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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS LSBK2040 DATA SHEET DOC. NO : REV. DATE : : QW0905- LSBK2040 A 03 - Mar - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK2040 Page 1/4 Package Dimensions 3.0 4.0 4.2 5.2 1.5MAX 0.5 TYP 25.0MIN 1.0MIN 2.54TYP + Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0 -30 30 -60 60 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK2040 Page 2/4 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol SBK Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 500 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL COLOR Emitted Lens Blue Diffused Forward Peak Dominant Spectral voltage wave wave halfwidth @ 20mA(V) length length f nm f Pnm f Dnm Luminous intensity @20mA(mcd) Viewing angle 2c 1/2 (deg) Typ. Max. Min. 468 470 26 3.5 4.2 160 Typ. 450 44 LSBK2040 InGaN/SiC Blue Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LLSBK2040 Page 3/4 Typical Electro-Optical Characteristics Curve SBK CHIP Fig.1 Forward current vs. Forward Voltage 30 25 20 15 10 5 0 1 2 3 4 5 Fig.2 Relative Intensity vs. Forward Current 1.5 Forward Current(mA) Relative Intensity Normalize @20mA 1.25 1.0 0.75 0.5 0.25 0 0 5 10 15 20 25 30 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Current vs. Temperature 40 30 20 10 0 0 25 50 75 100 Fig.4 Relative Intensity vs. Wavelength Forward Current@20mA Relative Intensity@20mA 1.0 0.5 0 380 430 480 530 580 630 680 Ambient Temperature(J ) Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK2040 Page 4/4 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65JO 5J 2.RH=90 %~95 % 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec |
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