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| High Power 3P3T Switch with Logic Control CXG1214UR Description The CXG1214UR is a 3P3T(Triple Pole Triple Throw) switch and suitable for wireless communication systems, for example, W-CDMA handsets. This IC has on-chip logic for operation with 3 CMOS control inputs. Low insertion loss and on-chip logic circuit are realized by the Sony JPHEMT process. (Applications: Antenna switch for cellular handsets, triple band W-CDMA) Features Low insertion loss: 0.25dB@900MHz 3 CMOS compatible control line Package Small package size: 20-pin UQFN Structure GaAs JPHEMT MMIC Absolute Maximum Ratings (Ta = 25C) Bias voltage Control voltage Operating temperature Storage temperature VDD Vctl Topr Tstg 7 5 -35 to +85 -65 to +150 V V C C This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E06133 CXG1214UR Block Diagram and Recommended Circuit GND3 GND4 20 F12 ANT2 CRF GND 2 GND2 (Band 3) 3 GND1(Band1) 4 ANT1 5 CRF 6 F10 F11 1 19 F13 EXT 18 GND 17 16 F8 GND RF3 (Band1) 14 F9 13 GND RF1 (Band6) 12 F7 11 CRF GND CRF RF2 (Band3) 15 CRF F4 F3 F6 F5 F2 F1 7 8 9 GND CTLC CTLB CTLA When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering. Truth Table State CTLA CTLB CTLC 1 2 3 4 5 6 H L L H L L L H L L H L H H H L L L ON path F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 RF1 - ANT1 ON OFF OFF OFF OFF OFF OFF ON ON OFF OFF ON ON RF2 - ANT2 OFF OFF ON OFF OFF OFF ON OFF ON OFF ON OFF ON RF3 - ANT2 OFF OFF OFF OFF ON OFF ON ON OFF ON OFF OFF ON RF1 - EXT OFF ON OFF OFF OFF OFF OFF ON ON OFF ON ON OFF RF2 - EXT OFF OFF OFF ON OFF OFF ON OFF ON OFF ON ON OFF RF3 - EXT OFF OFF OFF OFF OFF ON ON ON OFF ON ON ON OFF DC Bias Conditions (Ta = 25C) Item Vctl (H) Vctl (L) VDD Min. 2.2 0 2.6 Typ. 2.85 -- 2.85 Max. 3.2 0.4 3.2 Unit V V V -2- Cbypass (100pF) VDD CRF 10 CXG1214UR Electrical Characteristics (Ta = 25C) Item Symbol State 1 2 3 Insertion loss IL 4 5 6 RF1 - EXT RF2 - EXT RF3 - EXT Path RF1 - ANT1 RF2 - ANT2 RF3 - ANT2 Condition 830 to 885MHz 1749.9 to 1880MHz 1920 to 1980MHz 2110 to 2170MHz 830 to 885MHz 1749.9 to 1880MHz 1920 to 1980MHz 2110 to 2170MHz 4 5 6 RF1 - ANT1 RF2 - ANT2 RF3 - ANT2 830 to 885MHz 1749.9 to 1880MHz 1920 to 2170MHz 830 to 885MHz 1 Isolation ISO 2 RF2 - EXT RF1 - EXT 1749.9 to 1880MHz 1920 to 2170MHz 830 to 885MHz 1749.9 to 1880MHz 1920 to 2170MHz 830 to 885MHz 3 VSWR Switching speed 1dB compression input power ACLR Harmonics Bias current Control current *1 Min. Typ. 0.35 0.45 0.47 0.50 0.40 0.53 0.55 0.60 Max. 0.50 0.65 0.67 0.75 0.55 0.73 0.75 0.85 Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB 25 20 20 25 20 20 20 17 15 20 20 19 35 30 30 35 30 30 27 23 21 30 27 25 1.2 5 10 RF3 - EXT 1749.9 to 1880MHz 1920 to 2170MHz 50 VSWR TSW P1dB ACLR1 ACLR2 2fo 3fo Idd Ictl VDD = 2.85V 5MHz, 3.84MHz BW*1 10MHz, 3.84MHz BW*1 *1 *1 32 -50 -55 -45 -45 200 30 330 50 dBm dBc dBc dBm dBm A A VDD = 2.85V Vctl(H) = 2.85V Pin = 25dBm, 0/2.85V control, VDD = 2.85V, 830 to 840MHz, 1749.9 to 1785MHz, 1920 to 1980MHz, Mesurement system noise level : ACLR(5MHz) <-60dBc, (10MHz) <-65dBc, 2nd Harmonics <-75dBm, 3rd Harmonics <-75dBm -3- CXG1214UR Package Outline (Unit: mm) 20PIN UQFN (PLASTIC) x4 0.1 0.55 0.05 2.7 15 16 11 10 2.7 A 0.4 0.1 1.3 S A-B C 4-R0.3 C B 20 1 PIN 1 INDEX 5 6 0.4 0.18 0.07 0.25 0.05 M S A-B C 0.14 0. 26 0.05 S S Solder Plating + 0.09 0.14 - 0.03 + 0.09 0.25 - 0.03 MAX0.02 5-18m S TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. SONY CODE EIAJ CODE JEDEC CODE UQFN-20P-01 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% -4- Sony Corporation |
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