P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter
FEATURES * Convert surface mount QFP packages to a 15x15 PGA footprint * Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs * Pins are mechanically fastened and soldered to board using Aries' patented process, creating a reliable electrical connection and rugged contact * Consult factory for panelized form or for mounting of consigned chips GENERAL SPECIFICATIONS * ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces * PADS: bare Cu protected with ENIG or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling * PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 * PIN PLATING: 200 [5.08] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per ASTM B 545 over 100 [2.54] Ni per SAE AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS * SUGGESTED PCB HOLE SIZE: 0.062 0.003 [1.58 0.08] dia. * Will plug into standard PGA sockets
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ORDERING INFORMATION
P/N 97-68340 P/N 97-68340-P for Panelized Form P/N 145-PGM15024-30 for Wire Wrap PGA Socket
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW 0.003 [0.08] PIN-TO-PIN 0.003 [0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18025 Rev. AA
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