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CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 1/9
BTC2383A3
Features
* High breakdown voltage, BVCEO 200V * Large continuous collector current capability * Low collector saturation voltage * Complementary to BTA1013A3 * Pb-free package
Symbol
BTC2383A3
Outline
TO-92
BBase CCollector EEmitter
ECB
Absolute Maximum Ratings (Ta=25C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Base Current Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC IB Pd Tj Tstg Limits 280 200 6 1 0.5 900 150 -55~+150 Unit V V V A A mW C C
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *VBE(on) *hFE 1 *hFE 2 *hFE 3 fT Cob Min. 280 200 6 0.45 100 100 50 20 Typ. 0.2 100 Max. 100 100 0.5 1 0.9 0.75 320 20 Unit V V V nA nA V V V V MHz pF
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 2/9
Test Conditions IC=10A IC=10mA IE=10A VCB=250V VEB=6V IC=500mA, IB=50mA IC=1A, IB=50mA IC=500mA, IB=50mA VCE=5V, IC=5mA VCE=5V, IC=50mA VCE=5V, IC=200mA VCE=5V, IC=1A VCE=5V, IC=200mA VCB=10V, IE=0A,f=1MHz
*Pulse Test: Pulse Width 380s, Duty Cycle2%
Classification Of hFE 2
Rank Range O 100~200 Y 160~320
Ordering Information
Device BTC2383A3 Package TO-92 (Pb-free) Shipping 2000 pcs / Tape & Box Marking C2383
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
1000 Saturation Voltage---(mV)
VCE=5V
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 3/9
Saturation Voltage vs Collector Current
1000
VCESAT IC=50IB
Current Gain---HFE
100
100
10
VCE=2V
VCE=1V
IC=10IB
IC=20IB
IC=30IB
1 1 10 100 1000 10000 Collector Current---IC(mA)
10 1 10 100 1000 10000 Collector Current---IC(mA)
Saturation Voltage vs Collector Current
10000
Power Dissipation---PD(W)
Power Derating Curve
1.8 1.5 1.2 0.9 0.6 0.3 0
Saturation Voltage---(V)
VBESAT@IC=10IB
1000
100 1 10 100 1000 Collector Current---IC(mA) 10000
0
25
50
75
100
125
150
175
200
Ambient Temperature---TA()
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Output Characteristics
0.7
IB=10mA
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 4/9
Output Characteristics
0.7
IB=10mA
IB=8m A IB=5mA IB=3mA IB=2mA
0.6 Collector Current---IC(A) 0.5 0.4 0.3 0.2 0.1
0.6 Collector Current---IC(A) 0.5 0.4 0.3 0.2 0.1
IB=6mA IB=4mA IB=3mA IB=2.5mA IB=2mA IB=1.5m IB=1mA IB=500uA IB=0
IB=1mA
IB=0
0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6
0 0
1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V)
6
Output Capacitance vs Reverse Biased Voltage
100 Output Capacitance---Cob(pF)
10
Safe Operating Area
PT=1ms
Forward Current---IC(A)
1
PT=1s
PT=10ms
0.1
PT=100ms
0.01
10 1 10 Reverse Biased Voltage---VCB(V) 100
0.001 1 10 100 Forward Voltage---VCE(V) 1000
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Product Designation
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 5/9
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Recommended IR reflow profile
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 6/9
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for wave soldering
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 7/9
Recommendation: 1. Preheat temperature at solder side must be between 100 and 130 for 80 to 100 seconds. 2. Temperature ramp-up rate : 1~2 /s 3. The temperature gradient between preheat and wave soldering must be smaller than +160. 4. Terminations must go through the wave simultaneously. 5. Travel through the wave from 255 to 260 for 2.5 to 3.5 seconds 6. Temperature ramp-down rate : 2~3 /s
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Taping Outline
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 8/9
DIM A D D1 D2 E F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 -
Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch
Millimeters Min. 4.33 3.80 0.36 4.33 1.5 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.0 2.90 0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255
BTC2383A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
2
Product Name
1 2 3
Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.03.17 Page No. : 9/9
A B
Marking: HFE Rank
C2383
3
C
D
Date Code: Year+Month Year: 42004, 52005 Month: 11, 22, 99, A10, B11, C12
H I E F
G
1
Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC2383A3
CYStek Product Specification

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