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SP4T Antenna Switch for CDMA/UMTS CXM3531XR Description The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications. The antenna port can be routed to either of the 4TRx ports. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital base band control lines with the 1.8V CMOS logic levels. The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity. (Applications: CDMA/UMTS handsets) Features Low insertion Loss (Tx): 0.28dB (Typ.) @27dBm (450MHz) 0.30dB (Typ.) @27dBm (Cellular) 0.36dB (Typ.) @27dBm (PCS) 0.38dB (Typ.) @27dBm (IMT2000) 0.45dB (Typ.) @27dBm (2.6GHz) High linearity: IIP3 = 70dBm No DC Blocking Capacitors required on RF ports. Lead-Free and RoHS Compliant Package Small package: 20pin XQFN (2.7mm x 2.7mm x 0.35mm Typ.) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08909-PS CXM3531XR Absolute Maximum Ratings Bias voltage VDD Control voltage Vctl Input power Max. [Ant, RF1, RF2, RF3, RF4] Operating temperature Storage temperature Maximum power dissipation PD *1 4V (Ta = 25C) 4V (Ta = 25C) 32dBm (410 to 2690MHz, Ta = 25C) -35 to +85C -65 to +150C 500mW *1 25mm x 25mm x t:0.8mm Mounted on standard board (FR-4) -2- CXM3531XR Block Diagram Ant F1 F5 RF1 F2 F6 RF2 F3 F7 RF3 F4 F8 RF4 Pin Configuration GND GND GND 7 10 9 8 RF1 6 Ant VDD GND CTLA CTLB GND 11 12 13 14 15 XQFN-20P PKG (2.7mm x 2.7mm x 0.35mm Typ.) 5 4 3 2 1 GND RF3 GND RF4 GND Top View 16 GND 17 GND 18 N/C 19 GND 20 RF2 -3- CXM3531XR Truth Table ON Path ANT - RF1 ANT - RF2 ANT - RF3 ANT - RF4 CTLA L H L H CTLB L L H H F1 ON OFF OFF OFF F2 OFF ON OFF OFF F3 OFF OFF ON OFF F4 OFF OFF OFF ON F5 OFF ON ON ON F6 ON OFF ON ON F7 ON ON OFF ON F8 ON ON ON OFF DC Bias Condition (Ta = 25C) Item Vctl (H) Vctl (L) VDD Min. 1.3 0 2.5 Typ. 1.8 -- 2.8 Max. 3.2 0.3 3.2 V Unit -4- CXM3531XR Electrical Characteristics Electrical Characteristics 1 (Ta = +25C, VDD = 2.8V, Vctl = 0/1.8V) Item Symbol Path *1 *2 Condition Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 30 25 22 21 18 Typ. 0.28 0.30 0.36 0.38 0.45 0.28 0.30 0.36 0.38 0.46 0.25 0.27 0.33 0.35 0.42 0.25 0.27 0.33 0.35 0.42 41 36 27 26 23 Max. 0.43 0.45 0.51 0.53 0.60 0.43 0.45 0.51 0.53 0.61 0.40 0.42 0.48 0.50 0.57 0.40 0.42 0.48 0.50 0.57 -- -- -- -- -- Unit ANT-RF1 *3 *4 *5 *1 *2 ANT-RF2 *3 *4 *5 Insertion Loss IL *1 *2 dB ANT-RF3 *3 *4 *5 *1 *2 ANT-RF4 *3 *4 *5 *1 *2 Isolation ISO. ANT-RF1, 2, 3, 4 *3 *4 *5 dB Electrical Characteristics are measured with all RF ports terminated in 50. *1 *2 *3 *4 *5 freq = 410 to 495MHz freq = 698 to 960MHz freq = 1710 to 1990MHz freq = 2110 to 2170MHz freq = 2500 to 2690MHz -5- CXM3531XR Electrical Characteristics 2 (Ta = +25C, VDD = 2.8V, Vctl = 0/1.8V) Item VSWR Symbol VSWR 2fo 3fo 2fo 3fo Harmonics 2fo 3fo 2fo 3fo 2fo 3fo P0.2dB compression input power Inter modulation product power in Rx band P0.2dB IMD2 IMD3 ANT-RF1, 2, 3, 4 *1, *2, *3, *4, *5 *6-*9, *17 *5 *2 Path Condition 410 to 2170MHz 2500 to 2690MHz *1 Min. -- -- -- -- -- -- -- -- -- -- -- -- 31 -- -- 65 65 65 -- -- -- Typ. 1.1 1.3 -68 -68 -66 -66 -66 -63 -66 -63 -62 -59 -- -110 -110 70 70 70 0.005 0.2 2 Max. 1.4 1.7 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -- -105 -105 -- -- -- 10 0.4 5 Unit -- ANT-RF1, 2, 3, 4 *3 dBm *4 dBm ANT-RF1, 2, 3, 4 *10-*13, *17 *14, *17 dBm Input IP3 Control current Supply current Switching speed IIP3 Ictl IDD Swt ANT-RF1, 2, 3, 4 *15, *17 *16, *17 dBm A mA s Vctl = 1.8V VDD = 2.8V RF1, 2, 3, 4 50% Ctl to 90% RF Electrical Characteristics are measured with all RF ports terminated in 50. *1 *2 *3 *4 *5 *6 *7 *8 *9 *10 *11 *12 *13 *14 *15 *16 *17 Pin = 27dBm, freq = 410 to 484MHz Pin = 27dBm, freq = 698 to 915MHz Pin = 27dBm, freq = 1710 to 1910MHz Pin = 27dBm, freq = 1920 to 1980MHz Pin = 27dBm, freq = 2500 to 2570MHz Pin on RF: 20dBm, 1950MHz, Pin on ANT: -15dBm, 190MHz Pin on RF: 20dBm, 1745MHz, Pin on ANT: -15dBm, 95MHz Pin on RF: 20dBm, 1880MHz, Pin on ANT: -15dBm, 80MHz Pin on RF: 20dBm, 835MHz, Pin on ANT: -15dBm, 45MHz Pin on RF: 20dBm, 1950MHz, Pin on ANT: -15dBm, 1760MHz Pin on RF: 20dBm, 1745MHz, Pin on ANT: -15dBm, 1650MHz Pin on RF: 20dBm, 1880MHz, Pin on ANT: -15dBm, 1800MHz Pin on RF: 20dBm, 835MHz, Pin on ANT: -15dBm, 790MHz Pin = 27 + 27dBm, 450 + 451MHz, IIP3 = (3 x Pout - IM3) / 2 + Loss Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 x Pout - IM3) / 2 + Loss Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 x Pout - IM3) / 2 + Loss Measured with the recommended circuit -6- CXM3531XR Electrical Characteristics 3 (Ta = +25C, VDD = 2.8V, Vctl = 0/1.8V) Item Symbol Path PTx at RF* Pin [dBm] TBR ANTRF1, RF2, RF3, RF4 21.5 21.5 13.5 835.5 1880 1732 836.5 1881 1733 PTx1 [MHz] PTx2 [MHz] Condition Jammer at Ant -30dBm [MHz] 881.5 1960 2132 Triple beat product at RF* [MHz] 881.5 1 1960 1 2132 1 81 81 81 -- -- -- -- -- -- dBc Min. Typ. Max. Unit Triple beat ratio Electrical Characteristics are measured with all RF ports terminated in 50. Measured with the recommended circuit Electrical Characteristics 4 (Ta = +25C, VDD = 2.8V, Vctl = 0/1.8V) Item Symbol Path PTx at RF* 24dBm [MHz] 836.61 Input IP2 IIP2 836.61 AntRF1, RF2, RF3, RF4 1885 1885 1732.5 1732.5 Condition Jammer at ANT -20dBm [MHz] 1718.61 45 3850 80 3865 400 IM2 product at RF* [MHz] 881.61 881.61 1965 1965 2132.5 2132.5 113.5 95.5 95.5 95.5 95.5 95.5 -- -- -- -- -- -- -- -- -- -- -- -- dBm Min. Typ. Max. Unit Electrical Characteristics are measured with all RF ports terminated in 50. Measured with the recommended circuit -7- CXM3531XR Recommended Circuit L1 C1 GND GND GND 7 10 VDD GND CTLA CTLB GND 9 8 RF1 6 GND RF3 GND RF4 GND Ant 11 12 13 14 15 XQFN-20P PKG (2.7mm x 2.7mm x 0.35mm Typ.) 5 4 3 2 1 Top View 16 GND 17 GND 18 N/C 19 GND 20 RF2 Note) 1. No DC blocking capacitors are required on all RF ports. 2. DC levels of all RF ports are GND. 3. L1 (27nH) and C1 (12pF) are recommended on Ant port for ESD protection. -8- CXM3531XR PCB Layout Template XQFN-20P-01 Macro (Reference) PKG size: 2.7mm x t0.35mm Terminal pitch: 0.4mm Terminal length: 0.4mm Mask thickness: 0.11mm : Land area : Mask open area (Solder printing area) : Board resist open area : Metal area in board (*1) *1 This metal is for heat loss reduction in package and recommend to connect to GND. 3.1 2.7 (PKG Line) 1.3 (1) 0.3 0.05 0.2 R0.05 Land line [Detail A] 2.7 (PKG Line) R0.3 0.6 0.4 1.3 (1) Resist line 1 0. 3.1 Solder printing area 0.1 0.15 0.4 0.21 0.26 R0.05: Mask corner A -9- 0. 2 CXM3531XR Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m - 10 - Sony Corporation |
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