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SNAP01
Class AB Power Amplifier
============== CONTENTS ============== 1. 2. 3. 4. 5. GENERAL DESCRIPTION ....................................................................................... 3 FEATURES ................................................................................................................. 3 BLOCK DIAGRAM ................................................................................................... 3 PIN ASSIGNMENT .................................................................................................... 4 ELECTRICAL CHARACTERISTICS ...................................................................... 4 5.1. 5.2. 6. ABSOLUTE MAXIMUM RATINGS.............................................................................. 4 DC CHARACTERISTICS (TA=25).......................................................................... 5
APPLICATION CIRCUIT ......................................................................................... 6 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. CURRENT DAC APPLICATION WITH SINGLE-END MODE .......................................... 6 PWM WITH DIFFERENTIAL MODE ........................................................................... 7 PUSH-PULL DAC WITH SINGLE-END MODE ............................................................ 8 PUSH-PULL DAC WITH DIFFERENTIAL MODE.......................................................... 9 SINGLE-END WITH MIXED............................................................................... 10 DIFFERENTIAL MODE WITH MIXED ....................................................................... 11
7.
PACKAGE/PAD LOCATIONS ............................................................................... 12 7.1. 7.2. 7.3. SNAP01H (DICE) ................................................................................................ 12 SNAP01PG (DIP GREEN PACKAGE)..................................................................... 13 SNAP01SG (SOP GREEN PACKAGE).................................................................... 14
Ver1.3
1
November 22, 2007
SNAP01
Class AB Power Amplifier
AMENDENT HISTORY VERSION V1.0 V1.1 V1.2 V1.3 DATE September 27, 2007 October 9, 2007 November 2, 2007 November 22, 2007 DESCRIPITION First issue Advise Application Circuit Revise Package information. 1. Revise Operation current. 2. Revise package information.
Ver1.3
2
November 22, 2007
SNAP01
Class AB Power Amplifier
1. General Description
The SNAP01 is an integrated class AB mono speaker driver. The SNAP01 consist of single power supply, no switch-on/off click, high SNR ratio, power control, single-end/differential input mode and support Gain adjusted by external resistor.
2. Features
w w w w w w w w w w w Operation voltage2.4V-5.5V. High signal-to-noise ratio. Low distortion. High slew rate. No switch On/Off click. Power off control. Gain adjustment. Large output voltage swing. Direct driver speaker. Support single-end and differential mode. Low standby current1.0A.
3. Block Diagram
75K
VIN VM
5K 5K
+ OPA 75K 8K 8K Vbias + OPB
O-
VREF
O+
CE
Enable VDD Clickless/Depop CKT Power CKT GND
Ver1.3
3
November 22, 2007
SNAP01
Class AB Power Amplifier
4. Pin Assignment
Pin No. 1 2 3 4 5 6 7 8
Symbol VM VIN GND VREF CE O+ VDD O-
I/O I I I O I O I O
Function Description Signal Input Positive Signal Input Negative Negative Power Supply Voltage Reference Chip Enable, High Active Positive Output Positive Power Supply Negative Output
5. Electrical Characteristics 5.1. Absolute Maximum Ratings
Characteristic Supply Voltage Operating Temperature Storage Temperature Symbol VDD TOG TSTG Min -0.3 0 -55 Max 6.0 55 125 Unit V
Ver1.3
4
November 22, 2007
SNAP01
Class AB Power Amplifier
5.2. DC Characteristics (Ta=25)
Parameter Supply Power Standby Current Symbol VDD ISTB Min 2.4 Operating Current IOP Chip Enable Reference Voltage Output Current Signal to Noise Ratio The Harmonic Distortion + Noise CE VREF Io SNR THD+N 0.5 Output Power POUT 0.7 Enable Time TON 0.75 16 32 15 Gain 30 W ms ms 0.58 1 % W VDD/3 VDD/2 180 360 57 72 1 16 mA V V mA mA dB dB % Typical Max 5.5 1 12 Unit V A mA Condition CE=Low VDD=3.0V, CE=High, No load & VIN and VM is floating. VDD=4.5V CE=High, No load & VIN and VM is floating. VCE>2/3VDD = High VCE<1/3VDD = Low CE=High, CE=Low, VREF =VDD VDD=3.0V, RL=8 VDD=4.5V, RL=8 Single-End Mode Differential Mode VDD=3.0V, RL=8 P=0.25W VDD=4.5V, RL=8 P=0.58W VDD=4.5V, RL=8, THD+N=1% VDD=4.5V, RL=8, THD+N=10% VDD=4.5V VDD=3.0V Single-end mode Gain=75K/(5K+R1) Differential-mode Gain=75K/(5K+R1)
Note1TON is the time from CE high (chip enable) to O+ or O- output.
Ver1.3
5
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC
Current DAC with SINGLE-END MODE
U1
S1
6.1. Current DAC application with Single-End Mode
+
VCC
0.47uF R3 1K R
SNC5x3
C3
SNAP01
SPEAKER
+
VCC
1uF
6. Application Circuit
C4 0.1uF
Ver1.3
6
P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3
R1 330K
VDD
VCC C1 0.1uF
OSC RST BUO1 BUO2
C2 R2
U2
GND
1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 VREF CE
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC
U1
S1
PWM with Differnetial Mode
VDD
R2 330K C5 0.1uF VCC
CE BUO1 BUO2 GND
P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 OSC RST VM VIN R R1 R R1 SNC5x3
U2
GND
1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 CE VREF CE
SNAP01
VCC
SPEAKER
6.2. PWM with Differential Mode
C3 + 1uF
VCC
C6 0.1uF
Ver1.3
7
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC
U1
S1
PUSH-PULL DAC with SINGLE-END MODE
13
VCC R1 330K C1 0.1uF
CE 14 BUO1 12 BUO2
6.3. Push-Pull DAC with Single-End Mode
1 2 3 4 5 6 7 8 9 10 16 17 + P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 20 OSC 18 RST
C2 R2
VDD
U2
19 TEST 11 GND 15 GND SNC12030
GND
0.47uF R
1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 VREF CE
SNAP01
CE
SPEAKER
VCC C3
+
1uF
C4 0.1uF
Ver1.3
8
VCC
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC U1 S1
PUSH-PULL DAC with DIFFERENTIAL MODE
13
VCC R1 330K C1 0.1uF R C2 0.47uF R2
CE
6.4. Push-Pull DAC with Differential Mode
1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 20 OSC 18 RST 14 BUO1 12 BUO2 VM VIN
C3
VDD
U2
GND +
0.47uF R3 R1
1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 CE VREF CE +
VCC
19 TEST 11 GND 15 GND
SNAP01
SPEAKER
C4
VCC
+
SNC12030 1uF
C5 0.1uF
Ver1.3
9
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC U1 S1
SINGLE-END MODE with Push Pull DAC
13
VCC R1 330K C1 0.1uF
CE BUO1 BUO2
C2
1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 OSC RST 14 12
0.47uF R2
VDD
20 18
U2 R
VCC
TEST GND GND
SNC12030
19 11 15 +
1 2 3 4 +
C4 1uF
VM OVIN VDD GND O+ VREF CE
8 7 6 5
VCC
SNAP01
SPEAKER
C3 0.1uF
VCC U3 S2
6.5. SINGLE-END with MIXED
CE
1 2 3 4 5 6 7 8 9 10 16 17
P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3
VDD
13
R3 330K
VCC C5 0.1uF
OSC RST BUO1 BUO2
20 18
C6 0.47uF R4 R
14 12
TEST GND GND
SNC12030
19 11 15
+
Ver1.3
10
November 22, 2007
SNAP01
Class AB Power Amplifier
VCC U1 S1
DIFFERENTIAL MODE with MIXED
13
VCC R1 330K C1 0.1uF
CE B UO1 B UO2
C2
1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 OSC RST 14 12
0.47uF R2
VD D
20 18
R
U2
VCC
TEST GN D GN D
SNC12030
19 11 15
C3
1 2 3 4 + +
0.47uF R3 R C5
VM OVIN VDD GND O+ VREF CE
8 7 6 5
VCC
SNAP01
SPEAKER
C4 0.1uF
+
1uF
VCC
6.6. Differential Mode with Mixed
U3 S2
CE
1 2 3 4 5 6 7 8 9 10 16 17
P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3
VD D
13
R4 330K
VCC C6 0.1uF
OSC RST B UO1 B UO2
20 18
C7 0.47uF R5 R
14 12
C8
+
+
0.47uF
R6
R
TEST GN D GN D
SNC12030
19 11 15
Ver1.3
11
November 22, 2007
SNAP01
Class AB Power Amplifier
7. PACKAGE/PAD LOCATIONS 7.1. SNAP01H (Dice)
PAD Assignment
NO PAD NAME 1 2 3 4 5 VM VIN GND VREF CE X(um) -495.31 Yum) -370.90 NO PAD NAME X(um) 6 7 8 9 10 O+ O+ VDD OOYum) 375.49 234.14 375.49 349.14 -21.41 291.64 -418.31 349.14 -418.31 234.14
- 385.31 -370.90 -21.41 385.31 495.31 -295.15 -370.90 -370.90
CHIP SIZE: X=1124um,Y=960um Note: 1.The VDD pin MUST bonding to VDD in PCB layout. 2.The substrate MUST be connected to GND in PCB layout.
Ver1.3
12
November 22, 2007
SNAP01
Class AB Power Amplifier
7.2. SNAP01PG (DIP Green Package)
8-pin DIP (300mil) Outline Dimensions Pin No. 1 2 3 4 5 6 7 8 Symbol VM VIN GND VREF CE O+ VDD OI/O I I I O I O I O Function Description Signal Input Positive Signal Input Negative Negative Power Supply Voltage Reference Chip Enable, High Active Positive Output Positive Power Supply Negative Output
Ver1.3
13
November 22, 2007
SNAP01
Class AB Power Amplifier
7.3. SNAP01SG (SOP Green Package)
8-pin SOP (150mil) Outline Dimensions Pin No. 1 2 3 4 5 6 7 8 Symbol VM VIN GND VREF CE O+ VDD OI/O I I I O I O I O Function Description Signal Input Positive Signal Input Negative Negative Power Supply Voltage Reference Chip Enable, High Active Positive Output Positive Power Supply Negative Output
Ver1.3
14
November 22, 2007
SNAP01
Class AB Power Amplifier
DISCLAIMER The information appearing in SONiX web pages ("this publication") is believed to be accurate. However, this publication could contain technical inaccuracies or typographical errors. The reader should not assume that this publication is error-free or that it will be suitable for any particular purpose. SONiX makes no warranty, express, statutory implied or by description in this publication or other documents which are referenced by or linked to this publication. In no event shall SONiX be liable for any special, incidental, indirect or consequential damages of any kind, or any damages whatsoever, including, without limitation, those resulting from loss of use, data or profits, whether or not advised of the possibility of damage, and on any theory of liability, arising out of or in connection with the use or performance of this publication or other documents which are referenced by or linked to this publication. This publication was developed for products offered in Taiwan. SONiX may not offer the products discussed in this document in other countries. Information is subject to change without notice. Please contact SONiX or its local representative for information on offerings available. Integrated circuits sold by SONiX are covered by the warranty and patent indemnification provisions stipulated in the terms of sale only. The application circuits illustrated in this document are for reference purposes only. SONIX DISCLAIMS ALL WARRANTIES, INCLUDING THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. SONIX reserves the right to halt production or alter the specifications and prices, and discontinue marketing the Products listed at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal commercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support equipment, are specifically not recommended without additional processing by SONIX for such application.
Ver1.3
15
November 22, 2007

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