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| Combine Type Connector (for SIM Card 8pins, microSDTM Card) SCHG Series Double-deck for SIM Card (8pins) combine type. For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type NEW Features Two-slot, double-deck structure enables two typs cards, the SIM Card (8pins) and microSDTM Card, to be separately inserted. Applications For mobile phones, various personal digital assistants, notebook PCs. Typical Specifications For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module Structure Items Specifications SIM Card 8pins Applicable media microSDTM Card Mounting type Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial Contact resistance Initial Connector contacts Detection switch Surface mounting type Standard mount Manual insertion/removal/Push-push type 25 to 70 500V AC 1minute 1,000M 100m 500m min. max. max. Performance Insertion and removal cycle 5,000cycles SIM Card 8pins 10,000cycles microSDTM Card Product Line Media ejection structure Push-push type Mounting system Standard mount Stand-off mm 0 Packing system Taping Product No. SCHG1B0100 44 Combine Type Connector (for SIM Card 8pins, microSDTM Card) SCHG Series Dimensions Style Unit:mm 6.85 0.8 For SD Memory Card For microSDTM Card No.!4 No.!1 No.!5 No.!2 No.!6 No.!0 No.9 No.!8 No.!7 No.8 No.7 No.6 No.5 No.4 No.3 No.2 No.1 No.!3 (3.5)EJECT TRAVEL (1)OVER TRAVEL (1.4) 9.095 8.995 6.085 5.085 3.095 0.555 9-0.4 16.2 5.195 4.045 2.895 1.745 0.595 microSD CARD (0.1) 0.8 0.77 CONNECTOR CENTER microSD CARD CENTER For SIM Card 8pins For W-SIM C5C6C7 C8 4.245 17.45 16.62 8.8 P=1.1 1.4 For Memory Stick MicroTM For Memory StickTM Combine Type C1C2C3 C4 (7.9) 1.4 9-0.4 CONNECTOR CENTER 3 SIM CARD SIM CARD CENTER C5C6C7 C8 0.5 7 C1C2C3 C4 CONNECTOR TERMINAL No. No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 PIN No. microSD No.1 microSD No.2 microSD No.3 microSD No.4 microSD No.5 microSD No.6 microSD No.7 microSD No.8 PIN ASSIGMENTS CONNECTOR PIN LAYOUT TERMINAL No. DAT 2 No.9 CD/DAT3 No.10 CMD No.11 VDD No.12 CLK No.13 VSS No.14 DAT0 No.15 DAT1 No.16 PIN No. SIM No.C1 SIM No.C2 SIM No.C3 SIM No.C4 SIM No.C5 SIM No.C6 SIM No.C7 SIM No.C8 PIN LAYOUT VCC RST CLK RESERVED GND VPP I/O RESERVED For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module 1 PC board mounting hole dimensions Viewed from the mounting face side 18.045 0.8 16.9 8.8 4.545 P=1.1 1.05 9-0.8 0.52 1.8 3.095 0.555 9-0.8 9.295 8.175 8 6.085 5.085 7.75 6.85 5.195 4.045 2.895 1.745 0.595 1.1 1.8 0.55 2-R 2-R 0.2 Hole Land 0.8 1.5 1.8 7 No pattern area Land area 2-0.4 2-1.1 17.345 0.35 45 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type 240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.) Room temperature Heating time For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module sec. Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50 |
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