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| Connector for SIM Card 8pins SCGC Series Small size surface mounting contributes to improved flexibility in set design. For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM NEW Features Thin type 1.55mm push-push type. Equipped with card detection switch. Applications PCs and personal digital assistants For Memory Stick MicroTM For Memory StickTM Combine Type Typical Specifications Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial Contact resistance Initial Connector contacts Detection switch Standard mount Push-push type 25 70 Specifications SIM Card 8pins Surface mounting type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module 500V AC 1minute 1,000M 100m 500m min. max. max. Performance Insertion and removal cycle 5,000cycles Product Line Media ejection structure Push-push type Mounting style Stand-off mm 0 Packing system Product No. Standard mount Taping SCGC1B0101 27 Connector for SIM Card 8pins SCGC Series Dimensions Style Unit:mm PC board mounting hole dimensions Viewed from the mounting face side For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module C7 C8 C3 C4 C8 C7 C3 C4 C6 C5 C2 C1 C5 C6 C2 C1 2-2 2.4 26.77 Card detect switch Common 2-0.7 0.18 3.65 8.5 0.17 3.59 4-4 10.35 9.045 3.65 1.3 10.35 9.045 8.5 1.3 11.47 11.47 3.59 4.6 0.86 21.22 25.77 25.77 21.22 3.455 6.045 26.77 Card lock(1.3) Over travel(0.3) 3-0.8 Pitch 8-0.3 P= 0.8 0.6 13.77 9.2 :No pattern area :Land area :No parts area 9.2 2.4 Eject stroke(3.5) (1.23) 18.44 19.94 Card center Connector center 28 1.55 2.6 4.6 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type 240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.) Room temperature Heating time For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module sec. Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50 |
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