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| PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET Rev. 02 -- 3 December 2009 Product data sheet 1. Product profile 1.1 General description SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 Features and benefits Low conduction losses due to low on-state resistance Suitable for high frequency applications due to fast switching characteristics 1.3 Applications Computer motherboards DC-to-DC convertors Switched-mode power supplies 1.4 Quick reference data Table 1. VDS ID Ptot Quick reference Conditions Tsp = 80 C; see Figure 1 and 3 Tsp = 80 C; see Figure 2 VGS = 10 V; ID = 3 A; VDS = 100 V; Tj = 25 C; see Figure 11 VGS = 10 V; ID = 2.5 A; Tj = 25 C; see Figure 9 and 10 Min Typ Max 200 2.9 3.5 Unit V A W drain-source voltage Tj 25 C; Tj 150 C drain current total power dissipation gate-drain charge Symbol Parameter Dynamic characteristics QGD 12 16.5 nC Static characteristics RDSon drain-source on-state resistance 130 165 m NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 2. Pinning information Table 2. Pin 1 2 3 4 5 6 7 8 S S S G D D D D Pinning information Symbol Description source source source gate drain drain drain drain 1 4 mbb076 Simplified outline 8 5 Graphic symbol D G S SOT96-1 (SO8) 3. Ordering information Table 3. Ordering information Package Name PSMN165-200K SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number 4. Limiting values Table 4. Symbol VDS VGS ID IDM Ptot Tstg Tj IS ISM Limiting values Parameter drain-source voltage gate-source voltage drain current peak drain current total power dissipation storage temperature junction temperature source current peak source current Tsp = 80 C Tsp = 25 C; tp 10 s; pulsed Tsp = 80 C; see Figure 1 and 3 Tsp = 25 C; tp 10 s; pulsed Tsp = 80 C; see Figure 2 Conditions Tj 25 C; Tj 150 C Min -20 -55 -55 Max 200 20 2.9 20 3.5 150 150 3.1 20 Unit V V A A W C C A A In accordance with the Absolute Maximum Rating System (IEC 60134). Source-drain diode PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 2 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 120 Ider (%) 80 03aa25 120 Pder (%) 80 03aa17 40 40 0 0 50 100 150 Tsp (C) 200 0 0 50 100 150 Tsp (C) 200 Fig 1. Normalized continuous drain current as a function of solder point temperature 102 ID (A) 10 RDSon = VDS/ID Fig 2. Normalized total power dissipation as a function of solder point temperature 03ae06 tp = 10 s 100 s 1 ms 1 P = tp T 10 ms D.C. 100 ms 10-1 tp t T 10-2 1 10 102 VDS (V) 103 Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 3 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 5. Thermal characteristics Table 5. Symbol Rth(j-sp) Thermal characteristics Parameter Conditions Min Typ Max 20 Unit K/W thermal resistance from mounted on a metal clad substrate; junction to solder point see Figure 4 102 Zth(j-sp) (K/W) 10 = 0.5 0.2 0.1 0.05 0.02 P 03ae05 1 = tp T 10-1 single pulse tp t T 10-2 10-4 10-3 10-2 10-1 1 10 tp (s) 102 Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 4 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 6. Characteristics Table 6. Symbol V(BR)DSS VGS(th) Characteristics Parameter drain-source breakdown voltage gate-source threshold voltage Conditions ID = 250 A; VGS = 0 V; Tj = 25 C ID = 1 mA; VDS= VGS; Tj = 150 C; see Figure 8 ID = 1 mA; VDS= VGS; Tj = -55 C; see Figure 8 ID = 1 mA; VDS= VGS; Tj = 25 C; see Figure 8 IDSS IGSS RDSon drain leakage current gate leakage current drain-source on-state resistance VDS = 160 V; VGS = 0 V; Tj = 25 C VDS = 200 V; VGS = 0 V; Tj = 150 C VGS = 20 V; VDS = 0 V; Tj = 25 C VGS = -20 V; VDS = 0 V; Tj = 25 C VGS = 10 V; ID = 2.5 A; Tj = 150 C; see Figure 9 and 10 VGS = 10 V; ID = 2.5 A; Tj = 25 C; see Figure 9 and 10 Dynamic characteristics QG(tot) QGS QGD Ciss Coss Crss td(on) tr td(off) tf gfs total gate charge gate-source charge gate-drain charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time transfer conductance VDS = 15 V; ID = 2.9 A; Tj = 25 C; see Figure 13 IS = 2.3 A; VGS = 0 V; Tj = 25 C; see Figure 14 IS = 2.9 A; dIS/dt = -100 A/s; VGS = 0 V; VDS = 25 V; Tj = 25 C VDS = 100 V; RL = 100 ; VGS = 10 V; RG(ext) = 6 ; Tj = 25 C VDS = 25 V; VGS = 0 V; f = 1 MHz; Tj = 25 C; see Figure 12 ID = 3 A; VDS = 100 V; VGS = 10 V; Tj = 25 C; see Figure 11 40 4.5 12 1330 140 70 12 11 50 25 10 16.5 25 25 80 40 nC nC nC pF pF pF ns ns ns ns S Min 200 1.2 2 Typ 240 325 130 Max 6 4 1 0.5 100 100 413 165 Unit V V V V A mA nA nA m m Static characteristics Source-drain diode VSD trr Qr source-drain voltage reverse recovery time recovered charge 0.7 105 0.45 1.1 V ns C PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 5 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 20 ID (A) 15 VGS = 10 V 5V 03ae07 20 ID (A) 15 VDS > I D X R DSon 03ae09 4.5 V 10 10 5 4V 5 Tj = 150 C 25 C 0 3.5 V 0 1 2 3 4 VDS (V) 5 0 0 1 2 3 4 VGS(V) 5 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 03aa35 Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values 5 03aa32 10-1 ID (A) 10-2 min typ max VGS(th) (V) 4 max 10-3 3 typ 10-4 2 min 10-5 1 10-6 0 2 4 VGS (V) 6 0 -60 0 60 120 Tj (C) 180 Fig 7. Sub-threshold drain current as a function of gate-source voltage Fig 8. Gate-source threshold voltage as a function of junction temperature PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 6 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 0.3 R DSon () 0.25 VGS = 4 V 4.5 V 03ae08 3 a 03aa31 Tj = 25 C 2 0.2 5V 10 V 1 0.15 0.1 0 5 10 15 ID (A) 20 0 -60 0 60 120 Tj (C) 180 Fig 9. Drain-source on-state resistance as a function of drain current; typical values 10 03ae13 Fig 10. Normalized drain-source on-state resistance factor as a function of junction temperature 104 Ciss , Coss , Crss (pF) Ciss 103 03ae12 VGS (V) 8 ID = 3 A Tj = 25 C VDD = 40 V 100 V 160 V 6 4 102 2 Coss Crss 0 0 15 30 QG (nC) 45 10 10-1 1 10 VDS (V) 102 Fig 11. Gate-source voltage as a function of gate charge; typical values Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 7 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 30 gfs (S) 25 03ae10 20 IS (A) 15 03ae11 VDS > I D X R DSon Tj = 25 C VGS = 0 V 20 150 C 15 10 10 5 5 Tj = 150 C 25 C 0 0 5 10 15 ID (A) 20 0 0 0.2 0.4 0.6 0.8 VSD (V) 1 Fig 13. Forward transconductance as a function of drain current; typical values Fig 14. Source current as a function of source-drain voltage; typical values PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 8 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 7. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 pin 1 index Lp 1 4 A1 (A 3) A L wM detail X e bp 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 o 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 15. Package outline SOT96-1 (SO8) PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 9 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 8. Revision history Table 7. Revision history Release date 20091203 Data sheet status Product data sheet Change notice Supersedes PSMN165-200K-01 Document ID PSMN165-200K_2 Modifications: * * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product specification - PSMN165-200K-01 20010116 PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 10 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 9.2 Definitions Draft-- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet-- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Applications-- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data-- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values-- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale-- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license-- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control-- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.3 Disclaimers General-- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes-- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use-- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS-- is a trademark of NXP B.V. 10. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com PSMN165-200K_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 3 December 2009 11 of 12 NXP Semiconductors PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 December 2009 Document identifier: PSMN165-200K_2 |
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