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| YED210 Series Specifications SPGA - Interstitial (TH) Part Number (Details) Insulation Resistance: 1012 min. Withstanding Voltage: 1,000 VRMS for 1 minute Contact Resistance: 10m max. at 10mA / 20mV Current Rating: 1A max. Operating Temperature Range: -55C ~ +125C Acceptable Pin Diameter: 0.46 0.05 Mating Cycles: 100 insertions min. YED210 Series No. - 321 37 - 0 B S 4 No. of Contact Pins Grid Materials and Finish RoHS Design No. Inner Contact Plating B = Gold Outer Sleeve Plating S = Solder Terminal Style Housing: PCT, 30% glass filled Polyester, UL94V-0 Contact: Inner clip - Beryllium Copper (BeCu), Au over Ni (2-3m) Outer sleeve - Machined Brass, Sn (5m) over Ni (2-3m) Features Custom specific pin counts with grids to 41x41 Pin-Grid-Array precision-IC-Sockets, with displaced contacts, for picking up of ICs with high packing density. Contacts with 6-finger-clip, for low insertion and withdrawal force . Outline Socket Dimensions (Grid 37 x 37) Contact Position Detail Without Stand-off pins (Standard) With Stand-off pins Stand-off pin A-40 Sockets and Connectors SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER |
Price & Availability of YED210-32137-0BS4
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