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| Multi Control Devices 8-directional Stick Switch (with Center-push Function) RKJXS Series 8-direction center push type switch in 2.3mm low-profile design. Typical Specifications Items Swich ON position Operating force Push operating force Travel Push operation Push strength Rating max. Resistive load Specifications 7 max. 0.8 2.5 0.3 0.5N 1.5N 0.2mm 30N 10mA 5V DC Each direction 500,000cycles 50M min. 50V DC Multi Control Devices Operating life Insulation resistance Voltage proof 50V AC for 1minute Product Line Maximum resolution 8-direction Operating force Direction N 0.8 0.5 Center-push N 2.5 1.5 Minimum order unit pcs. 950 Product No. RKJXS1004001 Taping Specification (Taping Packaging) Reel Size o13 hole o21 Unit:mm Number of packages pcs. 1 reel o370~380 Variable Resistor Type Tape width mm Switch Type 1 case /Japan 1 case /export packing 950 1.6 25.5 3,800 3,800 24 Note Please place purchase orders for taping products per minimum order unit (1 reel or 1 case). Dimensions Style Unit:mm 11.7 2 ON position of terminal P and C 4.45 2.9 2.3 0.8 o1.2 Term.E Term.2 Term.1 Term.P . ax m .3 .1 12 12 5. 95 5. 85 Term.4 C 14 max. 2.8 2 11.7 o1 .2 ho le o0.8 C O .4 0.3 Push switch travel 0. 2 Guide bosses Term.E Term.C Term.3 479 Multi Control Devices List of Varieties Series Items Multi Control Devices Photo RKJXT1F RKJXM Switch type RKJXL RKJXS SKRV SKRH SKRHAA, SKRHAB SKRHAC, SKRHAD Function W D H Number of operating shafts Shaft material Directional resolution Directional operating feeling tactle feelimg Lever return mechanism Center-push switch Encoder Operating temperature range Rating max. Resistive load Dimensions typical value mm Outlined specifica-tions Electrical performance Output voltage Directional resolution Insulation resistance Voltage proof Directional operating force Push operating force Encoder detent torque Terminal strength Pushing direction Operating direction Vibration Operating life without load Operating life with load at rated load Cold Dry heat Damp heat Manual soldering Dip soldering Reflow soldering Page 475 476 478 479 260 5 60 2 - 40 85 2 2 for 500h for 500h 95%RH for 500h 5 1s 3s max. 260 max. 6s max. Please see P.492 480 481 350 10 -40 85 2 2 for 96h for 96h -30 80 2 2 for 96h for 96h 4-direction 8-direction 50M min. 50V DC 50V AC for 1min. 11.7 12.3 2.3 Single-shaft Resin 8-direction With Without With With With - 40 85 Without/With - 30 - 30 80 10mA 5V DC 70 + 5V 5K Measuring terminal 17 10.5 Single-shaft 4-direction 20.5 5.45 Single-shaft/Dual-shaft Metal 13 6.4 6.45 6.4 4 7.35/7.45 7.5 5 4-direction With Without -20 70 -30 50mA 12V DC 85 Measuring circuit 1V max. at 1mA 5V DC Resistive load 4-direction 100M min. 100V DC 100V AC for 1min. 1.23 0.69N 2.35 1.2 0.69N 0.69N 100M min. 250V DC 300V AC for 1min. or 360V AC for 2s Direction A B C D 30 20mN m DirectionAB BC CD DA 25 20mN m 3 12 1.5N 8mN m Variable Resistor Type Switch Type 40 25mN m 10 7mN m 0.8 0.5N 1.2 0.6N 5 15 2N 8mN m 4.5 1N 2.5 1.5N 2.4 0.69N Mechanical performance Endurance Environmental Soldering performance 5N for 1min. 100N 0.4N m 0.3N m 0.15N m 30N 20N 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively Actuatorstrength 8.3 1 to 200 4 to 8.3 1Hz, 4.4G fixed for 15 min./1 cycle ,3 angles each 2 hours , 90 350 ,5 60 3 +1 s 0 2 ,90 95%RH for 96h 350 max. 3s max. 470 Switch Type Multi Control Devices Soldering Conditions Example of Reflow Soldering Condition 1. Heating method: Multi Control Devices Double heating method with infrared heater. CA K or CC T at solder joints copper foil surface . A heat resistive tape should be used to fix thermocouple. 2. Temperature measurement: Thermocouple 0.1 to 0.2 3. Temperature profile 300 Temperature (C ) A max. B 200 D E 100 Time (s) Pre-heating F max. C Room temperature Series Reflow type RKJXS SLLB, SLLB5 Variable Resistor Type Switch Type SKRV/SKRH/SKQUBA,DB/SSAF/SRBE A 3s max. 260 240 260 B Cs 40 D 150 E Fs 230 20 40 180 150 120 Notes 1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. 492 |
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