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  Datasheet File OCR Text:
 ORANGE
1. 2. 2.1 2.2
Item No.: 190282
This specification applies to AlInGaP / GaAs LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy or Al Au alloy
3.
Outlines (dimensions in microns) p-Electrode Epitaxy AlInGaP
235
110
250
n-Substrate GaAs
235
n-Electrode
Wire-bond contacts can also be square 4. Electrical and optical characteristics (T=25C)
Parameter
Forward voltage Reverse current
Symbol
VF IR
Conditions
IF = 20 mA VR = 5 V
min
typ
2,10
max
2,40 10
Unit
V A mcd nm
Luminous intensity * IV IF = 10 mA 55,0 dom. wavelength IF = 20 mA 625 D * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. Packing Dice on adhesive film with 1) wire-bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity
(c) 2004
OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 contact@osa-opto.com


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