDEC EIAJ SC-74
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 01-05-04
2002 Sep 02
7
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage suppressor
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes 1. Please consult the most recently issued document before initiating or completing a design. PRODUCT STATUS(2) Development Qualification Production DEFINITION
BZA418A
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2002 Sep 02 8 above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613514/01/pp9 Date of release: 2002 Sep 02 Document order number: 9397 750 10098

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