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| IC553 Series Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Dual Inline Memory Module (DIMM, 160 pins) Part Number (Details) 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. -55C to +170C 10,000 insertions min. 160 contact pins IC-553 - 1 - MF Series No. Design No. MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features i Card thickness 1.57mm Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 141.00 0.1 102.87 0.2 1.27x37=46.99 0.2 AE3.20 Thru hole 3.81 Ref 2.54 1.27x41=52.07 0.2 1.27x37=46.99 0.1 1.270.05 102.87 0.1 1.27x41=52.07 0.1 (3.81) 160-AE0.80 + 0.1 0 17.00 13.00 8.580.05 1.27 0.1 108.00 + 0.2 0 1.27 0.1 132.00 0.4 141.00 0.2 150.00 0.4 5.380.05 1.27 0.05 AE3.20 + 0.1 0 Matching Module Dimensions 110.50 1.50 +0 0.1 + 0.2 0 1.88 0.05 R 0.75 19.00 11.00 4.00 3.70 0.5 w0.40 x t0.30 28.70 + 0.26 - 0.25 46.99 102.87 104.65 Ref 110.24 + 0.26 - 0.25 52.07 1.57 0.15 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Test & Burn-In B-3 |
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