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| RS2A - RS2M 2.0 AMPS. Surface Mount Fast Recovery Rectifiers SMB/DO-214AA .083(2.10) .077(1.95) .147(3.73) .137(3.48) Features For surface mounted application Glass passivated junction chip Built-in strain relief, ideal for automated placement Plastic material used carries Underwriters Laboratory Classification 94V-0 Fast switching for high efficiency High temperature soldering: 260 oC / 10 seconds at terminals .187(4.75) .167(4.25) .012(.31) .006(.15) .103(2.61) .078(1.99) .012(.31) .006(.15) .056(1.41) .035(0.90) .209(5.30) .201(5.10) .008(.20) .004(.10) Mechanical Data Cases: Molded plastic Terminals: Pure tin plated, Lead free. Polarity: Indicated by cathode band Packing: 12mm tape per EIA STD RS-481 Weight: 0.093 gram Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current o See Fig. 1 @T L=100 C Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 2.0A Maximum DC Reverse Current o @ T A =25 C at Rated DC Blocking o Voltage @ T A=125 C Maximum Reverse Recovery Time ( Note 1 ) Typical Junction Capacitance ( Note 2 ) Typical Thermal Resistance (Note 3) Operating Temperature Range Symbol V RRM V RMS V DC I(AV) IFSM VF IR Trr Cj R JA R JL TJ RS 2A 50 35 50 RS 2B 100 70 100 RS 2D 200 140 200 RS 2G 400 280 400 2.0 50 1.3 5 200 RS 2J 600 420 600 RS 2K 800 560 800 RS 2M 1000 700 1000 Units V V V A A V uA uA 150 50 55 18 250 500 nS pF o -55 to +150 Storage Temperature Range TSTG -55 to +150 1. Reverse Recovery Test Conditions: IF=0.5A, IR =1.0A, IRR =0.25A Notes: 2. Measured at 1 MHz and Applied V R =4.0 Volts 3. Thermal Resistance from Junction to Ambient and Junction to Lead Mounted on P.C.B. with 0.4" x 0.4" ( 10mm x 10 mm ) Copper Pad Areas. C /W o C o C Version: A06 RATINGS AND CHARACTERISTIC CURVES (RS2A THRU RS2M) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 2.25 100 FIG.2- TYPICAL REVERSE CHARACTERISTICS AVERAGE FORWARD CURRENT. (A) 2.0 RESISTIVE OR INDUCTIVE LOAD INSTANTANEOUS REVERSE CURRENT. ( A) Tj=125 0C 1.5 10 1.0 P.C.B. MOUNTED 0.4 X 0.4" ( 10 X 10mm ) COPPER PAD AREAS 0.5 50 60 70 80 90 100 110 120 o 130 140 150 1 160 LEAD TEMPERATURE. ( C) 50 FIG.3- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT TL=100 0C 8.3ms Single Half Sine Wave JEDEC Method Tj=25 0C PEAK FORWARD SURGE CURRENT. (A) 0.1 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE. (%) 40 30 20 10 FIG.5- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 20 10 0 1 FIG.4- TYPICAL JUNCTION CAPACITANCE 90 Tj=25 0C f=1.0MHz Vsig=50mVp-p INSTANTANEOUS FORWARD CURRENT. (A) 10 NUMBER OF CYCLES AT 60Hz 100 1 JUNCTION CAPACITANCE.(pF) 50 0.1 Tj=25 0C Pulse Width=300 s 1% Duty Cycle 10 1 5 10 REVERSE VOLTAGE. (V) 50 100 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 FORWARD VOLTAGE. (V) FIG.6- REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM 50 NONINDUCTIVE 10 NONINDUCTIVE +0.5A DUT (-) PULSE GENERATOR (NOTE 2) NON INDUCTIVE OSCILLOSCOPE (NOTE 1) (+) 0 -0.25A trr (+) 50Vdc (approx) (-) NOTES: 1. Rise Time=7ns max. Input Impedance= 1 megohm 22pf 2. Rise Time=10ns max. Sourse Impedance= 50 ohms -1.0A 1cm SET TIME BASE FOR 5/ 10ns/ cm Version: A06 |
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