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| HFP2N65 July 2007 BVDSS = 650 V HFP2N65 650V N-Channel MOSFET FEATURES Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 9.0 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) : 4.5 (Typ.) @VGS=10V 100% Avalanche Tested RDS(on) typ = 4.5 ID = 1.8 A TO-220 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Drain Current Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt TC=25 unless otherwise specified Parameter Value 650 Units V A A A V mJ A mJ V/ns W W/ - Continuous (TC = 25) - Continuous (TC = 100) - Pulsed (Note 1) 1.8 1.1 7.2 30 (Note 2) (Note 1) (Note 1) (Note 3) 120 1.8 5.4 5.5 54 0.43 -55 to +150 300 Power Dissipation (TC = 25) - Derate above 25 Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Resistance Characteristics Symbol RJC RCS RJA Junction-to-Case Case-to-Sink Junction-to-Ambient Parameter Typ. -0.5 -Max. 2.32 -62.5 /W Units SEMIHOW REV.A0,July 2007 HFP2N65 Electrical Characteristics TC=25 C Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units On Characteristics VGS RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance VDS = VGS, ID = 250 VGS = 10 V, ID = 0.9 A 2.5 --4.5 4.5 6.0 V Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ID = 250 , Referenced to25 VDS = 650 V, VGS = 0 V VDS = 520 V, TC = 125 VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V 650 ------0.65 ------1 10 100 -100 V V/ BVDSS Breakdown Voltage Temperature Coefficient /TJ IDSS IGSSF IGSSR Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz ---330 40 8 430 50 10.5 Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge (Note 4,5) VDS = 325 V, ID = 1.8 A, RG = 25 -------- 15 40 40 30 9.0 1.9 3.8 30 80 80 60 11.5 --- nC nC nC VDS = 520V, ID = 1.8 A, VGS = 10 V (Note 4,5) Source-Drain Diode Maximum Ratings and Characteristics IS ISM VSD trr Qrr Continuous Source-Drain Diode Forward Current Pulsed Source-Drain Diode Forward Current Source-Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS = 1.8 A, VGS = 0 V IS = 1.8 A, VGS = 0 V diF/dt = 100 A/s (Note 4) --------220 1.1 1.8 7.2 1.4 --A V C Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=68mH, IAS=1.8A, VDD=50V, RG=25, Starting TJ =25C 3. ISD1.8A, di/dt300A/s, VDDBVDSS , Starting TJ =25 C 4. Pulse Test : Pulse Width 300s, Duty Cycle 2% 5. Essentially Independent of Operating Temperature SEMIHOW REV.A0,July 2007 HFP2N65 Typical Characteristics ID , Drain Current [A] 100 VGS 15 V 10 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top : 10-1 * Note : 1. 250 s Pulse Test 2. TC = 25oC 10-2 -1 10 100 101 VDS , Drain-Source Voltage [V] Figure 1. On Region Characteristics Figure 2. Transfer Characteristics 18 RDS(on) , [] Drain-Source On-Resistance 15 12 9 6 3 VGS = 10V VGS = 20V * Note : TJ = 25oC 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 ID , Drain Current [A] Figure 3. On Resistance Variation vs Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature 12 450 400 350 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd VGS, Gate-Source Voltage [V] 10 VDS = 130V VDS = 325V VDS = 520V Capacitances [pF] 300 250 200 150 100 50 0 -1 10 Ciss Coss 8 6 Crss Note ; 1. VGS = 0 V 2. f = 1 MHz 4 2 * Note : ID = 1.8 A 0 10 0 10 1 0 1 2 3 4 5 6 7 8 9 10 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics SEMIHOW REV.A0,July 2007 HFP2N65 Typical Characteristics 1.2 (continued) 3.0 BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.1 RDS(ON), (Normalized) Drain-Source On-Resistance 2.5 2.0 1.0 1.5 1.0 * Note : 1. VGS = 10 V 2. ID = 0.9 A 0.9 * Note : 1. VGS = 0 V 2. ID = 250 A 0.5 0.8 -100 -50 0 50 100 o 150 200 0.0 -100 -50 0 50 100 150 200 TJ, Junction Temperature [ C] TJ, Junction Temperature [oC] Figure 7. Breakdown Voltage Variation vs Temperature Figure 8. On-Resistance Variation vs Temperature 2.0 Operation in This Area is Limited by R DS(on) 101 ID, Drain Current [A] 100 1 ms 10 ms 100 ms DC ID, Drain Current [A] 100 s 1.5 1.0 10-1 * Notes : 1. TC = 25 oC 2. TJ = 150 oC 3. Single Pulse 0.5 10-2 100 101 102 103 0.0 25 50 75 100 125 150 VDS, Drain-Source Voltage [V] TC, Case Temperature [oC] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature ZJC(t), Thermal Response 100 D=0.5 0.2 0.1 0.05 * Notes : 1. ZJC(t) = 2.32 oC/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZJC(t) 10-1 0.02 0.01 single pulse PDM t1 t2 100 101 10-2 10-5 10-4 10-3 10-2 10-1 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve SEMIHOW REV.A0,July 2007 HFP2N65 Fig 12. Gate Charge Test Circuit & Waveform 50K 12V 200nF 300nF Same Type as DUT VDS VGS Qg 10V VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms VDS RG RL VDD ( 0.5 rated VDS ) VDS 90% 10V DUT Vin 10% td(on) t on tr td(off) t off tf Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms L VDS VDD ID RG DUT VDD BVDSS IAS BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD ID (t) VDS (t) tp 10V Time SEMIHOW REV.A0,July 2007 HFP2N65 Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG Same Type as DUT VDD VGS * dv/dt controlled by RG * IS controlled by pulse period VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop SEMIHOW REV.A0,July 2007 HFP2N65 Package Dimension TO-220 [Unit : mm] 9.900.20 3 0 .6 0. 20 4.500.20 1.300.20 15.700.20 2.800.20 9.190.20 6.500.20 13.080.20 0.800.20 2.54typ 2.54typ 0.500.20 3.020.20 1.270.20 1.520.20 2.400.20 SEMIHOW REV.A0,July 2007 |
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